JPH04212475A - Manufacture of photovoltaic device - Google Patents

Abstract

PURPOSE:To provide the manufacturing method of a photovoltaic device by a method wherein a first resin layer is reliably stuck on a support substrate during a process for forming the device on the substrate and after the device is completed, the layer can be easily peeled from the substrate and the peeling of both of the layer and the substrate can be performed in a short time. CONSTITUTION:In the manufacturing method of a photovoltaic device manufactured by a method wherein a first resin layer 3 having an insulation property and a flexibility and a photoelectric conversion element 7 are at least laminated and formed in order on the upper surface of a support substrate 1 and thereafter, the layer 3 is peeled from the substrate 1, the adhesion of the layer 3 at least one part of a position surrounding the part of the photovoltaic device 10, which is peeled from the substrate 1, to the substrate 1 is increased more than that of other part.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible photovoltaic device.

0002

[Prior Art] Conventionally, this type of flexible photovoltaic device has been constructed on a flexible substrate such as stainless steel.
There are devices in which an insulating film, a metal back electrode, a thin film semiconductor layer including a photoactive layer, and a transparent electrode are sequentially formed.

However, although the photovoltaic device having this structure has flexibility, it is not sufficient.

[0004] Therefore, a photoelectric conversion element consisting of a laminate of a first resin layer having insulating, translucent, and flexible properties, a first electrode, a thin film semiconductor layer, and a second electrode is provided on the upper surface of a support substrate.
JP-A-1-105581 discloses a method for manufacturing a photovoltaic device in which a second insulating and flexible resin layer is sequentially laminated and then the first resin layer is peeled from the support substrate. Proposed.

[0005] As the first resin layer described above, a polyimide resin having excellent heat resistance is used, and since the film thickness can be made very thin, it is possible to make the first resin layer extremely flexible. An electromotive force device can be manufactured.

[0006]

[Problems to be Solved by the Invention] However, in the above method, the support substrate and the first
It must be ensured that the resin layer does not peel off. For this purpose, it is possible to strengthen the adhesion between the first resin layer and the support substrate over the entire surface of the support substrate, but in that case, the first resin layer is peeled off from the support substrate after the photovoltaic device is formed. In the process, the entire substrate is immersed in water, and it takes a very long time for the first resin layer to peel off from the supporting substrate due to the internal stress of the photovoltaic device.

The present invention has been made in view of the above-mentioned problems, and is designed to ensure that the support substrate and the first resin layer are reliably bonded to each other during the process of forming a photovoltaic device on the support substrate. Another object of the present invention is to provide a method for manufacturing a photovoltaic device in which the support substrate and the first resin layer can be easily peeled off after the photovoltaic device is completed, and in which both can be peeled off in a short time. do.

[0008]

[Means for Solving the Problems] The present invention provides a photovoltaic device comprising a laminate of an insulating and flexible first resin layer, a first electrode, a thin film semiconductor layer, and a second electrode on the upper surface of a support substrate. After at least sequentially stacking the conversion element, the first
In the method for manufacturing a photovoltaic device in which a resin layer is peeled off from the support substrate, adhesion between the first resin layer and the support substrate at at least a portion of a position surrounding a portion of the photovoltaic device to be peeled off from the support substrate. It is characterized by having been made stronger than other parts.

[0009]

[Function] According to the present invention, during the formation of the photovoltaic device, the first resin layer is firmly adhered to the supporting substrate surrounding it, so that it does not peel off from the supporting substrate; After completion, it can be easily peeled off from the supporting substrate.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 4 show a first embodiment of the present invention.

First, as shown in FIG. 1, the adhesion between the support substrate 1 and the first resin layer 3 to be laminated in a subsequent process at the periphery of one main surface of the support substrate 1 made of glass, ceramics, etc. In order to make the supporting substrate 1 stronger than other parts, an adhesive layer 2 made of a material having a strong adhesive force for both is formed on the periphery of the upper surface of the supporting substrate 1. As shown in FIG. 2, this adhesive layer 2 is provided along the outer periphery of the support substrate 1, that is, to surround the portion of the photovoltaic device 10 that will be peeled off from the support substrate 1, which will be formed through a post-process. It will be done. To explain more specifically, after polishing the surface of a glass of approximately 100 mm square as the supporting substrate 1, a distance of 1 to 5 mm from the periphery of the supporting substrate 1 is formed.
Adhesive layer 2 with a line width of 0.1 to 3 mm, leaving a margin of
A metal film such as silver (Ag) or aluminum (Al) is formed to a thickness of about 2000 Å to 1 μm using a method such as vapor deposition or sputtering. Alternatively, the adhesive layer 2 may be formed by applying a metal paste such as Ag paste or Al paste to a thickness of about 5 to 30 μm by a printing method, and then sintering it at a temperature of 300 to 600° C.

