JP2007258428A - Method for manufacturing optoelectric transducer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an optoelectric transducer obtaining a plurality of resin boards from one resin board without deteriorating the efficiency of a photoelectric conversion. <P>SOLUTION: In the manufacturing method for the optoelectric transducer, optoelectric transducer elements are formed on the resin board fixed onto a support board and the optoelectric transducer is obtained by removing the support board. The manufacturing method has a process successively laminating and arranging a first adhesive layer with a smoothed surface, a protective film composed of a resin film, and a second adhesive layer with the smoothed surface from the surface of the support board; the process sticking the resin board on the surface of the second adhesive layer; and the process forming a plurality of the optoelectric transducer elements on the resin board. The manufacturing method further has the process separating optoelectric transducer element pieces and support board pieces, while using an interface between the first adhesive layer and the protective film as a boundary; the process cutting the protective film and the second adhesive layer in conformity with the desired shapes of a plurality of the optoelectric transducer elements in the optoelectric transducer element pieces; and the process separating the optoelectric transducer from the optoelectric transducer element pieces. Such a manufacturing method is adopted. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  In manufacturing a photoelectric conversion device in which a photoelectric conversion layer is formed after fixing a resin substrate on a support substrate, the present invention provides a plurality of photoelectric conversion devices from a single resin substrate without reducing the photoelectric conversion efficiency. It is related with the manufacturing method of the photoelectric conversion apparatus which can obtain simultaneously.

  A photoelectric conversion device in which a photoelectric conversion layer made of an amorphous silicon film is formed on a resin substrate is lighter, thinner, and more flexible than those formed using a glass substrate or a metal substrate. It is used for small portable devices such as wristwatches by taking advantage of this characteristic.

  Since such a photoelectric conversion device has a photoelectric conversion layer constituting the device, a transparent electrode layer sandwiching the photoelectric conversion layer, and a back electrode layer, each layer must be formed while heat-treating each layer. Then, the manufacturing method based on this heat processing is proposed (for example, refer patent document 1).

  FIG. 3 is a drawing showing a conventional manufacturing process. FIG. 3 (a) shows an adhesive layer 2 having a predetermined softness after curing and having a smooth surface in an uncured state, and then completely cured and supported via the adhesion layer 2. The process of affixing the resin substrate 4 on the substrate 1 is shown. FIG.3 (b) is drawing which shows the process of forming a photoelectric conversion element in the structure obtained by Fig.3 (a), FIG.3 (c) is from the structure obtained by FIG.3 (b). It is drawing which shows the process of obtaining the target photoelectric conversion apparatus.

  First, liquid silicone rubber is applied on the support substrate 1 to a thickness of about 50 μm using a spin coater, and then heated in a dry oven set at 200 ° C. for 60 minutes to completely cure the silicone rubber. Then, the adhesion layer 2 firmly fixed to the support substrate 1 is formed.

  Next, when the film-like resin substrate 4 is gradually attached to the adhesion layer 2 from the end of the support substrate 1, air is pushed out from the interface between the resin substrate 4 and the adhesion layer 2, and the interface is almost vacuumed. Become close. Then, in order to completely remove still remaining air, the support substrate 1 is heated in vacuum to perform a deaeration process. Then, the resin substrate 4 and the adhesion layer 2 are adhered to each other and fixed to the support substrate 1.

  Further, as shown in FIG. 3B, a transparent electrode layer 5, a photoelectric conversion layer 6 made of an amorphous silicon film, and a back electrode layer 7 are sequentially laminated on the surface of the resin substrate 4 to form a photoelectric conversion element 8. . Then, the surface of the photoelectric conversion element 8 is covered with a protective film 9.

For the formation of the amorphous silicon film to be the photoelectric conversion layer 6, a plasma CVD method is generally used. The source gas is decomposed by plasma generated in the CVD apparatus, and the amorphous silicon film is formed in the order of P-type, I-type, and N-type. Laminate. P-type amorphous silicon film is silane (SiH
₄ ) Gas and diborane (B ₂ H ₆ ) gas, SiH ₄ gas for the I-type amorphous silicon film, and SiH ₄ gas and phosphine (PH ₃ ) gas for the N-type amorphous silicon film are introduced into the apparatus. Form. In order to form a high-quality amorphous silicon film in this film forming process, it is essential to form the film at a substrate temperature of 150 ° C. or higher in the CVD apparatus.

