KR20020090934A - Organic material point source feeding unit in organic semiconductor device and method thereof - Google Patents

Organic material point source feeding unit in organic semiconductor device and method thereof Download PDF

Info

Publication number
KR20020090934A
KR20020090934A KR1020020050922A KR20020050922A KR20020090934A KR 20020090934 A KR20020090934 A KR 20020090934A KR 1020020050922 A KR1020020050922 A KR 1020020050922A KR 20020050922 A KR20020050922 A KR 20020050922A KR 20020090934 A KR20020090934 A KR 20020090934A
Authority
KR
South Korea
Prior art keywords
organic material
organic
semiconductor device
moving
evaporation source
Prior art date
Application number
KR1020020050922A
Other languages
Korean (ko)
Other versions
KR100397196B1 (en
Inventor
김동수
배경빈
Original Assignee
에이엔 에스 주식회사
김동수
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이엔 에스 주식회사, 김동수 filed Critical 에이엔 에스 주식회사
Priority to KR20020050922A priority Critical patent/KR100397196B1/en
Publication of KR20020090934A publication Critical patent/KR20020090934A/en
Application granted granted Critical
Publication of KR100397196B1 publication Critical patent/KR100397196B1/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0002Deposition of organic semiconductor materials on a substrate
    • H01L51/0008Deposition of organic semiconductor materials on a substrate using physical deposition, e.g. sublimation, sputtering
    • H01L51/001Vacuum deposition

Abstract

PURPOSE: An organic material deposition source of an organic semiconductor apparatus and an operating method thereof are provided to prevent the nonuniform diffusion of gas by directing an organic material heating unit to an organic material moving unit to maintain the low pressure of the gas at a proper flow speed. CONSTITUTION: An organic material heating unit(10) heats an organic material to evaporate it. An organic material storing unit(30) has an organic material furnace(25) for loading the organic material in order to uniform an internal organic material. An organic material moving unit(50) moves the organic material of the organic material furnace(25) to a first position. When the temperature within a diffusion pot is uniform, the organic material moving unit(50) moves the organic material furnace(25) to a second position required to the deposition of the organic material and performs an organic material deposition process.

Description

유기 반도체 장치의 유기물질 증착원 장치 및 그 방법{ORGANIC MATERIAL POINT SOURCE FEEDING UNIT IN ORGANIC SEMICONDUCTOR DEVICE AND METHOD THEREOF} Organic material evaporation source apparatus and method of the organic semiconductor device {ORGANIC MATERIAL POINT SOURCE FEEDING UNIT IN ORGANIC SEMICONDUCTOR DEVICE AND METHOD THEREOF}

본 발명은 유기 반도체 장치의 유기물질 증착원 장치 및 그 방법에 관한 것으로, 더욱 상세하게는 유기물질 증착원 장치에서 그 증착 장치의 유기물질 보관부 내부에서 축적된 유기물질이 확산로의 열원에 의해 직접 영향을 받지 않고 그 유기물질이 소비하는 소비량에 따라 증기를 형성하여 이동하도록 함으로써 유기물질의 증착시 대용량으로 사용가능한 유기 반도체 장치의 유기물질 증착원 장치 및 그 방법에 관한 것이다. The present invention by a heat source of an organic material evaporation source apparatus and relates to a method, and more particularly, to the diffusion of organic matter accumulated in the organic material storage section of the deposition apparatus in the organic material evaporation source device of an organic semiconductor device, directly without being affected by the organic material is an organic material deposition of the organic semiconductor device capable of use as a large capacity at the time of vapor deposition of the organic material by moving to form a vapor source apparatus according to the consumption of consumption and to a method.

일반적으로, 유기 반도체 소자의 제조중 유기물질의 증착공정은 유기물질에 열을 가하여 그 물질을 기화시키는 공정을 이용한다. In general, the deposition process of organic material during the production of the organic semiconductor device is used in a process for gasifying the material by heating the organic material. 이 증착공정이 진행되는 과정에서 소정량의 유기물질을 사용하고, 사용에 의해 소비된 물질량 만큼 계속하여 보충하여 공급하면서 공정을 진행하기 위해서는, 유기물질이 일정하게 반응로에 공급되어야 하는 단점이 있다. In order for the deposition process proceeds to step while using the organic material of the given amount in the course of progression, and continues to supplement the supply by the amount of substance consumed by use, there is a disadvantage that the organic material to be supplied to the reaction constant . 현재까지는 유기물질의 재공급을 위한 장치를 설비하는 것을 고려하고 있지 않다. Until now not considered to plant a device for re-supply of the organic material.

이와같은 단점을 고려하여 최근에는 유기물질을 담을 수 있는 도가니와, 상기 도가니내 유기물질을 가열하여 기화시키는 저항성 열원과 이 열원을 제어하기 위한 온도 센서를 구성한 증착설비가 제안되고 있다. Considering these disadvantages it has recently been proposed that the crucible to hold the organic material deposition equipment configured with a temperature sensor for controlling the resistance to the heat source and a heat source for vaporizing the organic material is heated to the furnace.

