JPH04217532A - Inhibition of double lifting of piled thin plate - Google Patents

Inhibition of double lifting of piled thin plate

Info

Publication number
JPH04217532A
JPH04217532A JP41225690A JP41225690A JPH04217532A JP H04217532 A JPH04217532 A JP H04217532A JP 41225690 A JP41225690 A JP 41225690A JP 41225690 A JP41225690 A JP 41225690A JP H04217532 A JPH04217532 A JP H04217532A
Authority
JP
Japan
Prior art keywords
thin plate
striking
lifting
thin
lifted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP41225690A
Other languages
Japanese (ja)
Other versions
JP2536968B2 (en
Inventor
Shigeru Nakaji
中路 茂
Takayuki Ikeda
孝之 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
Kawasaki Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Steel Corp filed Critical Kawasaki Steel Corp
Priority to JP2412256A priority Critical patent/JP2536968B2/en
Publication of JPH04217532A publication Critical patent/JPH04217532A/en
Application granted granted Critical
Publication of JP2536968B2 publication Critical patent/JP2536968B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To surely lifting a thin plate one by one when accumulated thin plates are lifted in order from the uppermost one. CONSTITUTION:The upper surface of an uppermost thin plate S accumulated on a storing box B, is sucked and held by a vacuum sucking pad 14 of a lifting device 1, and the thin plate S is lifted thereby. While the thin plate S is lifted, a cylinder 16 is driven vertically, and by striking the thin plate S by a striking arm 18 mounted on the point, another thin plate S' adhered to the thin plate S is discriminated therefrom, and is thus dropped.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、積重ね薄板の二枚吊り
防止方法、特に積重ねてある冷延薄鋼板の切板等の薄板
を、最上位のものから1枚ずつ吊り上げて取り出すに際
し、同時に2枚以上の薄板を吊り上げることを確実に防
止できる積重ね薄板の二枚吊り防止方法に関する。
[Industrial Application Field] The present invention relates to a method for preventing the hanging of two sheets of stacked thin steel sheets, in particular, when lifting and taking out thin sheets such as cut sheets of stacked cold-rolled thin steel sheets one by one starting from the topmost sheet, This invention relates to a method for preventing hanging of two stacked thin plates, which can reliably prevent lifting of two or more thin plates.

【0002】0002

【従来の技術】所定の大きさに裁断された多数の薄板を
積重ねた状態で保存しておき、必要に応じて最上位にあ
る薄板から1枚ずつ順次取り出して該薄板を使用に供す
ることは、日常的に行われている。
[Prior Art] It is not possible to store a large number of thin plates cut to a predetermined size in a stacked state, and to use the thin plates by sequentially taking out the thin plates one by one starting from the top layer as needed. , is carried out on a daily basis.

【0003】例えば、製鉄所では、製造した冷延薄鋼板
の試験用試材や試験片等のサンプル板(薄板)をハンド
リングする場合、何枚も積重ねられたサンプル板を1枚
ずつに分離ハンドリングする作業が種々行われている。 これらの作業を装置化し自動化する場合、薄板の吊り上
げ方としては真空吸着パッドによる方法が主流である。 この真空吸着パッドでは、大きな切板でしかも非塗油板
であれば、薄板の変形等によって板間に隙間が入り易い
ので、1枚ずつ分離して吊り上げることが比較的容易で
あるが、小さい板や塗油板等では2枚以上一緒に吊り上
げてしまう問題がある。
For example, in a steelworks, when handling sample plates (thin plates) such as test materials and test pieces of manufactured cold-rolled thin steel plates, the stacked sample plates are separated and handled one by one. A variety of work is being carried out. When these operations are automated using equipment, the mainstream method for lifting thin plates is to use vacuum suction pads. With this vacuum suction pad, if the plates are large and unlubricated, gaps will easily form between the plates due to deformation of the thin plates, so it is relatively easy to separate them one by one and lift them up. There is a problem with boards, oiled boards, etc., where two or more boards are lifted together.