Finally, as shown in FIG. 3C, an adhesive tape (not shown) is attached to the end of the resin substrate 4 and peeled off from the end of the resin substrate 4 using the adhesive tape as a fulcrum. If the air is allowed to enter the interface with the resin 4, the resin substrate 4 can be easily separated from the support substrate 1, and the photoelectric conversion device 13 can be manufactured.

  Thus, in the conventional manufacturing method, the resin substrate 4 and the support substrate 1 are firmly adhered by vacuum adsorption through the completely cured adhesion layer 2 using silicone rubber. When the heat treatment is performed in the manufacturing process 8, the resin substrate 4 can be prevented from being separated from the support substrate 1 as much as possible even if stress due to the difference in linear expansion coefficient between the two substrates is applied to the resin substrate 4. . In addition, after the adhesive layer 2 is provided on the support substrate 1, the resin substrate 4 is pasted after being completely cured, so that no outgas is generated from the adhesive layer 2 when the photoelectric conversion layer 6 is formed. It is possible to prevent deterioration of the film quality of the photoelectric conversion element layer 6. Further, since the support substrate 1 and the resin substrate 4 can be easily separated, not only can the manufacturing time in this process be greatly reduced, but also when the resin substrate 1 is attached, it can be attached again and again. .

Japanese Patent Laying-Open No. 2005-294807 (page 6-8, FIG. 1)

  However, the above-described conventional manufacturing method has the following problems when manufacturing a plurality of photoelectric conversion elements 8 on one resin substrate 4 at a time.

  In order to obtain individual photoelectric conversion devices 13 after separating the resin substrate 4 on which the plurality of photoelectric conversion elements 8 are formed from the support substrate 1, each photoelectric conversion element 8 is cut for each resin substrate 4. A cutting process is required. First, in this cutting process, the resin substrate 4 on which the photoelectric conversion element 8 is not formed is placed on a jig (stage) of a cutting machine such as a press or a cutter, and the outer shape of the photoelectric conversion element 8 is adjusted. Therefore, it is necessary to adjust the position for cutting the resin substrate 4. During the position adjustment, the surface of the resin substrate 4 and a jig or the like may rub against each other, and the back surface of the resin substrate 4 on the light incident side of the photoelectric conversion element 8 may be damaged. Thus, when the back surface of the resin substrate 4 is scratched, the incident light incident on the photoelectric conversion element is scattered at that portion, and the amount of light incident on the photoelectric conversion layer 6 is reduced. As a result, the photoelectric conversion element manufactured in this way has a reduced photoelectric conversion amount.

  Accordingly, the present invention provides a method for manufacturing a photoelectric conversion device that can solve the above-described problems and that can simultaneously form a plurality of photoelectric conversion devices from a single resin substrate without reducing the photoelectric conversion efficiency. Objective.

  In order to achieve the above-described object, the photoelectric conversion device manufacturing method of the present invention basically employs the manufacturing method described below.

  That is, the photoelectric conversion device manufacturing method of the present invention is a method for manufacturing a photoelectric conversion device obtained by removing a support substrate after forming a photoelectric conversion element on a resin substrate fixed on the support substrate. , In order, a step of laminating and arranging a first adhesion layer whose surface is smoothed, a protective film made of a resin film, and a second adhesion layer whose surface is smoothed, and the surface of the second adhesion layer A step of affixing a resin substrate to the substrate, a step of forming a plurality of photoelectric conversion elements on the resin substrate, and a photoelectric conversion element piece and a supporting substrate piece at the interface between the first adhesion layer and the protective film, Separating the protective film and the second adhesive layer in accordance with the outer shape of the plurality of photoelectric conversion elements in the photoelectric conversion element piece, and separating the photoelectric conversion device from the photoelectric conversion element piece Including the step of It is an butterfly.

  Moreover, the manufacturing method of the photoelectric conversion device of the present invention is characterized in that both the first adhesion layer and the second adhesion layer described above are resin films formed of a silicone resin material.

  In addition, the method for manufacturing a photoelectric conversion device of the present invention supports the resin film in which the first adhesion layer and the second adhesion layer described above have a predetermined softness after curing and have a smooth surface in an uncured state. It is a film obtained by completely curing the resin film after it is formed on the substrate.

  Moreover, the manufacturing method of the photoelectric conversion device of the present invention includes a degassing treatment after a protective film is attached to the surface of the first adhesion layer and a resin substrate is attached to the surface of the second adhesion layer, respectively. It is characterized by performing.