Next, as shown in FIG. 3, a first resin layer 3 made of an organic polymer having at least insulation and flexibility is formed on one main surface of the support substrate 1 including the adhesive layer 2. 5～
It is formed with a thickness of 100 μm. Specifically, when imparting translucency to the first resin layer 3, a transparent polyimide varnish is uniformly applied using a spin coater or a roll coater, and the temperature is gradually increased between 100°C and 300°C. Process. If the film thickness is 5 μm or less, the mechanical strength will be insufficient when the first resin layer 3 is peeled off from the support substrate 1 in the process described later, and if the film thickness is 100 μm, sufficient light transmittance will not be obtained. Therefore, the first resin layer 3 preferably has a thickness of 5 to 100 μm as described above.

On the other hand, when the first resin layer 3 is not required to have translucency, an ordinary non-transparent polyimide varnish is uniformly applied with a spin coater or a roll coater, and
The treatment is carried out while increasing the temperature stepwise between 300°C and 300°C.

[0014] Thereafter, a first
When the resin layer 3 has translucency, the film thickness is 2000 to 500
0 Å tin oxide (SnO2), indium tin oxide (ITO)
) etc., or when the first resin layer 3 is non-transparent, A with a film thickness of about 2000 Å to 1 μm is used.
lSingle layer structure or Al, titanium (Ti), Ag, Ti
The first electrode 4 is formed of an electrode layer made of a metal having a laminated structure in which Ag alloy or the like is laminated in two layers or in multiple layers.

Next, on the upper surface of the first electrode 4, amorphous silicon (a- An amorphous silicon-based semiconductor layer 5 such as Si), amorphous silicon carbide (a-SiC), or amorphous silicon germanium (a-SiGe) is formed by a plasma CVD method or a photoCVD method.

Furthermore, when the first electrode 4 is a transparent electrode, an Al single layer structure with a thickness of about 4000 Å to 2 μm or Al, Ti, Ag, TiAg, etc. is formed on the upper surface of the semiconductor layer 5.
If the electrode layer is made of a metal with a laminated structure in which alloys or the like are laminated in two layers or even in multiple layers, or if the first electrode 4 is a metal electrode, Sn with a film thickness of about 200 to 2000 Å is used.
A transparent electrode layer made of O2, ITO, etc. is formed as the second electrode 6, and thus the photoelectric conversion element 7 made of the laminate of the first electrode 4, the semiconductor layer 5, and the second electrode 6 is completed.

After that, if the second electrode 6 is a metal electrode, a thermoplastic resin sheet of ethylene vinyl acetate (EVA), polyethylene terephthalate (PET), etc. with a thickness of about 20 to 100 μm is placed on the upper surface of the second electrode 6. On the other hand, when the second electrode 6 is a transparent electrode, 20 to
A second resin layer 8 made of a transparent thermoplastic resin sheet such as PET or fluororesin having a thickness of about 100 μm is formed.

The second resin layer 8 is formed after the step of peeling off the first resin layer 3 from the supporting substrate 1, which will be described later.
It may also be formed on the electrode 6.

Finally, as shown in FIG. 4, a cutting line 9 is drawn along the inside of the adhesive layer 2 by irradiating a laser beam or mechanically cutting. In addition, when using a laser beam, its intensity needs to be strong enough to melt all the layers in the irradiated area, that is, the first resin layer 3, each layer 4, 5, 6 of the photoelectric conversion element 7, and the second resin layer 8. There is. By drawing this cutting line 9, the inner part thereof is cut from the part where the adhesive layer 2 exhibiting strong adhesive force between the support substrate 1 and the first resin layer 3 is located. Thereafter, by immersing it in water or applying an external mechanical force, the first resin layer 3 on the inner side of the cutting line 9 is easily peeled off from the support substrate 1, and the photovoltaic device has flexibility. 10 is obtained.