이와 같이 구성된 유기물질 공정 설비에 의하여 증착공정을 진행할 때에는 먼저, 증착로 내부의 분위기를 진공으로 형성하여야 하기 때문에 배기장치에 의하여 증착로 내부에 진공압을 형성하고, 전기 가열장치에 의하여 증착원 내부의 온도를 셋팅한 상태에서 온도가 안정되도록 공정 환경이 설정되고, 도가니 내부의 유기물질이 일정한 증착속도를 유지하면서 기화된다. Thus when proceed with the deposition process by the organic material processing equipment is configured, first, the deposition by the inside atmosphere of a deposited because be formed in a vacuum to form a vacuum pressure inside a deposition by the exhaust device, an electric heating device circle inside the temperature of the temperature at a set state and a step configuration so that the stability, the organic material inside the crucible is vaporized while maintaining a constant deposition rate.

이후, 유기물질 증착공정이 연속적으로 진행되어 도가니 내부에 축적된 유기물질이 전부 소비되면 후속하는 유기물질공급 공정이 수행되어야 한다. Then, the organic material deposition process successively proceeds to the subsequent organic material to be supplied to the process performed when the organic material is consumed all accumulated in the crucible. 공급 공정이 진행할 때 증착에 의해 유기물질 소비되므로, 재충전하여 사용할 수밖에 없다. Since consumption of organic material by evaporation when the supplying step to proceed, it can only be used to recharge. 다시 말해 기존의 유기물질 증착 설비에 의하여 증착공정을 계속해서 진행할 때에는, 공정의 재시작을 위한 공정 또는 비용상의 손실이 크게 발생됨에도 불구하고 그 공정작업이 중단되어야 한다. In other words, although the time should continue to proceed with the deposition process by the deposition of an existing plant organic matter, largely lost in the process or cost for the restart of the process occurs and stop its process operations.

더욱이, 유기물질의 증착공정에 있어 작업중단은 처리 챔버 내부에 수분이나 산소등 이물질이 부착될 수 있고, 다른 증착 장치 내의 유기물질을 오염시키는 문제점이 있었다. Further, in the deposition process of organic material disruption may be a foreign matter such as moisture or oxygen attached to the inside of the process chamber, there is a problem of contamination of the organic material in the other vapor deposition device.

따라서, 본 발명은 이와 같은 종래의 문제점을 감안하여 안출된 것으로써, 본 발명의 목적은 유기물질 증착공정을 진행할 때 유기물질 보관부에 다량의 유기물질을 담아두고 저항성 열원에 의해 도가니 내부를 가열하여 기화시키고, 다시 유기물질 보관내에 담겨있는 유기물질을 도가니 상측부가지 이동시키는 운송장치를 포함하는 유기 반도체 장치의 유기물질 증착원 장치 및 그 방법을 제공함에 있다. Accordingly, the present invention this write as been made in view of the conventional problems, with capture the large amount of organic material in the organic material storage section when the object of the present invention to proceed with the organic material deposition process, heat the inner crucible by resistive ten won and it vaporizes, and the source device again organic material deposition of the organic semiconductor device comprising a transport device for moving the upper portion of the crucible the organic material contained in the organic material storage and a method to provide.

도 1은 본 발명에 의한 유기 반도체 장치의 유기물질 증착원 장치를 도시한 단면도. Figure 1 is a cross-sectional view showing the organic material evaporation source device of an organic semiconductor device according to the present invention.

도 2는 본 발명에 의한 균일한 성장밀도를 유지하기 위한 유기물질 증착원 공급 밀도를 도시한 그래프. Figure 2 is a graph showing an organic material evaporation source supply density to maintain a uniform density growth according to the present invention.

********** 도면의 주요 부분에 대한 부호 설명 ********** Reference Numerals in the figure description ********** **********

10 : 유기물질 가열부 10: organics heating element

20 : 수직형 확산로 20: a vertical-type diffusion

25 : 유기물질 도가니 25: organics crucible

30 : 유기물질 보관부 30: organic material storage section

40 : 연결지지부 40: Connection support

50 : 유기물질 이동부 50: organic matter moving part

52 : 모터 52: Motor

이와 같은 본 발명의 목적을 달성하기 위한 유기 반도체 장치의 유기물질 증착원 장치에 의하면, 수직형 확산로를 구비한 유기 반도체 장치의 유기물질 증착원 장치에 있어서, 유기물질을 기화시키는 저항성 열원으로 가열하는 가열부와; This, according to the evaporation source device organic material of the organic semiconductor device for achieving the object of the present invention, in the organic material evaporation source device of an organic semiconductor device provided with a a vertical-type diffusion, heat the resistive ten won for gasifying organic materials heating unit and; 상기 가열부와 상기 유기물질이 분리되고 내부의 유기물질을 균일하게 하기 위해 유기물질을 적재한 유기물질 도가니를 갖는 유기물질 보관부와; The heating element and the organic material separated and the organic material with an organic material crucible loaded with organic materials in order to make uniform the organic material within the storage unit; 상기 유기물질 도가니의 유기물질을 제 1 위치로 이동시키고, 상기 수직형 확산로 내부의 온도가 균일하게 형성되었을 때, 상기 유기물질 도가니를 유기물질 증착에 필요한 제 2 위치로 이동시킨 후, 유기물질 증착공정을 수행하는 유기물질 이동부를 포함한다. After moving the organic material of the organic material crucible at a first location and, when the temperature in the uniformly formed in the vertical type diffusion, moving the organic material crucible to the second position required for the organic material deposited, the organic material includes parts of organic matter moved to perform a deposition process.

