JPH04206929A - Separate surface plate for wafer polishing - Google Patents
Separate surface plate for wafer polishingInfo
- Publication number
- JPH04206929A JPH04206929A JP2338595A JP33859590A JPH04206929A JP H04206929 A JPH04206929 A JP H04206929A JP 2338595 A JP2338595 A JP 2338595A JP 33859590 A JP33859590 A JP 33859590A JP H04206929 A JPH04206929 A JP H04206929A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- ceramic surface
- supporting tool
- ceramic
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 33
- 239000004744 fabric Substances 0.000 abstract description 8
- 238000007514 turning Methods 0.000 abstract description 2
- 230000037431 insertion Effects 0.000 abstract 3
- 238000003780 insertion Methods 0.000 abstract 3
- 238000009434 installation Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、シリコン・ウェーハのポリシンノア加工で使
用されろボリシング用定盛に係わり、特に非金属製の新
規なセパレート型定盤に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a boring plate used in the polishing process of silicon wafers, and more particularly to a new separate-type surface plate made of non-metallic material.
［従来の技術］
従来、ポリシンク用定盤は黄銅製が多く使用され、その
ポリシンク面に研磨布を貼り付けてシリコンウェーハの
ポリシンク加工に供されていた。[Prior Art] Conventionally, a surface plate for polysinking is often made of brass, and a polishing cloth is attached to the surface of the polysinking plate for polysinking silicon wafers.
このように、高水準平面度のポリシンク面を加工可能な
黄銅なとの金属材料で強固な定盤ヘースを製造し、ポリ
シンク平面には研磨布を貼り１１けるなとの方法で研磨
部か形成されたポリシンク用定盤は、これを所定の駆動
装置に固定する手段として、駆動回転平行度の安定１＾
持に実績のある金属ボルトなどを使う糾み付は式となっ
ているのが通常であった。In this way, a strong surface plate head is manufactured from a metal material such as brass that can process a polysink surface with a high level of flatness, and a polishing cloth is applied to the polysink surface and a polished part is formed using a method that does not cut. The surface plate for polysink that has been developed is used as a means of fixing it to a predetermined drive device to stabilize the drive rotational parallelism 1^
It was normal to use a formula for tacking using metal bolts, which have a proven track record.
［発明か解決しようとする問題点］
黄銅なとの金属製定盤におけるレベル出し、研磨布貼り
替えなとの困難性は当該技術分野でよく知られる通りで
あり、また金属材料を使う以上研磨中の熱変形の問題か
未解決の４：ま（」随するから、このような不合理と欠
点の解消を本発明の目的とする。[Problem to be solved by the invention] It is well known in the technical field that it is difficult to level the metal surface plate of brass and to replace the polishing cloth. The problem of thermal deformation remains unsolved. Therefore, it is an object of the present invention to eliminate such unreasonableness and drawbacks.
詳しくは、熱膨張か大きれは定盤の平坦度に及ぼす影響
が大きく、この影響を見込んで行う定盤のレノベル出し
には相当な熟練を要するばかりてなく、熱歪によって平
坦度が基準に合わなくなると研磨布の交換とレヘル出し
の再作業のために団磨工稈ラインの作業中断を余儀なく
されて生産性のマイナスを招いていたから、このような
欠点の原因となっている技術的不合理を是正解消する。In detail, the degree of thermal expansion has a large effect on the flatness of the surface plate, and not only does it require considerable skill to level the surface plate in consideration of this effect, but also the flatness is not the standard due to thermal distortion. If the polishing cloth did not match, the work on the danma culm line had to be interrupted to replace the polishing cloth and rework the leveling process, resulting in a loss of productivity.Therefore, the technical irrationality that caused such shortcomings was inevitable. Correct and resolve.
［問題点を解決するだめの手段］
本発明は、高水準な平面度、加工中に高水準平泪度を保
持する剛性、そして回転平行度を出すための駆動装置へ
の調整可能な取り１１け固定手段まで、これら不可欠の
定盤３要件を満足させる新規なポリシンク用定盤を構成
するものであって、セラミック製定盤１ど、ターンテー
ブル２と、該ターンテーブル２の上面に形成する少なく
とも３箇所の支持具装着部２ａと、上記セラミック製定
盤１の下面に形成する少なくとも；３箇所の支持具嵌合
部１ａと、前記支持具装着部２ａにそれぞれ高さ調整可
能に取り付けられ上部が前記支持具嵌合部１ａと嵌合す
る調整支持具：３とを有するウェーハ・ポリシング用セ
パレート定盤である。[Means for Solving the Problems] The present invention provides a high level of flatness, rigidity to maintain a high level of flatness during machining, and an adjustable mechanism 11 to the drive device for achieving rotational parallelism. This constitutes a new polysink surface plate that satisfies these essential surface plate 3 requirements, including the ceramic surface plate 1, the turntable 2, and at least the ceramic surface plate 2 formed on the top surface of the turntable 2. Three support mounting parts 2a and at least three support fitting parts 1a formed on the lower surface of the ceramic surface plate 1, each of which is height-adjustably attached to the support mounting part 2a; This is a separate surface plate for wafer polishing, which has the support fitting part 1a and an adjustment support fitting 3.