By the way, a feature of the present invention is that the adhesion between the first resin layer 3 and the support substrate 1 in at least a portion surrounding the portion of the photovoltaic device 10 to be peeled off from the support substrate 1 is made stronger than in other portions. The reason is that we have strengthened it, and the following is as follows.
A second embodiment to an eighth embodiment will be shown. In addition, in these examples, there is no difference from the above-mentioned first example except for the method of strengthening the adhesion between the first resin layer 3 and the supporting substrate 1. Only the method of increasing the adhesive force between the support substrate 1 and the supporting substrate 1 will be explained, and other explanations will be omitted.

FIG. 5 shows a second embodiment of the present invention, in which a rough surface 20 is formed along the outer periphery of one main surface of the support substrate 1. As shown in FIG. The rough surface 20 is formed by mechanical processing such as sandblasting, wet or dry etching, or the like. Then, a first resin layer (not shown) is formed on one main surface of the support substrate 1 including the rough surface 20.

FIG. 6 shows a third embodiment of the present invention, in which the first resin layer 3 extends from one main surface of the support substrate 1 to the other main surface of the support substrate 1 via the side surface. It is formed.

FIG. 7 shows a fourth embodiment of the present invention, in which a rough surface 30 is formed on the side surface of the support substrate 1. The rough surface 30 is formed by cutting out the support substrate 1 made of glass or the like from a large substrate, and then leaving the end surface untreated. Similarly to the third embodiment, the first resin layer 3 is formed so as to extend slightly from one main surface of the support substrate 1 to the other main surface of the support substrate 1 via the rough side surface 30.

FIG. 8 shows a fifth embodiment of the present invention, in which a frame-shaped groove 40 is formed along the outer periphery of one main surface of the support substrate 1.
, and the first resin layer 3 is formed on the supporting substrate 1 including the groove 40.

FIG. 9 shows a sixth embodiment of the present invention, in which the first resin layer 3 is formed on one main surface of the support substrate 1, and then the outer periphery of the first resin layer 3 is A heat treatment line 50 is drawn along the line. The heat treatment line 50 is formed by irradiating the first resin layer 3 with a laser beam or applying a hot press to an extent that the first resin layer 3 is not melted and removed.

FIG. 10 shows a seventh embodiment of the present invention, in which after forming the first resin layer 3 on one main surface of the support substrate 1, the outer periphery of the first resin layer 3 is coated. The irradiation line 60 is drawn by irradiating ultraviolet rays along the line.

FIG. 11 shows an eighth embodiment of the present invention, in which the first resin layer 3 is formed on one main surface of the support substrate 1, and then the outer periphery of the first resin layer 3 is It is fixed by a frame-shaped fixture 70 that clamps and fixes it together with the outer periphery of 1.

With the rough surface 20, the wrap-around formation of the first resin layer 3, the rough surface 30, the groove 40, the heat treatment line 50, the ultraviolet irradiation line 60, and the fixture 70 in the second to eighth embodiments described above, The adhesion between the support substrate 1 and the first resin layer 3 formed on the upper surface thereof is stronger at a position surrounding the photovoltaic device 10 to be peeled off from the support substrate 1 than at other parts.

Each of the first to eighth embodiments described above may not only be implemented alone, but may also be combined as appropriate.

[0030] Furthermore, the adhesive layer 2 in each of the above embodiments,
The rough surface 20 , the wrap-around formation of the first resin layer 3 , the rough surface 30 , the groove 40 , the heat treatment line 50 , the ultraviolet treatment line 60 , and the fixture 70 are the photovoltaic device 1 to be peeled off from the support substrate 1 .
It does not need to be provided continuously so as to completely surround the 0 portion, but may be provided partially at a position surrounding the photovoltaic device 10. In short, these may be provided so that the adhesion between the first resin layer 3 and the support substrate 1 is stronger in at least a portion of the position surrounding the photovoltaic device 10 than in other portions.