또한, 유기 반도체 장치의 유기물질 증착원 증착 방법에 의하면, 수직형 확산로 내부로 소스 유기물질을 적재한 유기물질을 소정 방향으로 이동시키는 유기 반도체 장치의 유기물질 증착원 증착 방법에 있어서, Further, according to the organic material evaporation source deposition method of the organic semiconductor device to move the organic material source loaded with organic material to the inside a vertical-type diffusion in a given direction in an organic material evaporation source deposition method of an organic semiconductor device,

유기물질 증착율을 균일하게 유지하기 위해 유기물질 보관부에 유기물질을 탑재한 후, 상기 수직형 확산로 내부의 온도를 균일하게 형성하고, 상기 유기물질을 유기물질 이동부에 의하여 제 1 위치로 이동시키는 단계와; Then with the organic material in the organic material storage section to uniformly maintain the organic material deposition rate, and uniformly forming the internal temperature of the above vertical-type diffusion, moving the organic material to a first position by the moving organic matter portion and the step of;

상기 수직형 확산로 내부의 온도가 균일하게 형성되었을 때, 상기 유기물질을 유기물질 증착율을 계속 유지하도록 상기 유기물질 이동부의 상기 유기물질을 제 2 위치로 이동시킨 후, 유기물질 증착 공정을 수행하는 단계를 포함한다. With the inside to the vertical type diffusion temperature it is uniformly formed, and then the organic matter to move the organic material transfer of said organic material to a second position so as to keep the organic material deposition rate, performing the organic material deposition process and a step.

이하, 본 발명의 유기 반도체 장치의 유기물질 증착원 장치 및 그 방법을 첨부된 도면을 참조하여 설명하면 다음과 같다. Hereinafter, it will be described with reference to the accompanying drawings, an organic material evaporation source apparatus and method of the organic semiconductor device of the present invention.

도 1은 본 발명에 의한 유기 반도체 장치의 유기물질 증착원 장치를 도시한 도면이다. 1 is a view showing an organic material evaporation source device of an organic semiconductor device according to the present invention.

본 발명에 의한 유기 반도체 장치의 유기물질 증착원 장치의 구성 요소를 보다 상세하게 설명하면 다음과 같다. In more detail the components of the organic material evaporation source device of an organic semiconductor device according to the present invention.

수직형 확산로(20)는 그 상면이 개구되어 있는 형상이다. A vertical-type diffusion 20 is a shape that is the upper surface of the opening. 이와 같이 구성된 수직형 확산로(20)의 최상부측 개구에는 유기물질 가열부(10)로부터의 열원이 일정 방향으로 전달되도록 저항성 열원용으로서 핫 필라민트(12)와, 이 핫 필라민트(12)의 가열 효율을 높이기 위해 열적 리플렉터(14)가 형성되어 있다. Thus configured vertical diffusion to the top-side opening has a hot filament 12, as for the resistance heat source heat source from the organic material heating portion 10 to be transferred in a predetermined direction (20), a hot-filament 12 a thermal reflector 14 is formed of a heating efficiency to increase. 이 핫 필라민트(12)는 Ta, W, Mo 금속 또는 이것들의 합금선으로 구성된다. The hot filament 12 is composed of Ta, W, Mo metals or alloys of these lines. 또 그 핫 필라민트(12)의 절연체로서는 석영, 세라믹 등으로 구성될 수 있다. Also as the insulation of the hot-filament 12 it can be composed of quartz, ceramic or the like.

또한, 수직형 확산로(20)에는 유기물질 확산공정을 진행하기 위하여 수직형 확산로(20) 내부를 초진공압으로 형성한다. Further, the vertical-type diffusion 20 is formed inside the vertical type diffusion 20 to the first medical examination pneumatic else to do the organic substances diffusion process. 물론, 이 확산로(20)에는 일정 진공압(약 10 -3 torr 내지 10 -7 torr)을 형성시키는 진공펌프(미도시)가 연결되어 있어야 한다. Of course, this must be spread to 20 is provided with a vacuum pump (not shown) for forming a predetermined vacuum pressure (about 10 -3 torr to 10 -7 torr) connection.

이와 같이 수직형 확산로(20)의 내부에는 유기물질 보관부(30)가 지지부(40)를 통해 지지되고, 유기물질 이동부(50)에 의해 로딩/언로딩되어 유기물질이 가열부(10)를 향하여 이동된다. In this way is supported inside of the vertical type diffusion 20, the organic material storage section 30 through the support portion 40, the loading / unloading with the organic mass transfer unit 50, part of the organic material is heated (10 ) it is moved towards the. 유기물질 지지부(40)는 지지핀 등으로 구성된다. Organic material support portion 40 is composed of a support pin or the like.

유기물질 이동부(50)는 유기물질이 다량 적재되어있는 유기물질 도가니(25)상에서 로딩/언로딩되기 위해서는 유기물질이 안착됨과 동시에 이 유기물질을 상승 또는 하강 이동시키는 피스톤 형태로 된다. Organic material moving unit 50 in order to be loaded / unloaded in an organic material crucible (25) with a large amount of organic material is stacked soon as the organic material is mounted at the same time the organic material in the form of a piston which moves raised and lowered. 유기물질 이동부(50)는 정밀한 모터 등의 엘리베이터 구동부(미도시)에 의하여 작동된다. Organic material moving unit 50 is operated by the lift drive unit (not shown) such as a precision motor.

또한, 유기물질 보관부(30)는 상기 유기물질 가열부(10)와 도시 안된 지지핀 등으로 연결되고, 유기물질 보관부(30)만이 별도로 분리될 수 있다. In addition, the organic material storage section 30 is connected to the support pin, etc. not shown, and the organic material heating portion 10, and only the organic material storage section 30, can be isolated separately.