  According to the method for manufacturing a photoelectric conversion device of the present invention, even when a plurality of photoelectric conversion devices are formed at the same time, scratches are generated on the surface of the resin substrate opposite to the surface on which the photoelectric conversion elements are formed. Absent. Therefore, in the manufacturing process of the photoelectric conversion device, scratches on the back surface of the resin substrate can be reduced as much as possible, and a photoelectric conversion device with high light utilization efficiency can be easily obtained.

  The method for producing a photoelectric conversion device of the present invention is a method for producing a photoelectric conversion device obtained by removing a support substrate after forming a photoelectric conversion element on a resin substrate fixed on the support substrate, in order from the surface of the support substrate. A step of laminating and arranging the first adhesion layer, the protective film, and the second adhesion layer, a step of attaching a resin substrate to the surface of the second adhesion layer, and a plurality of photoelectric conversion elements on the resin substrate Forming a step, separating the photoelectric conversion element piece and the supporting substrate piece from the interface between the first adhesion layer and the protective film, and the outer shape of the plurality of photoelectric conversion elements in the photoelectric conversion element piece In accordance with the manufacturing method, the method includes a step of individually cutting the protective film and the second adhesion layer, and a step of separating the photoelectric conversion device from the photoelectric conversion element piece. Hereinafter, embodiments of the present invention will be described in detail based on the drawings in the order of the steps shown above. In addition, about the same member used by the prior art, it attaches | subjects and demonstrates the same code | symbol.

  First, the manufacturing method of the photoelectric conversion apparatus of this invention is demonstrated according to process sectional drawing of FIG. FIG. 1A shows a step of laminating and arranging the first adhesion layer 2 a, the protective film 3, and the second adhesion layer 2 b in order from the surface of the support substrate 1.

  First, as shown in FIG. 1 (a), in the same manner as in the conventional process, a liquid having a cured rubber hardness of 20 to 50 (JIS A) is formed on the entire surface of one side of the glass support substrate 1. A silicone rubber (for example, product name: TSE3033, manufactured by GE Toshiba Silicones Co., Ltd.) is applied to a thickness of about 50 μm using a spin coater.

  Thereafter, the support substrate 1 coated with the liquid silicone rubber was put into a dry oven set at 200 ° C. and heated for 60 minutes to completely cure the silicone rubber, and was firmly fixed to the support substrate 1. The first adhesion layer 2a is formed.

  At this time, the surface of the first adhesion layer 2a needs to be formed smoothly. In this smoothing, when the protective film 3 is next attached onto the support substrate 1 via the first adhesive layer 2a, the protective film 3 and the first adhesive layer 2a are securely vacuum-adsorbed and fixed. It is necessary for.

If the 1st contact | adherence layer 2a is formed on the support substrate 1 as mentioned above, next, the protective film 3 will be affixed on the support substrate 1 through the 1st contact | adherence layer 2a. The material of the protective film 3 is not limited. However, the protective film 3 has flexibility, can withstand heating in the subsequent process of producing a photoelectric conversion element, and does not generate outgas that deteriorates the characteristics of the photoelectric conversion layer. It is important to satisfy this. For example, a polyethylene terephthalate substrate or a polyethylene substrate, which is the same material as the resin substrate used in the subsequent process, may be used. When the protective film 3 is gradually attached to the first adhesion layer 2a from the end of the support substrate 1, air is gradually pushed out from the interface between the protection film 3 and the first adhesion layer 2a, and the interface is almost the same. It becomes a state close to vacuum. Then, the protective film 3 and the first adhesion layer 2 a are in close contact with each other and are fixed to the support substrate 1.

  In addition, even if it fails to stick the protective film 3 at the time of sticking the protective film 3 to the 1st adhesion layer 2a, an adhesive tape is stuck on the edge part of the protective film 3, and this part is used as a fulcrum, and the protective film 3 It can be peeled off and pasted again at a desired position. Here, the protective film 3 can be reattached because the protective film 3 is a flexible film and is simply vacuum-adsorbed without an adhesive or the like at the interface between the protective film 3 and the adhesion layer 2a. This is because it is fixed.

  At this stage, a little air (not shown) still remains at the interface between the protective film 3 and the first adhesion layer 2a attached on the support substrate 1. Therefore, in order to completely remove the remaining air, the support substrate 1 is heated in vacuum to perform a deaeration process. Then, the remaining air escapes from the periphery of the substrate, and the protective film 3 and the first adhesion layer 2a can be firmly adhered (vacuum adsorption). This deaeration treatment can be performed only by creating a vacuum without heating, but it takes time to completely deaerate air from this interface. Therefore, this step is preferably performed by heating in vacuum.