[0031]

Effects of the Invention The present invention provides a photoelectric conversion element comprising a laminate of an insulating and flexible first resin layer, a first electrode, a thin film semiconductor layer, and a second electrode on the upper surface of a support substrate; In a method for manufacturing a photovoltaic device, the first resin layer is peeled from the supporting substrate after at least sequentially laminating the following:
Since the adhesion between the first resin layer and the support substrate is made stronger in at least a portion of the position surrounding the photovoltaic device to be peeled off from the support substrate than in other portions, it is possible to Since the first resin layer around the photoelectric conversion element is tightly adhered to the support substrate, the first resin layer does not peel off from the support substrate, and the formation of the photoelectric conversion element is performed without any problem, and the photoelectric conversion element is After the photovoltaic device is completed, the photovoltaic device can be easily peeled off from the support substrate, thereby simplifying the manufacturing process of a flexible photovoltaic device.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a first step of a manufacturing method according to a first embodiment of the present invention.

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a sectional view showing the second step of the manufacturing method according to the first embodiment of the present invention.

FIG. 4 is a sectional view showing the third step of the manufacturing method according to the first embodiment of the present invention.

FIG. 5 is a top view showing a second embodiment of the present invention.

FIG. 6 is a sectional view showing a third embodiment of the present invention.

FIG. 7 is a sectional view showing a fourth embodiment of the present invention.

FIG. 8 is a sectional view showing a fifth embodiment of the present invention.

FIG. 9 is a top view showing a sixth embodiment of the present invention.

FIG. 10 is a top view showing a seventh embodiment of the present invention.

FIG. 11 is a sectional view showing an eighth embodiment of the present invention.

Claims (9)

[Claims] 1. A first insulating and flexible resin layer, a photoelectric conversion element made of a laminate of a first electrode, a thin film semiconductor layer, and a second electrode are laminated, at least in sequence, on the upper surface of a support substrate. In the method for manufacturing a photovoltaic device, the first resin layer is peeled off from the support substrate after forming the first resin layer in at least a portion of a position surrounding a portion of the photovoltaic device to be peeled off from the support substrate. A method for manufacturing a photovoltaic device, characterized in that the adhesion to the support substrate is made stronger than other parts. 2. A strong adhesive force is applied to both the support substrate and the first resin layer on at least a portion of the upper surface of the support substrate at a position surrounding the portion of the photovoltaic device to be peeled off from the support substrate. Claim 1 characterized in that the adhesion is strengthened by forming an adhesive layer shown in the figure.
A method of manufacturing the photovoltaic device described. 3. The adhesion force is strengthened by forming a rough surface on at least a portion of the upper surface of the support substrate at a position surrounding the portion of the photovoltaic device to be peeled off from the support substrate. A method for manufacturing a photovoltaic device according to claim 1. 4. The method of manufacturing a photovoltaic device according to claim 1, wherein the adhesion is strengthened by forming the first resin layer from the upper surface to the side surface of the support substrate. 5. The adhesion is strengthened by forming a rough surface on at least a portion of the side surface of the support substrate, and forming the first resin layer from the top surface to the side surface of the support substrate. A method for manufacturing a photovoltaic device according to claim 4. 6. A claim characterized in that the adhesion is strengthened by forming a groove in at least a portion of the upper surface of the support substrate at a position surrounding the portion of the photovoltaic device to be peeled off from the support substrate. Item 1. A method for manufacturing a photovoltaic device according to item 1. 7. After forming the first resin layer on the upper surface of the support substrate, heat-treating the first resin layer in at least a portion of a position surrounding a portion of the photovoltaic device to be peeled off from the support substrate. 2. The method of manufacturing a photovoltaic device according to claim 1, wherein the adhesion is strengthened by: 8. After forming the first resin layer on the upper surface of the support substrate, ultraviolet rays are irradiated to the first resin layer in at least a portion of a position surrounding a portion of the photovoltaic device to be peeled off from the support substrate. 2. The method of manufacturing a photovoltaic device according to claim 1, wherein the adhesion is strengthened by: 9. After forming the first resin layer on the upper surface of the support substrate, use a fixture to remove the first resin layer in at least a portion of the position surrounding the photovoltaic device portion to be peeled off from the support substrate. 2. The method of manufacturing a photovoltaic device according to claim 1, wherein the adhesion is strengthened by fixing.