JPH04214655A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPH04214655A
JPH04214655A JP2401458A JP40145890A JPH04214655A JP H04214655 A JPH04214655 A JP H04214655A JP 2401458 A JP2401458 A JP 2401458A JP 40145890 A JP40145890 A JP 40145890A JP H04214655 A JPH04214655 A JP H04214655A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
sealed semiconductor
sealed
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2401458A
Other languages
Japanese (ja)
Inventor
Kiminari Tajima
田島　公成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP2401458A priority Critical patent/JPH04214655A/en
Publication of JPH04214655A publication Critical patent/JPH04214655A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Abstract

PURPOSE:To obtain an effect that a positioning operation can be performed easily by utilizing a recessed part so that an installed position is not moved carelessly. CONSTITUTION:At a resin-sealed semiconductor device, a resin part 3 which has sealed a lead frame 1 and a semiconductor chip 2 is constituted. The bottom face part of the resin part 3 is formed as a recessed part, and a plurality of round holes 4, square holes and the like are provided.

Description

【発明の詳細な説明】[Detailed description of the invention]

【０００１】0001

【産業上の利用分野】本発明は半導体装置に関し、特に
樹脂封止型の半導体装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a resin-sealed semiconductor device.

【０００２】0002

【従来の技術】従来の半導体装置は、図２に示す様に、
樹脂部１３には意図的な凹部は有しない形状をしている
。[Prior Art] A conventional semiconductor device, as shown in FIG.
The resin portion 13 has a shape that does not have any intentional recesses.

【０００３】0003

【発明が解決しようとする課題】この従来の半導体装置
では、プリント基板に実装する場合等において、その設
置位置を定める時は、樹脂部上部をつかんで、位置を定
める必要があり、その位置の基準もあいまいで、設置位
置精度が容易に向上せず、設置後の位置を容易に保たれ
ないという様な問題点があった。[Problems to be Solved by the Invention] When mounting this conventional semiconductor device on a printed circuit board, etc., when determining the installation position, it is necessary to grasp the upper part of the resin part and determine the position. The standards were also vague, and there were problems in that the accuracy of the installation position could not be easily improved and the position after installation could not be easily maintained.

【０００４】本発明の目的は、設置後の位置定めを容易
にできる樹脂封止型半導体装置を提供することにある。An object of the present invention is to provide a resin-sealed semiconductor device that can be easily positioned after installation.

【０００５】[0005]

【課題を解決するための手段】本発明の樹脂封止型半導
体装置は、設置の基準となりその位置を固定する為の穴
あるいは凹部を半導体装置の樹脂部に備えている。[Means for Solving the Problems] The resin-sealed semiconductor device of the present invention has a hole or a recess in the resin portion of the semiconductor device to serve as a reference for installation and to fix the position.

【０００６】[0006]

【実施例】次に本発明について図面を参照して説明する
。図１は本発明の一実施例の半導体装置の縦断面図及び
底面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a longitudinal sectional view and a bottom view of a semiconductor device according to an embodiment of the present invention.

【０００７】樹脂封止型半導体装置はリードフレーム１
と半導体チップ２を封止した樹脂部３で構成されている
。この樹脂部３の底面部に凹部として、複数個の丸穴４
を有している。The resin-sealed semiconductor device has a lead frame 1.
and a resin part 3 in which a semiconductor chip 2 is sealed. A plurality of round holes 4 are formed as recesses in the bottom of the resin part 3.
have.

【０００８】この穴は丸穴である必要はなく、四角等の
形状でもよい。又、穴の数は複数個あれば数は限定され
ない。[0008] This hole does not have to be a round hole, but may have a square shape or the like. Further, the number of holes is not limited as long as there are a plurality of holes.

【０００９】[0009]

【発明の効果】以上説明したように本発明は、樹脂部底
面に凹部を有しているので、これを利用して設置の位置
定めを容易にでき、その位置が不用意に移動しない様に
できるという効果を有する。[Effects of the Invention] As explained above, the present invention has a concave portion on the bottom of the resin part, so by using this, it is possible to easily determine the installation position, and to prevent the position from being moved inadvertently. It has the effect of being able to.

【図面の簡単な説明】[Brief explanation of the drawing]

【図１】本発明の一実施例の縦断面図と底面図である。FIG. 1 is a longitudinal sectional view and a bottom view of an embodiment of the present invention.

【図２】従来の半導体装置の縦断面図と底面図である。FIG. 2 is a vertical cross-sectional view and a bottom view of a conventional semiconductor device.

【符号の説明】[Explanation of symbols]

１，１１　　　　リードフレーム ２，１２　　　　半導体チップ ３，１３　　　　樹脂部 ４　　　　凹部 1,11 Lead frame 2,12 Semiconductor chip 3,13 Resin part 4 Recessed part

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】　　樹脂部底面に複数の凹部を有すること
を特徴とする樹脂封止型半導体装置。1. A resin-sealed semiconductor device having a plurality of recesses on the bottom surface of the resin portion.
JP2401458A 1990-12-12 1990-12-12 Resin-sealed semiconductor device Pending JPH04214655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2401458A JPH04214655A (en) 1990-12-12 1990-12-12 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2401458A JPH04214655A (en) 1990-12-12 1990-12-12 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPH04214655A true JPH04214655A (en) 1992-08-05

Family

ID=18511283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2401458A Pending JPH04214655A (en) 1990-12-12 1990-12-12 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPH04214655A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8617778B2 (en) 2009-12-28 2013-12-31 Ricoh Company, Ltd. Image bearing member, image forming apparatus, and process cartridge

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8617778B2 (en) 2009-12-28 2013-12-31 Ricoh Company, Ltd. Image bearing member, image forming apparatus, and process cartridge

Similar Documents

Publication Publication Date Title
KR870004507A (en) Resin-sealed semiconductor device
CA2161569A1 (en) Circuit element mounting structure
KR920010872A (en) Multichip Module
DE69013646D1 (en) Integrated semiconductor circuit device with contacting areas on the edge of the semiconductor chip.
JPH04214655A (en) Resin-sealed semiconductor device
JPH07297573A (en) Printed circuit board fixing mechanism
JPS53110371A (en) Ceramic package type semiconductor device
JPH0631742Y2 (en) Resin-sealed electronic circuit device
JPH08172247A (en) Circuit board
JPS6130288Y2 (en)
JPH0611537Y2 (en) Resin-sealed electronic circuit device
KR960001725Y1 (en) Attachment jig for rubber-attached soldering plate
JPH0543488Y2 (en)
IT1296458B1 (en) VERTICALLY INTEGRATED SEMICONDUCTOR COMPONENT ON A SUBSTRATE WITH A REAR-SIDE CONNECTION
JPS6319827Y2 (en)
FR2535528B1 (en) INTEGRATED CIRCUIT STRUCTURE ON INSULATING SUBSTRATE WITH INSULATING FILLER AROUND SEMICONDUCTOR ISLANDS
JPS5874341U (en) Resin molding equipment for semiconductor devices
JPS6446963A (en) Package for semiconductor integrated circuit
JPS6039253U (en) integrated circuit device
JPH0463148U (en)
JPH0596890A (en) Memory card
JPS6489545A (en) Package for semiconductor device
JPH02112300A (en) Packaging device of multilayer ceramic wiring board
JPS5844841U (en) Mold for resin-sealed semiconductor devices
JPS6134750U (en) semiconductor equipment