한편, 이와 같이 유기물질 이동부(50)는 전체적으로 보아 유기물질 이동부(50)의 아래 부분에 안착한 상태에서 동력전달밸트등에 의해 동력을 전달하는 모터(52) 및 모터(52)의 이동속도를 제어하기 위하여 제어모듈(미도시)과 연결되어 있다. On the other hand, and thus the movement speed of the organic material transfer unit 50 includes a motor 52 and a motor 52 as a whole when viewed transmitting the power by the power transmission belt in anchakhan the lower part of the organic mass transfer unit 50, the state It is connected to the control module (not shown) to control.

본 발명에 의한 유기 반도체 장치의 유기물질 증착원 장치는 우선 증착원 물질로서 유기물질 보관부(30)에 유기물질을 채우고, 상기 유기물질 가열부(10)를 가열하면 이동부(50)이 이동에 따라 유기물질이 상승하여 확산하는 일정한 속도를 갖는다. Organic material evaporation source device of an organic semiconductor device according to the present invention, first as an evaporation source material filling the organic material in the organic material storage section 30, and the by heating the organic material heating unit 10, the moving part 50 is moved according to have a constant rate of diffusion to the organic material increases. 여기서 상기 확산량의 유기물질이 도시안된 센서에 의해 감지되고 소비된 확산량에 대응하여 이하에서 설명되듯이 일정한 속도로 유기물질 이동부(50)가 상승운동을 한다. Wherein the organic material of the diffusion amount and the rising movement of organic matter moving section 50 at a constant rate as represented below in response to the amount of proliferation detected and consumed by a sensor not shown. 여기서 유기물질 가열부(10)는 기존의 소용량 유기물 열원대신에 대용량 열원으로 사용가능하다. The heating section 10 is an organic material can be used as a large-capacity heat source in place of the conventional organic small capacity heat source.

도 2는 이와 같은 본 발명 유기물질 증착원 장치에 의하여 균일한 밀도를 갖는 유기물질을 공급하기 위한 방법을 도시한 그래프이다. Figure 2 is a graph illustrating the present invention, this method for supplying the organic matter having a uniform density by the organic material evaporation source device, such as. 도 2에서 부호 (a)의 그래프는 수직형 확산로(20) 내부의 유기물질이 소비되는 소비량을 공정 시간에 따라서 도시하고 있고, 부호 (b)의 그래프는 공정 시간에 따른 유기물질의 균일성이 균일하도록 상승 및 하강하는 유기물질 이동부(50)의 이동속도를 도시하고 있다. The graph in the vertical diffusion of the code (a) in FIG 20, and shows therefore the consumption which the consumption of organic material inside the processing time, the uniformity of the organic material graph according to the processing time of the code (b) this is even shown the moving speed of the rising and organic material moving part 50, which fall to. 또한, 부호 (c)의 그래프의 S 선은 공정을 진행하기 위한 표준 공정 온도를 나타낸다. In addition, S line on the graph of the code (c) shows a standard process temperature for the processing of the process.

먼저, 도 2에 있어서 유기물질 공정을 진행하기 위해서는 선행공정을 종료한 유기물질을 유기물질 보관부(30)에 적재하여야 함으로, 유기물질 이동부(50)에 의해 유기물질 보관부(30)를 하방으로 내려 탑재할 준비를 수행한다. First, by an organic material, exit the preceding step to advance the organic matter the process according to Figure 2 be loaded in the organic material storage section 30, a storage unit 30, the organic material by moving the organic material part 50 perform ready to be mounted lower down.

이때, (a) 그래프의 구간 0 - t 을 살펴보면 다음과 같다. At this time, (a) a graph of the interval 0 - Looking at t as follows:

유기물질 보관부(50)가 하방으로 내려가 수직형 확산로 내부가 외부에 대하여 개방된 상태가 되면 수직형 확산로(20) 내부의 온도는 급격하게 하강하였다가 유기물질 이동부(30)가 탑재된 상태에서 유기물질 보관부(50)가 상승함에 따라서 같이 상승하게 된다. When the organic material storage section 50 down to the lower side is the interior is opened with respect to the external state to a vertical diffusion to vertical diffusion 20, the temperature inside was abruptly lowered with a moving organic material part 30 So as to rise as the organic material storage part 50 increases in the state.

이때, (b) 그래프의 구간은 0 - t 구간으로 유기물질 이동부(30)가 상승 이동하고 있음으로써 수직형 확산로(20)내부에는 균일한 온도 분포가 형성될 수 있다. At this time, (b) region of the graph is 0 to inside the vertical type diffusion by that the organic mass transfer unit 30 moves the rising period t 20 may be formed with a uniform temperature distribution.

다음으로 그래프의 t - t'구간은 공정을 계속 진행하기 위하여 미리 결정된 제어 모듈(미도시)에 의하여 이후, 온도 안정이 이루어지고, 유기물질 이동부(30)가 이동하게 되면, 제어 모듈은 모터(52)를 제어하여 유기물질 이동부(30) 이동속도를 실제 공정에 적합하게 유지하게 된다. Next t of the graph - when later by the predetermined control module (not shown) to t 'intervals to continue the process, the temperature stability is made, to move the organic material part 30 moves, the control module is a motor It controls 52 are adapted to keep the organic matter moving part 30, the moving speed in the actual process.