【0004】このように、薄板を吸着パッドで吊り上げ
る際に、同時に2枚以上吊り上がることを防止する方法
としては、特開昭47−32571、特開昭49−26
970、特開昭54−97969、特開昭58−216
846、実開昭49−33574、実開昭50−117
580、実公昭54−10701等に示されているよう
に、多くの方法がある。
[0004] As described above, methods for preventing two or more thin plates from being lifted at the same time when lifting them using suction pads are disclosed in Japanese Patent Application Laid-Open No. 47-32571 and Japanese Patent Application Laid-open No. 49-26.
970, JP 54-97969, JP 58-216
846, Utility Model No. 49-33574, Utility Model No. 50-117
There are many methods, as shown in Japanese Utility Model No. 580, Utility Model Publication No. 54-10701, etc.

【0005】又、その他にも、薄板の表面に略垂直方向
に振動を与える方法(特公昭51−12568)、薄板
の表面を振動ノズルで振動させる方法(実公昭51−7
7777)、磁石を用いて積層された薄板端部を同極に
磁化し、その反発力を利用する方法(実公昭55−24
038)等も知られている。
[0005] In addition, there are other methods, such as applying vibration to the surface of a thin plate in a substantially vertical direction (Japanese Patent Publication No. 51-12568), and vibrating the surface of a thin plate using a vibrating nozzle (Japanese Patent Publication No. 51-7).
7777), a method of magnetizing the ends of laminated thin plates to the same polarity using a magnet and utilizing the repulsive force (Utility Model Act 55-24
038) etc. are also known.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、これら
の方法には、薄板を極端に曲げたりするために該薄板に
損傷を与えることがあり、又、使用する装置が複雑であ
ったり、大掛りである等の欠点がある。
[Problems to be Solved by the Invention] However, in these methods, the thin plate may be damaged due to extreme bending, and the equipment used is complicated or large-scale. There are some drawbacks.

【0007】又、上記実公昭55−24038等のよう
に磁石を用いる方法は、性質上磁力を使えない薄板には
使用できないという問題点もある。
[0007] Furthermore, the method using a magnet as in the above-mentioned Japanese Utility Model Publication No. 55-24038 has the problem that it cannot be used for thin plates for which magnetic force cannot be used due to their nature.

【0008】本発明は、前記従来の問題点を解決するべ
くなされたもので、簡単な手段で確実に薄板の二枚吊り
を防止することができる積重ね薄板の二枚吊り防止方法
を提供することを課題とする。
The present invention has been made to solve the above-mentioned conventional problems, and provides a method for preventing double hanging of stacked thin plates, which can reliably prevent double hanging of thin plates by simple means. The task is to

【0009】[0009]

【課題を解決するための手段】本発明は、積重ねてある
薄板を吊上手段で順次吊り上げる際の積重ね薄板の二枚
吊り防止方法において、薄板を打撃するための打撃手段
を設け、最上位の薄板の上面を吊上手段で保持して該薄
板を吊り上げ、吊り上げた状態の上記薄板を、上記打撃
手段で打撃することにより、前記課題を達成したもので
ある。
[Means for Solving the Problems] The present invention provides a method for preventing the hanging of two stacked thin plates when the stacked thin plates are sequentially lifted by a lifting means, in which a striking means for striking the thin plates is provided, and a striking means for striking the thin plates is provided. The above object is achieved by lifting the thin plate by holding the upper surface of the thin plate with a lifting means and striking the lifted thin plate with the striking means.

