JPH042069U - - Google Patents
Info
- Publication number
- JPH042069U JPH042069U JP4229790U JP4229790U JPH042069U JP H042069 U JPH042069 U JP H042069U JP 4229790 U JP4229790 U JP 4229790U JP 4229790 U JP4229790 U JP 4229790U JP H042069 U JPH042069 U JP H042069U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- printed wiring
- paste
- insulating substrate
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4229790U JPH042069U (cs) | 1990-04-20 | 1990-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4229790U JPH042069U (cs) | 1990-04-20 | 1990-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042069U true JPH042069U (cs) | 1992-01-09 |
Family
ID=31553720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4229790U Pending JPH042069U (cs) | 1990-04-20 | 1990-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042069U (cs) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01107563A (ja) * | 1987-10-20 | 1989-04-25 | Cmk Corp | プリント配線板におけるチップ部品の実装方法 |
| JPH01290292A (ja) * | 1988-05-18 | 1989-11-22 | Abisare:Kk | 封止剤の流出防止堰を有する導電回路基板 |
-
1990
- 1990-04-20 JP JP4229790U patent/JPH042069U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01107563A (ja) * | 1987-10-20 | 1989-04-25 | Cmk Corp | プリント配線板におけるチップ部品の実装方法 |
| JPH01290292A (ja) * | 1988-05-18 | 1989-11-22 | Abisare:Kk | 封止剤の流出防止堰を有する導電回路基板 |