セラミック製定盤１の材質、例えば、アルミナ質セラミ
ックについてその原ｔオ利の改質技術とその焼成プロセ
スの制御技術の両面検討の結果、定盤として要求されろ
高水準な平面加］二か可能であり、この３要件の１つの
充足に１にって、セラミックの優れた硬質性とともに相
対的ここ小さな熱膨張性がウェーハのポリシンク用定盤
として新規な特質を持つ定盤となることを見出した。As a result of examining the material of the ceramic surface plate 1, for example, the alumina ceramic, both the original modification technology and the control technology of the firing process revealed that there are two possible high-level flat surfaces required for the surface plate. By satisfying one of these three requirements, we discovered that ceramic's excellent hardness and relatively small thermal expansion make it a surface plate with new characteristics as a surface plate for wafer polysinks. Ta.
［作用］
高精度加工でポリシンクに必要な平面度をｌｌ１ｉｌえ
たセラミック製定盤１は、セラミ・ング特有の硬質性と
小さな熱膨張性により従来のような熱歪の影響を受けな
い優れた定盤平坦度を保持する新規な機能を有して」二
記：３要件の２つ目を充足する。[Function] Ceramic surface plate 1, which has achieved the flatness required for polysink through high-precision processing, is an excellent surface plate that is not affected by conventional thermal distortion due to the hardness and small thermal expansion characteristic of ceramics. It has a new function of maintaining flatness and satisfies the second of the requirements in Section 2:3.
一方、ターンテーブル゛２の支持具装着部２ａに設ける
調整支持具３と支持具嵌合部１ａを介して着脱可能に絹
付けられる該セラミック製定盤ｌは、熱膨張が小さくな
った分容易ζこなった調整支持具３の自在な調整で能率
よく正確に回転平行度を設定できる機能を有して上記３
要件の３つ目を充足し、交換・調整ロスか少なく生産性
を引き−１−げ得た該定盤は」二記定盤の不可欠３要件
に相当する所要機能を全て備える新規定盤となっている
。On the other hand, the ceramic surface plate 1, which is removably attached to the adjustment support 3 provided on the support mounting part 2a of the turntable 2 through the support fitting part 1a, is easy to use due to its small thermal expansion. It has the function of efficiently and accurately setting rotational parallelism by freely adjusting the adjustable adjustment support 3.
This surface plate, which satisfies the third requirement and achieves productivity with less replacement and adjustment loss, is a new standard board that has all the necessary functions corresponding to the three essential requirements for a surface plate. It has become.
特に、調整支持具３については、セラミック製定盤の硬
質性と形状の熱的安定性の優れた特質を合理的に活用す
ることで、その構造を簡潔にすることができ、例えばマ
イクロネジで微妙な高さ調整を可能にすると云う簡易構
造で該調整支持具；３を構成するメリットを有し、また
その所要数も最少の３制とするいわゆる二３点支持型の
調整機構とする大きなメリットを有する。即ち、本発明
の実施例の１つは、取外し自由な高さ微調整機構のつい
た７３点支持型のウェーハ・ポリシング用セパレート定
盤である。In particular, with regard to the adjustment support 3, the structure can be simplified by rationally utilizing the excellent characteristics of the hardness of the ceramic surface plate and the thermal stability of its shape. The adjustment support has the advantage of having a simple structure of 3, which makes it possible to adjust the height, and the great advantage of having a so-called 23-point support type adjustment mechanism with the minimum number of 3 systems required. has. That is, one embodiment of the present invention is a 73-point support type separate surface plate for wafer polishing that is equipped with a removable height fine adjustment mechanism.
［実施例コ
図面はこの３点支持型のセパレート定盤Ｉを示し、その
裏面には支持具嵌合部１ａが相互等間隔て３箇所形成さ
れる。該セラミック製定盤１を回転させるターンテーブ
ル２は金属製でもよく、その」二面には上記支持具嵌合
部１ａに対応する支持具装着部２ａがマイクロ雄ネジと
して形成される。[The drawing of the embodiment shows this three-point support type separate surface plate I, on the back surface of which support fitting portions 1a are formed at three locations equally spaced from each other. The turntable 2 for rotating the ceramic surface plate 1 may be made of metal, and a support fitting part 2a corresponding to the support fitting part 1a is formed as a micro male thread on its two surfaces.