【0010】0010

【作用】本発明においては、積重ねられている薄板を、
最上位のものから順次真空吸着パッド等の吊上手段で順
次吊り上げるに際し、吊り上げた状態の薄板の一部を打
撃することにより、上記吊上手段で保持されている薄板
に付着している薄板をその打撃力で分離させることがで
きるので、薄板を1枚ずつ確実に吊り上げることができ
る。
[Operation] In the present invention, the stacked thin plates are
When lifting one by one using a lifting means such as a vacuum suction pad, starting with the highest one, by hitting a part of the lifted thin plate, the thin plate attached to the thin plate held by the lifting means can be removed. Since the impact force can be used to separate the thin plates, the thin plates can be reliably lifted one by one.

【0011】本発明によれば、磁力を使えない薄板はも
とより、表面の仕上り状態が良い薄板や、表面に塗油さ
れた薄板等の離れ難い薄板であっても、確実に1枚ずつ
吊り上げることができる。
According to the present invention, it is possible to reliably lift one sheet at a time, not only for thin sheets that cannot be used with magnetic force, but also for thin sheets that are hard to separate, such as thin sheets with a well-finished surface or thin sheets coated with oil on the surface. I can do it.

【0012】0012

【実施例】以下、図面を参照して、本発明の実施例を詳
細に説明する。
Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

【0013】図1は、本発明の第1実施例に適用される
吊上装置を、その作用と共に示した概略正面図である。
FIG. 1 is a schematic front view showing a lifting device applied to a first embodiment of the present invention, along with its function.

【0014】上記吊上装置1は、吊上枠10を有してお
り、該吊上枠10の所定位置の上部には昇降用シリンダ
12が設置され、その下方には該シリンダ12に昇降さ
れる真空吸着パッド(吊上手段)14が設置されている
The lifting device 1 has a lifting frame 10, and a lifting cylinder 12 is installed at a predetermined upper part of the lifting frame 10, and a lifting cylinder 12 is installed below the lifting frame 10. A vacuum suction pad (lifting means) 14 is installed.

【0015】又、上記吊上枠10の両端部には打撃用シ
リンダ16が設置され、その先端には該シリンダ16に
より上下動されるゴム等の打撃片(打撃手段)18が取
付けられている。
Further, striking cylinders 16 are installed at both ends of the lifting frame 10, and a striking piece (impacting means) 18 made of rubber or the like is attached to the tip thereof, which is moved up and down by the cylinder 16. .

【0016】又、図中符号Bで示したものは収納箱であ
り、該収納箱B内には、多数の切板(薄板)Sが積載収
納されている。
Further, the reference numeral B in the figure is a storage box, and inside the storage box B, a large number of cut plates (thin plates) S are stacked and stored.

【0017】本実施例では、上述した吊上装置1を、移
動手段(図示せず)により、上記収納箱Bの上方に移動
させた後、上記昇降用シリンダ12を駆動させて上記真
空吸着パッド14を下降させ、該パッド14を上記切板
Sの表面に押し付け、接触させる。
In this embodiment, after the above-mentioned lifting device 1 is moved above the above-mentioned storage box B by a moving means (not shown), the above-mentioned lifting cylinder 12 is driven to move the above-mentioned vacuum suction pad. 14 is lowered, and the pad 14 is pressed against the surface of the cutting plate S to bring it into contact.

【0018】上記真空吸着パッド14を最上位の切板S
の表面に接触させた後、該パッド14内を減圧状態にし
て上記切板Sを吸着し、保持する。
The vacuum suction pad 14 is placed on the uppermost cutting plate S.
After making contact with the surface of the pad 14, the pressure inside the pad 14 is reduced to attract and hold the cut plate S.

【0019】上記切板Sを吸着・保持した状態で、上記
真空吸着パッド14を上昇させ、該切板Sを前記図1の
位置まで吊り上げた段階で、打撃用シリンダ16を駆動
させ、吊り上げられた状態にある切板Sを上記打撃片1
8で打撃する。
With the cut plate S being sucked and held, the vacuum suction pad 14 is raised, and when the cut plate S is lifted to the position shown in FIG. The cut plate S in the state of
Hit with 8.

