JPH0421647Y2 - - Google Patents
Info
- Publication number
- JPH0421647Y2 JPH0421647Y2 JP16368087U JP16368087U JPH0421647Y2 JP H0421647 Y2 JPH0421647 Y2 JP H0421647Y2 JP 16368087 U JP16368087 U JP 16368087U JP 16368087 U JP16368087 U JP 16368087U JP H0421647 Y2 JPH0421647 Y2 JP H0421647Y2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder
- molten solder
- nozzle
- waves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 34
- 238000005476 soldering Methods 0.000 claims description 12
- 238000007667 floating Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 239000003517 fume Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16368087U JPH0421647Y2 (cs) | 1987-10-28 | 1987-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16368087U JPH0421647Y2 (cs) | 1987-10-28 | 1987-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0168164U JPH0168164U (cs) | 1989-05-02 |
| JPH0421647Y2 true JPH0421647Y2 (cs) | 1992-05-18 |
Family
ID=31448616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16368087U Expired JPH0421647Y2 (cs) | 1987-10-28 | 1987-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0421647Y2 (cs) |
-
1987
- 1987-10-28 JP JP16368087U patent/JPH0421647Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0168164U (cs) | 1989-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000040872A (ja) | プリント基板のはんだ付け方法および噴流はんだ槽 | |
| JPH0421647Y2 (cs) | ||
| US20240015926A1 (en) | Immersion cooling system | |
| EP1694104B1 (en) | Surface-mounting type electronic circuit unit | |
| JPH0144220Y2 (cs) | ||
| JPH087655Y2 (ja) | 面実装部品の取付構造 | |
| JPH034438Y2 (cs) | ||
| JPS6246270B2 (cs) | ||
| JP3956250B2 (ja) | 噴流はんだ槽 | |
| JPH028601Y2 (cs) | ||
| GB2063414A (en) | Cleaning of Printed Circuit Boards | |
| JP5240844B2 (ja) | 構造体、これを用いた基板装置及びその実装方法 | |
| JP3197856B2 (ja) | 噴流はんだ槽 | |
| JP2584837Y2 (ja) | 噴流はんだ槽 | |
| JPH0615420Y2 (ja) | プリント基板用ラグ端子の取付構造 | |
| JPS625818Y2 (cs) | ||
| JPH0635498Y2 (ja) | プリント基板 | |
| CN211720851U (zh) | 一种机械式插件吸嘴 | |
| JP3674979B2 (ja) | 多面取り回路基板 | |
| JP2000244080A (ja) | プリント配線板 | |
| JPH02271593A (ja) | 表面実装型２電極チップ部品実装用のプリント基板のパッド | |
| JP2006344812A (ja) | 電子部品 | |
| JP2002217502A (ja) | プリント基板の取付部構造及びその製造方法 | |
| KR19980046071U (ko) | 인쇄회로기판의 에칭액 분사장치 | |
| JPH10335565A (ja) | デュアルインラインパッケージ及びその取り付け方法 |