＝５−
調整支持具３は、マイクロ雄ネジ：３Ｃと、上記セラミ
ック製定盤１を受承するフランジ３ ｂと、嵌入ボス３
ａを有する。=5- The adjustment support 3 includes a micro male screw: 3C, a flange 3b that receives the ceramic surface plate 1, and a fitting boss 3.
It has a.
支持！″！−装着部２ａのマイクロＩＩ！ｌネジにマイ
クロ雄ネジ：３ｃを螺合した調整支持４１３の嵌入ボス
３ａを支持具嵌合部１ａに嵌着した時、フランジ；３ｂ
がセラミック製定盤１の回転平行度を確定する。support! ″!-When the fitting boss 3a of the adjustment support 413, in which the micro male screw 3c is screwed into the micro II!l screw of the mounting portion 2a, is fitted into the support fitting portion 1a, the flange; 3b
determines the rotational parallelism of the ceramic surface plate 1.
このためのセラミック製定盤１の各点高さの微調整は、
フランジ３ｈを回してマイクロ雄ネジ３Ｃの深さを変え
て行う。フランジ；３１〕の高さが高精度に一致すれば
、これに受承されるセラミック製定盤１０回転平行度を
所要水準に塚持可能となる。Fine adjustment of the height of each point of the ceramic surface plate 1 for this purpose is as follows:
This is done by turning the flange 3h to change the depth of the micro male screw 3C. If the heights of the flanges (31) match with high accuracy, it becomes possible to maintain the 10-turn parallelism of the ceramic surface plate to the required level.
上記構成による３点支持機構に従って、セラミック製定
盤１は嵌入ボス３ａから抜き取るだけで容易に収外しが
でき、セラミック製定盤１の研磨布張替え作業のための
取外し作業は能率よく極く簡便に行える。According to the three-point support mechanism with the above configuration, the ceramic surface plate 1 can be easily removed by simply pulling it out from the fitting boss 3a, and the removal work for replacing the polishing cloth of the ceramic surface plate 1 can be performed efficiently and extremely easily. .
このように高度に簡便・簡潔化された新規なつ工−ハ・
ポリシンク用セパレート定盤は、定盤を熱膨張が小さく
、優れた硬質性をもつセラミックて製作した点にあり、
従来に比へ相当に小さく抑えられる定盤の熱膨張は嵌入
ボス；３ａ相互間に及ぼす熱歪ないし妨応力を小さく規
制して定盤精度のＩＥいを所要限度内に的確に収めるこ
とかできる。This is a highly simplified and simplified new summer technique.
The separate surface plate for Polysink is made of ceramic, which has low thermal expansion and excellent hardness.
Thermal expansion of the surface plate, which can be suppressed to a considerably smaller level than in the past, can be controlled to a small level by reducing the thermal distortion or disturbing stress exerted between the fitting bosses and 3a, making it possible to precisely keep the IE of the surface plate accuracy within the required limit. .
しかも、この定盤の特質は、調整支持具：３の構造を簡
潔化するための決め手となり、従来の定盤とターンテー
ブルとの間の堅牢な結合機構を抜本的に簡易化するため
の斬新な技術ベースとなる重要なポイントでもある。Moreover, the characteristics of this surface plate were the deciding factor for simplifying the structure of the adjustment support 3, and were a novel feature that drastically simplified the conventional robust coupling mechanism between the surface plate and the turntable. This is also an important point that will form the basis of this technology.
さらに、ボリシング工程を自動化システムとする場合、
この定盤の特質はその斬新な重要性が一層明らかとなる
。即ち、研石布の張替え作業の能率がその自動システム
の生産性を実質的に決めるため、セラミック製定盤１の
取外しと再取り付けを能率よく自由に行い得る本発明の
ウェーハ・ホリシンク用セパレート定盤は、この点て、
従来予期できなかった優れた特徴となる。Furthermore, if the borising process is automated,
The uniqueness of this surface plate makes its innovative importance even more apparent. That is, since the efficiency of the polishing cloth re-covering work substantially determines the productivity of the automatic system, the separate surface plate for wafer honing of the present invention allows the ceramic surface plate 1 to be efficiently and freely removed and reattached. Regarding this point,
This is an excellent feature that could not have been predicted before.