【0020】上記のように、吊り上げ状態の切板Sを打
撃すると、その際の衝撃力により、図中二点鎖線で示し
たように、該切板Sの裏面に付着したまま吊り上げられ
た切板S′がある場合には、これを分離させることが可
能となる。その結果、分離された切板S′は元の位置に
落下するため、上記シリンダに吸着されている切板Sの
みを吊り上げることが可能となり、確実に1枚の切板S
を所望の場所に搬送することが可能となる。
As described above, when the suspended cutting board S is struck, the impact force at that time causes the suspended cutting board to remain attached to the back surface of the cutting board S, as shown by the two-dot chain line in the figure. If the plate S' is present, it is possible to separate it. As a result, the separated cut plate S' falls back to its original position, making it possible to lift only the cut plate S that is attracted to the cylinder, ensuring that only one cut plate S
can be transported to a desired location.

【0021】従って、切板Sを積重ねて収納した収納箱
から、切板Sを1枚ずつ取出して移動させることが可能
となり、例えば試験用や加工用等の切板をハンドリング
する場合の作業の自動化が可能となった。又、塗油板な
どの、従来は分離し難かった切板をも効果的に分離し、
1枚ずつ吊り上げることが可能となった。
[0021] Therefore, it becomes possible to take out and move the cut plates S one by one from the storage box in which the cut plates S are stacked and stored, which simplifies the work when handling cut plates for testing or processing, for example. Automation is now possible. In addition, it can effectively separate cut plates such as oiled plates that were previously difficult to separate.
It became possible to lift one piece at a time.

【0022】又、本実施例では、吊り上げられた切板S
の端部近傍を打撃するので、付着している切板S′を効
果的に分離させることができる。又、塗油された付着力
の大きな切板の場合は、吊り上げた状態で切板が曲る程
度の打撃を与えると効果的に分離できる。
Furthermore, in this embodiment, the suspended cut plate S
Since the impact is applied near the end of the cut plate S', the adhering cut plate S' can be effectively separated. In addition, in the case of a cut plate coated with oil and having a strong adhesion force, it can be effectively separated by applying a blow to the extent that the cut plate bends while being lifted up.

【0023】なお、上記打撃片による打撃の仕方は、特
に限定されるものでなく、例えば1回の打撃であっても
よく、又、1回では十分でないとき等の場合は、打撃用
シリンダ16の上下駆動を繰返し、2回以上の打撃を行
ってもよい。
[0023] The manner of striking with the above-mentioned striking piece is not particularly limited; for example, one strike may be sufficient, and if one strike is not sufficient, the striking cylinder 16 may be used. The vertical movement may be repeated to perform two or more strikes.

【0024】又、打撃の程度は、吸着状態にある切板S
が外れない範囲で任意に調整可能であり、又、2回以上
の打撃を行う場合の間隔は、切板Sに適切な衝撃力を与
えることができる程度に任意に変更可能である。
[0024] Furthermore, the degree of impact is determined by
can be arbitrarily adjusted within a range that does not come off, and the interval when striking two or more times can be arbitrarily changed to the extent that an appropriate impact force can be applied to the cut plate S.

【0025】又、打撃片18の設置数は、適用する切板
Sの大きさ、種類等に応じて任意に変更でき、その設置
位置も切板Sの端部近傍を打撃することが可能な位置に
限られない。
Furthermore, the number of striking pieces 18 installed can be changed arbitrarily depending on the size, type, etc. of the cut plate S to which it is applied, and the installation position can also be changed so that it can strike the vicinity of the end of the cut plate S. It's not limited to location.

【0026】又、打撃片を駆動する手段もシリンダに限
らず、例えば電動機等であってもよい。
Further, the means for driving the striking piece is not limited to a cylinder, but may be, for example, an electric motor.

【0027】次に本発明の第2実施例を説明する。Next, a second embodiment of the present invention will be described.