본 발명이 바람직한 실시예를 참조하여 특별히 도시되고 기술되었지만, 본발명 분야의 당업자는 본 발명 사상과 범위를 벗어남이 없이 다양한 변경이 가능하다는 것을 이해할 수 있을 것이다. Although the invention has been particularly shown and described with reference to particular embodiments, those of skill in the art will appreciate that various changes without departing from the spirit and scope of this invention. 따라서, 본 발명은 특허청구범위에 의해서만 제한된다. Accordingly, the invention is limited only by the claims.

이상에서 상세하게 설명한 바와 같이 본 발명에 따른 유기 반도체 장치의 유기물질 증착원 장치는 그 증착원 장치의 유기물질 이동부가 유기물질 가열부를 향하여 적정 속도로 이동하면서 유기물질 증착공정에 필요한 저압을 유지시켜 가스의 불균일한 확산이 발생하는 것을 방지하는 효과가 있다. Organic material evaporation source device of an organic semiconductor device according to the invention as specifically described above it is toward the organic mass transfer of that vapor source apparatus with parts of heating the organic material by moving in an appropriate speed to maintain the low pressure necessary for the organic material deposition process this has the effect of preventing the non-uniform diffusion of the gas occurs. 그리고 유기물질 증착 공전 진행과정에서 대용량의 유기물질 보관부를 채용함으로써 대량생산이 가능하므로 경제성면에서도 그 코스트를 절약할 수 있다. And by employing a large part of the organic material stored in the organic material deposited goes idle process for mass production, so you can save the cost in the economic plane.

Claims (4)

  1. 수직형 확산로를 구비한 유기 반도체 장치의 유기물질 증착원 장치에 있어서, 유기물질을 기화시키는 저항성 열원으로 가열하는 가열부와; In an organic material evaporation source device of an organic semiconductor device provided with a vertical-type diffusion, and a heating unit for heating a resistance ten won for gasifying organic material;
    상기 가열부와 상기 유기물질이 분리되고 내부의 유기물질을 균일하게 하기 위해 유기물질을 적재한 유기물질 도가니를 갖는 유기물질 보관부와; The heating element and the organic material separated and the organic material with an organic material crucible loaded with organic materials in order to make uniform the organic material within the storage unit;
    상기 유기물질 도가니의 유기물질을 제 1 위치로 이동시키고, 상기 수직형 확산로 내부의 온도가 균일하게 형성되었을 때, 상기 유기물질 도가니를 유기물질 증착에 필요한 제 2 위치로 이동시킨 후, 유기물질 증착공정을 수행하는 유기물질 이동부를 포함하는 것을 특징으로 하는 유기 반도체 장치의 유기물질 증착원 장치. After moving the organic material of the organic material crucible at a first location and, when the temperature in the uniformly formed in the vertical type diffusion, moving the organic material crucible to the second position required for the organic material deposited, the organic material organic material evaporation source device of an organic semiconductor device characterized in that it comprises an organic material moving to perform the deposition process.
  2. 제 1항에 있어서, According to claim 1,
    상기 유기물질 보관부는 상기 유기물질 가열부와 연결된 지지핀이 별도로 분리가능한 것을 특징으로 하는 유기 반도체 장치의 유기물질 증착원 장치. The organic material storage section organic material evaporation source device of an organic semiconductor device, characterized in that the support pin is additionally possible separation that is associated with the organic material heating unit.
  3. 제 1항에 있어서, According to claim 1,
    상기 유기물질 상승부는 동력을 전달하는 모터 및 상기 모터의 이동속도를 제어하기 위하여 연결되어 있는 제어모듈을 포함하는 것을 특징으로 하는 유기 반도체 장치의 유기물질 증착원 장치. Organic material evaporation source device of an organic semiconductor device comprises a control module connected to the organic material rising portion to control the motor and the moving speed of said motor for transmitting power.
  4. 유기 반도체 장치의 유기물질 증착원 증착 방법에 의하면, 수직형 확산로 내부로 소스 유기물질을 적재한 유기물질을 소정 방향으로 이동시키는 유기 반도체 장치의 유기물질 증착원 증착 방법에 있어서, According to the organic material evaporation source deposition method of an organic semiconductor device, the organic material evaporation source deposition method of the organic semiconductor device to move the organic material source loaded with organic material to the inside a vertical-type diffusion in a predetermined direction,
    유기물질 증착율을 균일하게 유지하기 위해 유기물질 보관부에 유기물질을 탑재한 후, 상기 수직형 확산로 내부의 온도를 균일하게 형성하고, 상기 유기물질을 유기물질 이동부에 의하여 제 1 위치로 이동시키는 단계와; Then with the organic material in the organic material storage section to uniformly maintain the organic material deposition rate, and uniformly forming the internal temperature of the above vertical-type diffusion, moving the organic material to a first position by the moving organic matter portion and the step of;
    상기 수직형 확산로 내부의 온도가 균일하게 형성되었을 때, 상기 유기물질을 유기물질 증착율을 계속 유지하도록 상기 유기물질 이동부의 상기 유기물질을 제 2 위치로 이동시킨 후, 유기물질 증착 공정을 수행하는 단계를 포함하는 것을 특징으로 한 유기 반도체 장치의 유기물질 증착원 공급 방법. With the inside to the vertical type diffusion temperature it is uniformly formed, and then the organic matter to move the organic material transfer of said organic material to a second position so as to keep the organic material deposition rate, performing the organic material deposition process organic material evaporation source supply method of the organic semiconductor device characterized in that it comprises the steps:
KR20020050922A 2002-08-27 2002-08-27 Organic material point source feeding unit in organic semiconductor device and method thereof KR100397196B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20020050922A KR100397196B1 (en) 2002-08-27 2002-08-27 Organic material point source feeding unit in organic semiconductor device and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20020050922A KR100397196B1 (en) 2002-08-27 2002-08-27 Organic material point source feeding unit in organic semiconductor device and method thereof