［発明の効果］
シリコンウェーハの急激な需要増加に応えるために、増
産のネックとなっていた素材処理段階に属するウェーハ
・ボリシンク工程のボリシング用定盤を根本的に刷新す
る本発明は、従来の黄銅なとの金属製定盤が解決できな
かった熱歪問題を、セラミックを定盤とすることでその
相対的に小さな熱膨張率により当該熱歪問題を根本的に
解決し、従来困難な作業となっていた定盤の取外し作業
とこれに伴うレヘル出し作業を優れた能率で実行可能と
するとともに、かかる作業を簡便とした結果生産性を大
幅に引き」−げて従来の増産ネックの解消を図ることが
できた。一方、熱歪問題を実質的に排除できたことによ
り、？、゛を来の定盤とターンテーブルとの間の強固な
結合機構を大幅に簡易化することかでき、定盤のトータ
ルコストの大幅な引下げに成功したばかりでなく、端的
には、定盤の回転平行度を確定する調整支持具３は従来
実現されなかった嵌合手段によってセラミック製定盤】
の支持具嵌合部１ａと嵌合結合できるようにし、この嵌
合手段を用いた簡易な結合機構に従って、セラミック製
定盤１のターンテーブル２からの取外し作業が該嵌合部
分における抜き外し操作で能率よく行い得る優れた合理
性を備えるものとなっている。[Effects of the Invention] In order to meet the rapidly increasing demand for silicon wafers, the present invention fundamentally renovates the borishing surface plate of the wafer borishing process, which belongs to the material processing stage, which has been a bottleneck to increased production. By using ceramic as a surface plate, its relatively small coefficient of thermal expansion fundamentally solves the problem of thermal distortion that could not be solved with metal surface plates such as brass, making the work difficult in the past. In addition to making it possible to perform the removal work of the surface plate and the accompanying leveling work with excellent efficiency, and by simplifying such work, productivity has been significantly increased and the conventional bottleneck in increasing production has been resolved. I was able to figure it out. On the other hand, by being able to virtually eliminate the thermal distortion problem? This not only greatly simplifies the strong coupling mechanism between the surface plate and the turntable, but also significantly reduces the total cost of the surface plate. Adjustment support 3 that determines the rotational parallelism of
According to a simple coupling mechanism using this fitting means, the removal operation of the ceramic surface plate 1 from the turntable 2 is performed by a removal operation at the fitting portion. It has excellent rationality that allows it to be carried out efficiently.
図面は本発明の一実施例であるセラミック製定盤とター
ンテーブルとを分離して示す一部断面斜視図である。
ｌ：セラミック製定盤
ｌａ：支持具嵌合部
２：ターンテーブル
２ａ：支持具装着部
３：調整支持具
出願人 東芝セラミックス株式会社
−９＝
図面The drawing is a partially sectional perspective view showing a ceramic surface plate and a turntable separately, which are an embodiment of the present invention. l: Ceramic surface plate la: Support fitting part 2: Turntable 2a: Support mounting part 3: Adjustment support Applicant: Toshiba Ceramics Corporation -9= Drawing
Claims (1)
ターンテーブル２の上面に形成する少なくとも３箇所の
支持具装着部２ａと、上記セラミック製定盤１の下面に
形成する少なくとも３箇所の支持具嵌合部１ａと、前記
支持具装着部２ａにそれぞれ高さ調整可能に取り付けら
れ上部が前記支持具嵌合部１ａと嵌合する調整支持具３
とを有することを特徴とするウェーハ・ポリシング用セ
パレート定盤。(1) Ceramic surface plate 1, turntable 2, at least three support mounting portions 2a formed on the top surface of the turntable 2, and at least three supports formed on the bottom surface of the ceramic surface plate 1. an adjustment support 3 that is height-adjustably attached to the support fitting part 1a and the support fitting part 2a, and whose upper part fits into the support fitting part 1a;
A separate surface plate for wafer polishing, characterized in that it has:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33859590A JP2999547B2 (en) | 1990-11-30 | 1990-11-30 | Separate surface plate for wafer polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33859590A JP2999547B2 (en) | 1990-11-30 | 1990-11-30 | Separate surface plate for wafer polishing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04206929A true JPH04206929A (en) | 1992-07-28 |
| JP2999547B2 JP2999547B2 (en) | 2000-01-17 |
Family
ID=18319652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33859590A Expired - Fee Related JP2999547B2 (en) | 1990-11-30 | 1990-11-30 | Separate surface plate for wafer polishing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2999547B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5704827A (en) * | 1994-10-19 | 1998-01-06 | Ebara Corporation | Polishing apparatus including cloth cartridge connected to turntable |
| US6083083A (en) * | 1994-04-22 | 2000-07-04 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
-
1990
- 1990-11-30 JP JP33859590A patent/JP2999547B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6083083A (en) * | 1994-04-22 | 2000-07-04 | Kabushiki Kaisha Toshiba | Separation type grinding surface plate and grinding apparatus using same |
| US5704827A (en) * | 1994-10-19 | 1998-01-06 | Ebara Corporation | Polishing apparatus including cloth cartridge connected to turntable |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2999547B2 (en) | 2000-01-17 |
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