【0028】本実施例は、図2に示したように、真空吸
着パッド14で切板Sを吸着して吊り上げた際に、その
吊り上げ途中で該切板Sの端部近傍を打撃することがで
きる位置に打撃手段20を別個に設置した以外は、前記
第1実施例の場合と実質的に同一である。
In this embodiment, as shown in FIG. 2, when the cut plate S is sucked and lifted by the vacuum suction pad 14, the vicinity of the end of the cut plate S can be hit during the lifting. This embodiment is substantially the same as the first embodiment except that the striking means 20 is separately installed at a location where it can be used.

【0029】本実施例に適用される打撃手段20は、ス
プリング22で弾発力が付与されたアーム24の先端に
、ゴム製等の打撃片18が取付けられているものである
。この打撃片18は、上記切板Sが吊り上げられると、
該切板Sの端部近傍に当接する位置に配置されている。
The striking means 20 applied to this embodiment has a striking piece 18 made of rubber or the like attached to the tip of an arm 24 to which elastic force is applied by a spring 22. This striking piece 18, when the cut plate S is lifted,
It is arranged at a position where it comes into contact with the vicinity of the end of the cutting plate S.

【0030】本実施例では、前記第1実施例の場合と同
様に切板を真空吸着パッド14で吸着した後、図2(A
)に示すように吸着状態のまま該切板Sを急速に吊り上
げ、上昇させる。切板Sが、上記打撃片18の位置まで
上昇すると、図2(B)に示すように、上記切板Sの側
端近傍は、上記打撃片18に衝突し、該打撃片18をア
ーム24と共に外側に押しやりつつ、更に上方に吊り上
げられる。又、同時に、上記打撃片はスプリング22に
より元の位置に戻り、次の切板の吊上に待機する。
In this embodiment, the cut plate is suctioned by the vacuum suction pad 14 in the same way as in the first embodiment, and then
), the cut plate S is rapidly lifted and raised while in the suction state. When the cutting plate S rises to the position of the striking piece 18, the vicinity of the side end of the cutting plate S collides with the striking piece 18, as shown in FIG. At the same time, it is pushed outward and lifted further upwards. At the same time, the striking piece returns to its original position by the spring 22 and waits for hoisting the next cut plate.

【0031】本実施例によれば、上述の如く、切板Sを
急上昇させてその端部近傍を打撃片18に衝突させるた
め、その際に該切板Sに打撃力が加わることになる。そ
の結果、前記第1実施例と同様に、真空吸着パッド14
に吸着されている切板Sに付着している切板S′を確実
に分離させることが可能となり、切板Sを1枚ずつ確実
に吊り上げることが可能となる。
According to this embodiment, as described above, the cut plate S is raised rapidly and the vicinity of its end collides with the striking piece 18, so that a striking force is applied to the cut plate S at that time. As a result, similarly to the first embodiment, the vacuum suction pad 14
It becomes possible to reliably separate the cut plate S' adhering to the cut plate S that is attracted to the cut plate S, and it becomes possible to reliably lift the cut plate S one by one.

【0032】以上、本発明を具体的に説明したが、本発
明は前記実施例に示したものに限定されるものでないこ
とはいうまでもない。
Although the present invention has been specifically explained above, it goes without saying that the present invention is not limited to what has been shown in the above embodiments.

【0033】例えば、前記実施例では、真空吸着パッド
が幅方向に2箇所設けてある吊上装置を示したが、これ
に限らず、吊り上げる薄板の大きさ、重さ、種類等に応
じて、真空吸着パッドの設置数、設置位置を任意に変更
可能である。
For example, in the above embodiment, a lifting device is shown in which vacuum suction pads are provided at two locations in the width direction. The number and position of vacuum suction pads can be changed as desired.

【0034】又、吊上手段としては真空吸着パッドのみ
を示したが、これに限らず、例えば該真空吸着パッドの
代りに電磁石を用いることもできる。
Further, although only a vacuum suction pad is shown as the lifting means, the present invention is not limited to this, and for example, an electromagnet may be used instead of the vacuum suction pad.