  Next, the second adhesion layer 2b is formed on the protective film 3, and the same material and method as those used when the first adhesion layer 2a is formed on the support substrate 1 may be used. Specifically, after applying liquid silicone rubber on the protective film 3, the second adhesive layer 2 b is securely fixed to the protective film 3 by heating and curing.

  Also in this case, the surface of the second adhesion layer 2b needs to be formed smoothly. In the next step, the smoothing is performed by reliably vacuum-adsorbing the resin substrate and the second adhesion layer 2b when the resin substrate is attached to the support substrate 1 via the second adhesion layer 2b. Necessary for fixing.

FIG. 1B shows a process of attaching the resin substrate 4 on the second adhesion layer 2b.
When the first adhesion layer 2a, the protective film 3 and the second adhesion layer 2b are laminated on the support substrate 1 as described above, then, as shown in FIG. The resin substrate 4 is affixed on the support substrate 1 via the first adhesion layer 2a, the protective film 3, and the second adhesion layer 2b. When the resin substrate 4 is gradually attached to the second adhesion layer 2b from its end, air (not shown) is gradually pushed out from the interface between the resin substrate 4 and the second adhesion layer 2b, and the interface Is almost in a vacuum state. Then, the resin substrate 4 and the second adhesion layer 2 b are in close contact with each other and fixed to the support substrate 1.

  Further, as shown in FIGS. 1A and 1B, the method for manufacturing the solar cell device of the present invention includes the first adhesive layer 2a, the protective film 3 and the like so that the surface of the support substrate 1 is exposed. The size of the second adhesion layer 2b is made smaller than that of the support substrate 1, and the size of the resin substrate 4 is made smaller than that of the second adhesion layer 2b so that the surface of the second adhesion layer 2b is exposed. It is. That is, after the photoelectric conversion element is formed on the resin substrate 4, the process of separating the photoelectric conversion element pieces at the interface between the first adhesion layer 2a and the protective film 3, and the individually cut photoelectric conversion element pieces This is because, in the process of separating the photoelectric conversion device at the boundary between the second adhesive layer 2b and the resin substrate 4, the operation of attaching and peeling the adhesive tape to the end of each piece to be separated becomes easy.

  Even if the resin substrate 4 is missed when the resin substrate 4 is adhered to the second adhesion layer 2b, the end of the resin substrate 4 is the same as when the first adhesion layer 2a and the protective film 3 are adhered again. It is possible to stick an adhesive tape on the part, peel off the resin substrate 4 using this part as a fulcrum, and stick it again to a desired position.

  At this stage, a little air (not shown) still remains at the interface between the resin substrate 4 and the second adhesion layer 2 adhered on the support substrate 1. To deaerate.

Next, the process performed after this deaeration process is demonstrated. FIG. 1C shows a process of forming a plurality of photoelectric conversion elements 8 on the resin substrate 4.
As shown in FIG. 1C, a transparent electrode layer 5 such as ITO, a photoelectric conversion layer 6 made of an amorphous silicon film, and a back electrode layer 7 made of a reflective metal material such as Ti or Al are formed on the resin substrate 4. Are formed in a desired pattern in the same manner as in the conventional example to obtain a plurality of photoelectric conversion elements 8, and then the surface of the photoelectric conversion elements 8 is covered with a protective film 9. Although three photoelectric conversion elements 8 are illustrated in FIG. 1C, the number and pattern of the photoelectric conversion elements 8 can be changed as appropriate.

  Note that the silicone rubber used for the first adhesion layer 2a and the second adhesion layer 2b has excellent heat resistance, and in the above-described manufacturing process, even when the treatment is performed at a temperature from room temperature to 150 ° C. or higher, the composition decomposition and composition There is no denaturation. If a material satisfying this condition is used, the adhesion between the resin substrate 4 and the second adhesion layer 2b, the protective film 3 and the first adhesion layer 2a are maintained even after the step of forming the photoelectric conversion element 8.

