JPH04209502A - Manufacture of resistor - Google Patents

Abstract

PURPOSE:To prevent a resistor from cracking so as to obtain a low-resistance value resistor by repeating such a process by a plurality of times that a solution prepared by dissolving a compound structurally containing ruthenium and another compound containing titanium, manganese, and cobalt, in an organic solvent is baked after the solution is applied to the surface of an insulating substrate. CONSTITUTION:A compound containing ruthenium and either one of compound containing titanium and compound containing cobalt or the compound containing titanium and compound containing cobalt are dissolved in an organic solvent. Then a resistor 8 is formed by repeating such a process two or more times that the solution is baked after the solution is applied to underglaze glass and Ag-Pd electrodes 7 formed on an aluminum substrate 5. Therefore, a film having a thickness which does not allow the occurrence of cracks is formed and a low-resistance value resistor having an excellent noise characteristic can be obtained.

Description

[Detailed description of the invention]

[00011

[Industrial Field of Application] The present invention relates to a method for manufacturing resistors used in various electronic devices. [0002] Ruthenium oxide and its compounds are chemically stable, and resistors containing them as a main conductive component are widely used. Its structure is such that conductive particles are arranged in a mesh pattern in a matrix of insulating particles such as glass, and the resistance value is determined by changing the ratio of the two. This resistor can be manufactured at low cost by printing and firing, but due to its complicated structure as mentioned above, the noise characteristics are not stable over the entire range from 125 dB to 25 dB, and the metal film It is inferior to so-called thin film resistors using, for example, thin film resistors. [0003] Therefore, recently, as a low-cost resistor with excellent noise characteristics, solutions containing compounds containing ruthenium in the structure and other metal compounds to improve resistance temperature characteristics as main components have been used as substrates. It has been discovered that a resistor with good noise characteristics can be obtained by forming a metal oxide mixture on an insulating substrate by a so-called pyrolysis method, in which the metal oxide mixture is formed by coating and firing the metal oxide mixture on the insulating substrate. [00041] FIG. 2 is a sectional view of a square plate type fixed chip resistor, which is an example of a component using the resistor obtained in this manner. In FIG. 2, an underglaze glass 3 is formed on an insulating substrate 4, and this underglaze glass 3 is
Silver-palladium electrodes 2 are formed on both sides of the resistor 1, and a resistor 1 is formed on the underglaze glass 3 so that both ends partially overlap the silver-palladium electrodes 2. However, in FIG. 2, the overglaze glass for protecting the resistor is omitted. [0005]

[Problems to be Solved by the Invention] The resistor layer formed by the above method is composed of fine crystal grains, but in the composition for low resistance, the film thickness is increased to obtain a low resistance of 200 OA or more. When the thickness is set to , a film crack 1a occurs in the resistor 1 as shown in FIG. Therefore, there was a problem in that it was impossible to manufacture a resistor in a low resistance region, that is, a sheet resistance value of 10 to 200 ohm/sq. [0006] The object of the present invention is to eliminate the above-mentioned drawbacks and provide a method for manufacturing a resistor in the low resistance region with good noise characteristics. [0007]

[Means for Solving the Problems] In order to solve the above problems, the present invention provides a method for combining a compound containing ruthenium in its structure, a compound containing titanium, a compound containing manganese, and a compound containing cobalt in an organic solvent. Using a solution dissolved in
By repeating this process more than once, a resistor made of ruthenium oxide, any one of titanium oxide, manganese oxide, and cobalt oxide, or titanium oxide and cobalt oxide It is characterized by forming. [o o o 8]

According to the present invention, cracking of the resistor can be prevented by forming a film having a thickness that does not cause film cracking and stacking the films. Therefore, the film thickness increases, and a resistor in a low resistance region can be obtained. [0009]

[Embodiment] A method of manufacturing a resistor according to an embodiment of the present invention will be described below. [00101 (Example 1) For the paste shown in (Table 1), metal compounds 1 to 3 were mixed in the indicated composition ratio, and a total amount of 10 g was mixed and dissolved in 100 g of 4-methyl 2-pentanone to obtain a viscosity of 0.5 Pa-8. It was made into a coating liquid. [00111

