JPH04206652A - Socket for testing high frequency ic - Google Patents

Abstract

PURPOSE:To supply a power source having low noise to an IC to be measured by mounting a chip capacitor between a power terminal of a socket for testing the IC and a ground, and placing the IC thereon. CONSTITUTION:A chip type capacitor 13 is mounted between a power terminal and a ground terminal in a space 10-1 of the inner surface under a socket body 10 for testing an IC. When the IC 3 is placed on the body 10 mounted on a printed board 4, the capacitor 13 connected to the power terminal of the IC 3 inserted between the 2-1 and 2-2 of the contactor 2 of the socket is connected the ground without intermediary of a lead. As a result, high frequency noise on a power source line can be efficiently bypassed, and influence of high frequency to the power source line is reduced. Thus, power having low noise can be supplied to the IC to be measured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high frequency IC test socket.

[Conventional technology] Conventionally, burn-in I was used for functional testing of high-frequency ICs.
The DIP type (Dual I) shown in Fig. 5 is a C socket.
n Package) Burn-in socket (hereinafter DI
PIC socket) or SOP type (Sma
ll 0utline Package ) I was in trouble.

A plurality of contacts 2 are formed on both sides of the inner surface into which the terminals 3-1 and terminal openings 3-2 on both sides of the well-known DIP type IC 3 shown in FIG. 5A are inserted.
A socket body 1 made of a plastic material as shown in FIG. The contact piece 2 is formed from a contact opening 2-2, and the contact piece 2 is integrally formed as shown in FIG. 5C.
The terminal of the P-type IC3 is inserted.

The DIP type hahn insocket is mounted on the printed circuit board 4 as shown in FIG. 6, and the contact terminal 2'
A functional test of the IC3 mounted on the socket is performed via a signal line connected to the socket.

As shown in FIG. 9, there is a conventional example in which a space is provided on the lower surface of a DTP type burn-in socket, and a capacitor is mounted in the space or below the socket and below the printed circuit board.

[Problem to be solved by the invention] The test speed of IC testers used to be around 30 MHz, but now it is extremely fast, reaching 60-100 MHz. Leaf-type contactors have the disadvantage that impedance matching is not performed, so the signal reflection phenomenon is large and the tester cannot achieve its original performance.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and provide a high-frequency IC testing socket that meets the performance of the tester, has less reflection, and has less noise in the power supply line and ground line.

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention connects a high-frequency IC test socket to a terminal of a mounted IC by connecting a signal line to a contact terminal of the test socket that contacts the terminal of the mounted IC. The invention according to claim 1, wherein a test socket for performing a test is configured by providing a space on the lower inner surface of the test socket main body and mounting a capacitor connected to a contact placed in the space, and the test socket. The invention of claim 2, in which a conductor for distributed capacitance is provided between the contacts of the test socket, and the invention of claim 1, in which a conductor for reinforcing the ground (hereinafter referred to as ground) is provided around and under the test socket body. The present invention is composed of the invention described in Section 2.

[Function] The invention of claim 1 configured as described above, when performing a high frequency function test of an IC using the test socket and throat,
Since the capacitor placed in the space is connected to the ground without passing through a lead wire, the high frequency components of the power line can be efficiently bypassed, which is effective in reducing the influence of high frequencies on the power line. Yes, claim 2
The invention has the effect of correctly transmitting signal information by suppressing the reflection phenomenon of signal waves due to impedance mismatch of signal lines by impedance matching when performing a functional test of an IC using the test socket. IC for conventional burn-in even if the burn-in is not complete
Unlike leaf-type contactors for sockets and handlers, it has distributed capacitance to reduce reflection loss.
Distortion of the transmitted signal is reduced and the reliability of the transmitted signal can be improved.The invention according to claim 3 allows connection to a ground with a large surface area at a short distance from the contact, thereby reducing the high frequency impedance of the ground and improving the reliability of the transmitted signal. Reliability can be improved, and by arbitrarily combining the inventions of each claim, the reliability of the high frequency function test can be further improved.

[Example] An embodiment of the present invention will be described with reference to the drawings.

Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a front view of an embodiment of the invention, Fig. 3 is a plan view of the invention, and Fig. 4 is a partially enlarged view of the embodiment of the invention. The cross-sectional view, FIG. 9, is data of an example of measurement of an IC according to an embodiment of the present invention.

In FIGS. 1 to 4, numeral 3 is a contact, 3 is an rc, and 4 is a printed circuit board, which are the same as in the conventional example. IC3 is a DIP type IC. Reference numeral 10 denotes a socket body, which is the same in external shape and dimensions as the conventional socket body 1 shown in FIG.
The sign has been changed because some structures have been changed. A conductor 11 forming a ground may be formed on the socket body 10 by electroless plating. Reference numeral 12 denotes a conductor port, which is provided in a recessed portion inside the socket body 1o in the central longitudinal direction. Reference numeral 10-1 is a space provided on the lower inner surface of the socket body 10, and a chip type capacitor 13 is mounted in the space 10-1 at a necessary location.