Publications (2)

Publication Number Publication Date
KR20020090934A true KR20020090934A (en) 2002-12-05
KR100397196B1 KR100397196B1 (en) 2003-09-13

Family

ID=27727982

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20020050922A KR100397196B1 (en) 2002-08-27 2002-08-27 Organic material point source feeding unit in organic semiconductor device and method thereof

Country Status (1)

Country Link
KR (1) KR100397196B1 (en)

Cited By (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102216488A (en) * 2008-11-17 2011-10-12 韩商Snu精密股份有限公司 Deposition material supply apparatus and substrate treatment apparatus having the same
US8137466B2 (en) 2009-08-24 2012-03-20 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
KR101146997B1 (en) * 2010-07-12 2012-05-23 삼성모바일디스플레이주식회사 A tension apparatus for patterning slit sheet
CN102732843A (en) * 2011-04-13 2012-10-17 韩商Snu精密股份有限公司 High-capacity deposition device for forming a thin film
CN102732841A (en) * 2011-04-13 2012-10-17 韩商Snu精密股份有限公司 Device for supplying materials
US8486737B2 (en) 2009-08-25 2013-07-16 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8536057B2 (en) 2009-06-25 2013-09-17 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light emitting device by using the same
US8709161B2 (en) 2009-08-05 2014-04-29 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8802200B2 (en) 2009-06-09 2014-08-12 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US8833294B2 (en) 2010-07-30 2014-09-16 Samsung Display Co., Ltd. Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same
US8846547B2 (en) 2010-09-16 2014-09-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the thin film deposition apparatus, and organic light-emitting display device manufactured by using the method
US8852687B2 (en) 2010-12-13 2014-10-07 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8859043B2 (en) 2011-05-25 2014-10-14 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8859325B2 (en) 2010-01-14 2014-10-14 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8865252B2 (en) 2010-04-06 2014-10-21 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8871542B2 (en) 2010-10-22 2014-10-28 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus manufactured by using the method
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882921B2 (en) 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882556B2 (en) 2010-02-01 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8882920B2 (en) 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882922B2 (en) 2010-11-01 2014-11-11 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8907326B2 (en) 2009-06-24 2014-12-09 Samsung Display Co., Ltd. Organic light-emitting display device and thin film deposition apparatus for manufacturing the same
US8906731B2 (en) 2011-05-27 2014-12-09 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8916237B2 (en) 2009-05-22 2014-12-23 Samsung Display Co., Ltd. Thin film deposition apparatus and method of depositing thin film
US8921831B2 (en) 2009-08-24 2014-12-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8945979B2 (en) 2012-11-09 2015-02-03 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus by using the same, and organic light-emitting display apparatus manufactured by the method
US8945974B2 (en) 2012-09-20 2015-02-03 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display device using an organic layer deposition apparatus
US8951349B2 (en) 2009-11-20 2015-02-10 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8951610B2 (en) 2011-07-04 2015-02-10 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8956697B2 (en) 2012-07-10 2015-02-17 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus and organic light-emitting display apparatus manufactured by using the method
US8962360B2 (en) 2013-06-17 2015-02-24 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the organic layer deposition apparatus
US8968829B2 (en) 2009-08-25 2015-03-03 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8973525B2 (en) 2010-03-11 2015-03-10 Samsung Display Co., Ltd. Thin film deposition apparatus
US8993360B2 (en) 2013-03-29 2015-03-31 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus
US9012258B2 (en) 2012-09-24 2015-04-21 Samsung Display Co., Ltd. Method of manufacturing an organic light-emitting display apparatus using at least two deposition units
US9018647B2 (en) 2010-09-16 2015-04-28 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9040330B2 (en) 2013-04-18 2015-05-26 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus
US9051636B2 (en) 2011-12-16 2015-06-09 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus
US9121095B2 (en) 2009-05-22 2015-09-01 Samsung Display Co., Ltd. Thin film deposition apparatus
US9136476B2 (en) 2013-03-20 2015-09-15 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by the method
US9150952B2 (en) 2011-07-19 2015-10-06 Samsung Display Co., Ltd. Deposition source and deposition apparatus including the same
US9174250B2 (en) 2009-06-09 2015-11-03 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US9206501B2 (en) 2011-08-02 2015-12-08 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus by using an organic layer deposition apparatus having stacked deposition sources
US9234270B2 (en) 2011-05-11 2016-01-12 Samsung Display Co., Ltd. Electrostatic chuck, thin film deposition apparatus including the electrostatic chuck, and method of manufacturing organic light emitting display apparatus by using the thin film deposition apparatus
US9249493B2 (en) 2011-05-25 2016-02-02 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus by using the same
US9257649B2 (en) 2012-07-10 2016-02-09 Samsung Display Co., Ltd. Method of manufacturing organic layer on a substrate while fixed to electrostatic chuck and charging carrier using contactless power supply module
US9260778B2 (en) 2012-06-22 2016-02-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9279177B2 (en) 2010-07-07 2016-03-08 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9306191B2 (en) 2012-10-22 2016-04-05 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US9347886B2 (en) 2013-06-24 2016-05-24 Samsung Display Co., Ltd. Apparatus for monitoring deposition rate, apparatus provided with the same for depositing organic layer, method of monitoring deposition rate, and method of manufacturing organic light emitting display apparatus using the same
US9388488B2 (en) 2010-10-22 2016-07-12 Samsung Display Co., Ltd. Organic film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9450140B2 (en) 2009-08-27 2016-09-20 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US9461277B2 (en) 2012-07-10 2016-10-04 Samsung Display Co., Ltd. Organic light emitting display apparatus
US9466647B2 (en) 2012-07-16 2016-10-11 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same
US9496317B2 (en) 2013-12-23 2016-11-15 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus
US9496524B2 (en) 2012-07-10 2016-11-15 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9512515B2 (en) 2011-07-04 2016-12-06 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9534288B2 (en) 2013-04-18 2017-01-03 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light-emitting display apparatus by using same, and organic light-emitting display apparatus manufactured by using deposition apparatus
US9593408B2 (en) 2009-08-10 2017-03-14 Samsung Display Co., Ltd. Thin film deposition apparatus including deposition blade
US9624580B2 (en) 2009-09-01 2017-04-18 Samsung Display Co., Ltd. Thin film deposition apparatus
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same
US10246769B2 (en) 2010-01-11 2019-04-02 Samsung Display Co., Ltd. Thin film deposition apparatus