Next, the process of separating the photoelectric conversion element piece 10 and the support substrate piece 11 will be described with reference to FIG.
Adhesive tape (not shown) is affixed to the end of the second adhesive layer 2b, and the photoelectric conversion element piece 10 is gradually put into the interface between the protective film 3 and the first adhesive layer using the adhesive tape as a fulcrum. Is separated from the support substrate piece 11. At this time, as described above, if the laminated portion of the first adhesion layer 2a, the protective film 3, and the second adhesion layer 2b is formed to be smaller than the support substrate 1, the photoelectric conversion element piece 10 and the support element are supported. The substrate piece 11 can be easily separated. The photoelectric conversion element piece 10 corresponds to an element piece including the protective film 3, the second adhesion layer 2 b, the resin substrate 4, the photoelectric conversion element 8 and the protective film 9. The support substrate piece 11 corresponds to a substrate piece composed of the support substrate 1 and the first adhesion layer 2a.

  Further, as shown in FIG. 2A, the photoelectric conversion element piece 10 is placed on a jig (stage) of a machine device for press cutting, and is adjusted to the outer shape of the photoelectric conversion element 8 by press cutting. The photoelectric conversion element piece 10 is divided into individual pieces (in the case of the present embodiment, three pieces) by cutting along the one-dot chain line.

  In this step, since the photoelectric conversion element piece 10 is cut in a state where the resin substrate 4 and the protective film 3 are firmly fixed via the adhesion layer 2b, the light incident surface 4a to the photoelectric conversion element 8 of the resin substrate 4 is cut. Will not be scratched.

FIG. 2B shows one of the individual photoelectric conversion element pieces 12 obtained by cutting the photoelectric conversion element piece 10 as described above.
Adhesive tape is applied to the ends of the photoelectric conversion element pieces 12 that are individually divided as described above, and the boundary between the second adhesion layer 2b and the resin substrate 4 is separated as shown in FIG. The intended photoelectric conversion device 13 is obtained. Since the protective film 3 fixed to the resin substrate 4 through the second adhesion layer 2b protects the light incident surface 4a of the resin substrate 4 until the previous step, the surface of the light incident surface 4a is scratched. There is no.

  As described above, according to the method for manufacturing a photoelectric conversion device of the present invention, a plurality of photoelectric conversion devices 13 can be simultaneously produced from the resin substrate 1 and the photoelectric conversion efficiency of each photoelectric conversion device 13 is lowered. It will not let you.

It is process sectional drawing which shows the manufacturing method of the photoelectric conversion apparatus of this invention. FIG. 2 is a process cross-sectional view illustrating a process continued from FIG. 1. It is process sectional drawing which shows the manufacturing method of the conventional photoelectric conversion apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support substrate 2 Adhesion layer 2a 1st adhesion layer 2b 2nd adhesion layer 3 Protective film 4 Resin substrate 4a Light incident surface 5 Transparent electrode layer 6 Photoelectric conversion layer 7 Back surface electrode layer 8 Photoelectric conversion element 9 Protective film 10 Photoelectric conversion Element piece 11 Support substrate piece 12 Photoelectric conversion element piece 13 Photoelectric conversion device

Claims (4)

In the method for producing a photoelectric conversion device obtained by removing the support substrate after forming the photoelectric conversion element on the resin substrate fixed on the support substrate,
In order from the surface of the support substrate, a step of laminating and arranging a first adhesion layer whose surface is smoothed, a protective film made of a resin film, and a second adhesion layer whose surface is smoothed;
Attaching the resin substrate to the surface of the second adhesion layer;
Forming a plurality of the photoelectric conversion elements on the resin substrate;
Separating the interface between the first adhesion layer and the protective film into a boundary between the photoelectric conversion element piece and the support substrate piece,
In accordance with the outer shape of the plurality of photoelectric conversion elements in the photoelectric conversion element piece, the step of individually cutting the protective film and the second adhesion layer,
Separating the photoelectric conversion device from the photoelectric conversion element piece;
A process for producing a photoelectric conversion device, comprising:   2. The method of manufacturing a photoelectric conversion device according to claim 1, wherein the first adhesion layer and the second adhesion layer are both resin films formed of a silicone resin material.   The first adhesion layer and the second adhesion layer are formed on the surface of the support substrate after forming a resin layer having a predetermined softness after curing and having a smooth surface in an uncured state. The method for producing a photoelectric conversion device according to claim 1, wherein the film is obtained by completely curing.   The deaeration treatment is performed after the protective film is pasted on the surface of the first adhesive layer and after the resin substrate is pasted on the surface of the second adhesive layer, respectively. The manufacturing method of the photoelectric conversion apparatus as described in any one of 1-3.

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