[Table 1] [0012] Each sample was coated on a barium borosilicate glass (059 manufactured by Corning) substrate using a spin coater, dried, thermally decomposed in an electric furnace in the atmosphere, and baked to form a film. was formed. The firing temperature at this time was 700°C. Furthermore, a film was laminated on top of this film using the above coating liquid and the same procedure to form a resistor. However, for sample bait No. 1 to 5.16 to 20, the rotation speed of the spin coater is 3000 rotations, the number of laminated layers is 3, and 6 to 15.
The rotation speed was 2000 rpm and there were 4 layers. The film thickness and area resistance value of the resistor thus obtained are shown in Table 2. [0013] [Table 2] [0014] The substrates on which the resistors made using these sample pastes N011 to 20 were formed were cut into strips with a width of 0.8 mm using a diamond cutter, and a commercially available gold paste was cut into strips with a width of 0.8 mm. to form an electrode with a thickness of 1 μm or less using
A resistance value having a resistance size of mm×0.8 mm was created. Furthermore, a protective glass layer is provided by coating and baking a commercially available glass base on the surface of the resistor, and the gold electrode is nickel plated and soldered to reduce the current noise of these resistors.
Measured using a current noise measuring device manufactured by ) company. The applied voltage at this time was calculated using the rated power of the resistor as O and IW. The results are shown in Table 2. Since structural defects in the film such as cracks can be detected from the current noise value, the second
It is clear from the table that these resistors did not suffer from film cracking. [0015] Note that the sheet resistance value of the resistor can be changed by changing the firing temperature; when it is lowered, the resistance value decreases, and when it is raised, the resistance value increases. Furthermore, the film thickness of the obtained resistor changes depending on the concentration of the metal compound in the coating liquid and the viscosity of the coating liquid, and the sheet resistance value changes accordingly. [0016] As described above, the resistor of the present invention can achieve a wide range of resistance values by adjusting the chemical composition, film thickness, and processing temperature. However, in this example, a constant solution viscosity was used for all samples. Apply the coating liquid on the substrate,
Although the resistor was formed at a constant firing temperature, the desired resistance value can be obtained by appropriately selecting the above conditions. [00171 As described above, from the results of this example, it was found that the resistor of the present invention has very excellent noise characteristics even in the low resistance region. [0018] (Example 2) Next, an example of the pond of the present invention will be described. In the same manner as in Example 1, the metal compounds shown in Table 1 were mixed in the indicated composition ratio, and a total of 5 g was dissolved in 100 g of α-terpineol.
Dimerized rosin was added to this solution, and the mixture was heated under reflux at a temperature of 140° C. or higher to dissolve the dimerized rosin to prepare a paste. [00191 FIG. 1 shows a square plate type fixed chip resistor manufactured according to the present invention. In the figure, 5 is an insulating substrate, 6 is underglaze glass, 7 is a pair of @ poles, 8 is a resistor,
9 is overcoat glaze glass. A method of manufacturing this square temporary chip fixed resistor will be described below. 96% alumina substrate 5 with slits for division
A glass paste with a softening point of 750°C was screen-printed on top of the underglaze glass as an underglaze glass, and after baking at 900°C, a silver-palladium paste was applied as an electrode 7 on both ends of the underglaze glass 6 in the same manner as above for each sample paste N011. ~20 is screen printed, dried, and then pyrolyzed at 700°C in the atmosphere to form a film. Next, a film was laminated on this film by the same method using the above paste to form the resistor 8. However, the number of laminations, that is, the number of operations to form a film, depends on the sample paste No. 1 to **
3, 6-8. 11-13. 16-20 three times, No. 4, 9. 14 twice, No. 5.10.15 four times. Further, a protective underglaze glass 9 was formed on the upper surface of this resistor 8 by printing and firing, and finally it was divided and the end faces @poles were baked to produce the square plate type fixed chip resistor of this example. The same measurements as in Example 1 were carried out for each of these chip resistors, and the results of the film thickness of the resistor, the sheet resistance value, and the current noise of the resistor using the resistor are shown in (Table 3). [00201

[Table 3] [00211] From these results, it was found that a resistor having a sheet resistance value depending on the paste composition and film thickness could be obtained. Furthermore, all samples had good noise characteristics. The reason why the noise characteristics of the resistors manufactured according to Examples 1 and 2 are good as described above is that the film cracking 1a of the resistor 1 as shown in FIG. 2 does not occur. [0022] In this example, only a square plate type chip resistor is described as an example of the use of a resistor, but the paste produced in this example can be used to create hybrid ICs, resistance networks, RC networks, various variable resistors, etc. It can be used as a resistor of a thermal head, and a heating resistor of a thermal head, and these elements can have performance equivalent to that of the above-mentioned chip resistor. [0023] As described above, according to the present invention, a multilayered ruthenium oxide, and any one of a titanium oxide, a manganese oxide, and a cobalt oxide. Alternatively, by creating a resistor made of titanium oxide and cobalt oxide, it is possible to create a resistor with excellent noise characteristics in the low resistance region, and its effects on production are significant. be.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a square plate type fixed chip resistor using a method for manufacturing a resistor according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a resistor according to the prior art.

[Explanation of symbols]

5 Insulating substrate 6 Underglaze glass 7 Silver-palladium electrode 8 Resistor 9 Overglaze glass

Claims (1)

[Claims] Claim 1: A compound containing ruthenium in its structure;
Using a solution in which one of a titanium-containing compound, a manganese-containing compound, and a cobalt-containing compound, or a titanium-containing compound and a cobalt-containing compound are dissolved in an organic solvent, this solution is dissolved. By repeating the operation of coating and firing on an insulating substrate twice or more, ruthenium oxide, and one of titanium oxide, manganese oxide, and cobalt oxide,
Alternatively, a method for manufacturing a resistor, comprising forming a resistor made of a titanium oxide and a cobalt oxide.