Cited By (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012508815A (en) * 2008-11-17 2012-04-12 エスエヌユー プレシジョン カンパニー,リミテッドSnu Precision Co., Ltd. The deposition material supplying device and a substrate processing apparatus including the
CN102216488A (en) * 2008-11-17 2011-10-12 韩商Snu精密股份有限公司 Deposition material supply apparatus and substrate treatment apparatus having the same
US9121095B2 (en) 2009-05-22 2015-09-01 Samsung Display Co., Ltd. Thin film deposition apparatus
US8916237B2 (en) 2009-05-22 2014-12-23 Samsung Display Co., Ltd. Thin film deposition apparatus and method of depositing thin film
US9873937B2 (en) 2009-05-22 2018-01-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882920B2 (en) 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882921B2 (en) 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8802200B2 (en) 2009-06-09 2014-08-12 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US9174250B2 (en) 2009-06-09 2015-11-03 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US8907326B2 (en) 2009-06-24 2014-12-09 Samsung Display Co., Ltd. Organic light-emitting display device and thin film deposition apparatus for manufacturing the same
US8536057B2 (en) 2009-06-25 2013-09-17 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light emitting device by using the same
US8709161B2 (en) 2009-08-05 2014-04-29 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9593408B2 (en) 2009-08-10 2017-03-14 Samsung Display Co., Ltd. Thin film deposition apparatus including deposition blade
US8193011B2 (en) 2009-08-24 2012-06-05 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8137466B2 (en) 2009-08-24 2012-03-20 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8921831B2 (en) 2009-08-24 2014-12-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8968829B2 (en) 2009-08-25 2015-03-03 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8486737B2 (en) 2009-08-25 2013-07-16 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9450140B2 (en) 2009-08-27 2016-09-20 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US9624580B2 (en) 2009-09-01 2017-04-18 Samsung Display Co., Ltd. Thin film deposition apparatus
US9224591B2 (en) 2009-10-19 2015-12-29 Samsung Display Co., Ltd. Method of depositing a thin film
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
US9660191B2 (en) 2009-11-20 2017-05-23 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8951349B2 (en) 2009-11-20 2015-02-10 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US10246769B2 (en) 2010-01-11 2019-04-02 Samsung Display Co., Ltd. Thin film deposition apparatus
US10287671B2 (en) 2010-01-11 2019-05-14 Samsung Display Co., Ltd. Thin film deposition apparatus
US8859325B2 (en) 2010-01-14 2014-10-14 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8882556B2 (en) 2010-02-01 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8973525B2 (en) 2010-03-11 2015-03-10 Samsung Display Co., Ltd. Thin film deposition apparatus
US9453282B2 (en) 2010-03-11 2016-09-27 Samsung Display Co., Ltd. Thin film deposition apparatus
US8865252B2 (en) 2010-04-06 2014-10-21 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9136310B2 (en) 2010-04-28 2015-09-15 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9279177B2 (en) 2010-07-07 2016-03-08 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR101146997B1 (en) * 2010-07-12 2012-05-23 삼성모바일디스플레이주식회사 A tension apparatus for patterning slit sheet
US8833294B2 (en) 2010-07-30 2014-09-16 Samsung Display Co., Ltd. Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same
US9018647B2 (en) 2010-09-16 2015-04-28 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8846547B2 (en) 2010-09-16 2014-09-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the thin film deposition apparatus, and organic light-emitting display device manufactured by using the method
US8871542B2 (en) 2010-10-22 2014-10-28 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus manufactured by using the method
US9388488B2 (en) 2010-10-22 2016-07-12 Samsung Display Co., Ltd. Organic film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8882922B2 (en) 2010-11-01 2014-11-11 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8852687B2 (en) 2010-12-13 2014-10-07 Samsung Display Co., Ltd. Organic layer deposition apparatus
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same
CN102732841A (en) * 2011-04-13 2012-10-17 韩商Snu精密股份有限公司 Device for supplying materials
CN102732843A (en) * 2011-04-13 2012-10-17 韩商Snu精密股份有限公司 High-capacity deposition device for forming a thin film
US9234270B2 (en) 2011-05-11 2016-01-12 Samsung Display Co., Ltd. Electrostatic chuck, thin film deposition apparatus including the electrostatic chuck, and method of manufacturing organic light emitting display apparatus by using the thin film deposition apparatus
US8859043B2 (en) 2011-05-25 2014-10-14 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9249493B2 (en) 2011-05-25 2016-02-02 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus by using the same
US8906731B2 (en) 2011-05-27 2014-12-09 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US9512515B2 (en) 2011-07-04 2016-12-06 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9777364B2 (en) 2011-07-04 2017-10-03 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8951610B2 (en) 2011-07-04 2015-02-10 Samsung Display Co., Ltd. Organic layer deposition apparatus
US9150952B2 (en) 2011-07-19 2015-10-06 Samsung Display Co., Ltd. Deposition source and deposition apparatus including the same
US9206501B2 (en) 2011-08-02 2015-12-08 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus by using an organic layer deposition apparatus having stacked deposition sources
US9051636B2 (en) 2011-12-16 2015-06-09 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus
US9260778B2 (en) 2012-06-22 2016-02-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US8956697B2 (en) 2012-07-10 2015-02-17 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus and organic light-emitting display apparatus manufactured by using the method
US9257649B2 (en) 2012-07-10 2016-02-09 Samsung Display Co., Ltd. Method of manufacturing organic layer on a substrate while fixed to electrostatic chuck and charging carrier using contactless power supply module
US9496524B2 (en) 2012-07-10 2016-11-15 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9461277B2 (en) 2012-07-10 2016-10-04 Samsung Display Co., Ltd. Organic light emitting display apparatus
US9466647B2 (en) 2012-07-16 2016-10-11 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same
US8945974B2 (en) 2012-09-20 2015-02-03 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display device using an organic layer deposition apparatus
US9012258B2 (en) 2012-09-24 2015-04-21 Samsung Display Co., Ltd. Method of manufacturing an organic light-emitting display apparatus using at least two deposition units
US9306191B2 (en) 2012-10-22 2016-04-05 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US8945979B2 (en) 2012-11-09 2015-02-03 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus by using the same, and organic light-emitting display apparatus manufactured by the method
US9136476B2 (en) 2013-03-20 2015-09-15 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by the method
US8993360B2 (en) 2013-03-29 2015-03-31 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus
US9534288B2 (en) 2013-04-18 2017-01-03 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light-emitting display apparatus by using same, and organic light-emitting display apparatus manufactured by using deposition apparatus
US9040330B2 (en) 2013-04-18 2015-05-26 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus
US8962360B2 (en) 2013-06-17 2015-02-24 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the organic layer deposition apparatus
US9347886B2 (en) 2013-06-24 2016-05-24 Samsung Display Co., Ltd. Apparatus for monitoring deposition rate, apparatus provided with the same for depositing organic layer, method of monitoring deposition rate, and method of manufacturing organic light emitting display apparatus using the same
US9496317B2 (en) 2013-12-23 2016-11-15 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus

Also Published As

Publication number Publication date
KR100397196B1 (en) 2003-09-13

Similar Documents

Publication Publication Date Title
US5951779A (en) Treatment method of semiconductor wafers and the like and treatment system for the same
US6884319B2 (en) Susceptor of apparatus for manufacturing semiconductor device
US5060354A (en) Heated plate rapid thermal processor
US5252807A (en) Heated plate rapid thermal processor
CN101356296B (en) Vapor deposition apparatus for organic vapor deposition material and process for producing organic thin film
EP1560467B1 (en) Source for thermal physical vapor deposition of organic electroluminescent layers
JP2927857B2 (en) Substrate heating apparatus
US7312156B2 (en) Method and apparatus for supporting a semiconductor wafer during processing
CN100567556C (en) Evaporation source and vapor deposition apparatus having the same
EP1487006A1 (en) Device and method for heat treatment
KR100569646B1 (en) Heat-treating apparatus and heat-treating method
US6157004A (en) Electric heating or preheating furnace particularly for lining cylinders and/or for firing metal-ceramic
CN1157761C (en) Method for transfering wafers and heat treating device and ring combination
JP4133333B2 (en) Processing method and apparatus of the workpiece
JP5820731B2 (en) The substrate processing apparatus and the solid material replenishment methods
TWI416645B (en)
JP4436920B2 (en) The method of the organic deposition source and heating source
US20070264807A1 (en) Cleaining Process and Operating Process for a Cvd Reactor
KR19980018624A (en) Chemical vapor deposition, plasma enhanced chemical vapor deposition or an exhaust gas processing method and apparatus from the plasma etch reactor
US7102104B2 (en) Heat treatment system
CN1314834C (en) Processing system, processing method and mounting member
US20050034664A1 (en) Apparatus for depositing
US6879778B2 (en) Batch furnace
EP1522090A2 (en) Thermal processing system and configurable vertical chamber
JP2000510652A (en) Multi-purpose process chamber for the chemical vapor deposition process

Legal Events

Date Code Title Description
A201 Request for examination
G15R Request for early opening
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130705

Year of fee payment: 11

FPAY Annual fee payment

Payment date: 20140702

Year of fee payment: 12

FPAY Annual fee payment

Payment date: 20150727

Year of fee payment: 13

FPAY Annual fee payment

Payment date: 20160727

Year of fee payment: 14

LAPS Lapse due to unpaid annual fee