【0035】[0035]

【発明の効果】前述した通り、本発明によれば、簡単な
手段で、積重ねられている薄板を、その最上位のものか
ら1枚ずつ確実に吊り上げることができる。
As described above, according to the present invention, stacked thin plates can be reliably lifted one by one starting from the topmost one by simple means.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】図1は、第1実施例に適用される真空吸着パッ
ドを、その作用と共に示す概略正面図である。
FIG. 1 is a schematic front view showing a vacuum suction pad applied to a first embodiment along with its function.

【図2】図2は、第2実施例に適用される吊上装置の要
部を、その作用と共に示す概略正面図である。
FIG. 2 is a schematic front view showing the main parts of the lifting device applied to the second embodiment, along with their functions.

【符号の説明】[Explanation of symbols]

1…吊上装置、 12…昇降用シリンダ、 14…真空吸着パッド、 16…打撃用シリンダ、 18…打撃片。 1... Lifting device, 12...lifting cylinder, 14...Vacuum suction pad, 16...Blow cylinder, 18...Blowing piece.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】積重ねてある薄板を吊上手段で順次吊り上
げる際の積重ね薄板の二枚吊り防止方法において、薄板
を打撃するための打撃手段を設け、最上位の薄板の上面
を吊上手段で保持して該薄板を吊り上げ、吊り上げた状
態の上記薄板を、上記打撃手段で打撃することを特徴と
する積重ね薄板の二枚吊り防止方法。
Claim 1: A method for preventing the suspension of two stacked thin plates when the stacked thin plates are sequentially lifted by a lifting means, wherein a striking means for striking the thin plates is provided, and the upper surface of the uppermost thin plate is touched by the lifting means. A method for preventing hanging of two stacked thin plates, which comprises holding and lifting the thin plates, and striking the lifted thin plates with the striking means.
JP2412256A 1990-12-20 1990-12-20 A device for preventing double hanging of stacked thin plates Expired - Fee Related JP2536968B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2412256A JP2536968B2 (en) 1990-12-20 1990-12-20 A device for preventing double hanging of stacked thin plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2412256A JP2536968B2 (en) 1990-12-20 1990-12-20 A device for preventing double hanging of stacked thin plates

Publications (2)

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JPH04217532A true JPH04217532A (en) 1992-08-07
JP2536968B2 JP2536968B2 (en) 1996-09-25

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Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1070674A2 (en) * 1999-07-16 2001-01-24 Hitachi, Ltd. Apparatus for separating and picking out thin board type objects
JP2011246211A (en) * 2010-05-24 2011-12-08 Toyama Kikai Kk Device and method for transferring solar cell
JP2021054613A (en) * 2019-09-30 2021-04-08 フタバ産業株式会社 Plate material separation device and plate material conveyance system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59223637A (en) * 1983-05-27 1984-12-15 Fujitsu Ltd Separation method of stacked thin plates
JPS634932U (en) * 1986-06-24 1988-01-13
JPH0264542U (en) * 1988-11-07 1990-05-15

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59223637A (en) * 1983-05-27 1984-12-15 Fujitsu Ltd Separation method of stacked thin plates
JPS634932U (en) * 1986-06-24 1988-01-13
JPH0264542U (en) * 1988-11-07 1990-05-15

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1070674A2 (en) * 1999-07-16 2001-01-24 Hitachi, Ltd. Apparatus for separating and picking out thin board type objects
EP1070674A3 (en) * 1999-07-16 2002-04-17 Hitachi, Ltd. Apparatus for separating and picking out thin board type objects
JP2011246211A (en) * 2010-05-24 2011-12-08 Toyama Kikai Kk Device and method for transferring solar cell
JP2021054613A (en) * 2019-09-30 2021-04-08 フタバ産業株式会社 Plate material separation device and plate material conveyance system

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