When the IC 3 is mounted on the IC testing socket mounted on the printed circuit board 4 and its terminal A and opening are inserted into the contact piece A 2-1 and the opening 2-2 of the contact I, the terminal 2' of the contact
The conductor 11 and the opening 12 are connected to the ground of the printed circuit board 4.

If a ground is provided between the terminals around the IC socket with the signal line of the contact 2' and the ground, a microstrip line is formed, and a strip line is formed when a ground is provided between the terminals and the area around the IC socket. Therefore, impedance matching of the signal line of the socket contact is possible.

If it is necessary to lower the impedance of the ground line, insert a conductor instead of the chip capacitor 13 at the position of the ground contact, and in addition to the ground connection through the terminal 2' of the contact 2, the ground contact 2' The ground can be strengthened, that is, the ground line can be strengthened by connecting the ground via the above-mentioned substitute conductor, or by deforming a part of the contact (not shown) and directly connecting it to the ground conductor provided in the socket. Low impedance is possible.

The case of DIP type socket has been explained above, but SO
The gist of the present invention can also be implemented with P-type sockets, leaf-type contactors, etc., and detailed explanation thereof will be omitted.

[Effects of the Invention] Since the present invention is configured as described above, the invention according to claim 1 has the effect of making it possible to supply power with less noise to the IC under test and improving the reliability of measurement results.

The invention of claim 2 reduces the reflection phenomenon caused by impedance mismatching of the signal line at the IC socket, thereby reducing signal distortion at the socket, thereby transmitting the signal from the tester to the IC under test more accurately. This has the effect of making high frequency measurements more accurate.

FIG. 10 is a comparison diagram showing measurement results according to an example of the present invention.

In FIG. 10, (2) is a conventional example (2) is an embodiment of the present invention (2) is an example in which (2) is further improved. This measurement was performed by TDR measurement. From the figure, it is clear that the amount of reflection at the IC socket is improved.

The invention of claim 3 has the effect of strengthening the ground of the IC to be measured to the vicinity of the contacts of the IC socket, and configuring the ground line of the IC socket as a ground line with low high frequency impedance.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a front view of an embodiment of the invention, Fig. 3 is a plan view of the invention, and Fig. 4 is a partially enlarged view of the embodiment of the invention. Cross-sectional view, Figure 5 is a conventional DI
A perspective view of a P-type burn-in socket, Fig. 6 is a partially cutaway side view of a DIP-type burn-in socket mounted on a printed circuit board, Fig. 7a is a front view of an SOP-type socket, and Fig. 7A is a SOP-type socket. Figure 8a is a front view of a leaf-type contactor for a handler, Figure 8a is a plan view of a leaf-type contactor for a handler, and Figure 9a is a conventional condenser installed in the lower space. FIG. 9 is a front view of a DIP type socket, FIG. 9 is a plan view of a conventional DIP type socket in which a capacitor is mounted in the lower surface space, and FIG. 10 is a comparison diagram showing measurement results according to an embodiment of the present invention. 1... Socket body, I... Contact, 2-1...
Contact piece A, 2-2...Contact piece mouth, 2'...Terminal, 3
...IC13-1...Terminal A, 3-2...Terminal opening, 4...Printed circuit board, 10...Socket body, 1
0-1... Chip type capacitor, 11... Conductor A, 12... Conductor opening, 13... Terminal portion, 14... Capacitor Perspective view of one embodiment of the present invention 1 Contactor No. 1 Figure 2': Contact terminal Front view of one embodiment of the present invention Figure 2 Plan view of one embodiment of the present invention Figure 3 = 2-1 Partially enlarged sectional view of the embodiment of the present invention Figure 4 1 Socket Figure 6. Perspective view of conventional DIP type burn-in socket. Figure 5. Figure 8.b. Figure 8. Q. Front view of sop type. Main body 311C 14 Capacitor 14-1 Lead Plan view of the DIP type Tsukukudo with a condenser installed in the conventional do surface space Figure 9 Figure 10

Claims (1)

[Claims] 1. In a test socket in which the function of the IC is tested by a signal line through the contact terminal of the test socket that contacts the terminal of the mounted IC, a space is provided on the lower inner surface of the test socket main body. A socket for high frequency IC testing, characterized in that the socket is provided with a capacitor connected to a contact disposed in the space. 2. The high frequency IC test socket according to claim 1, further comprising a conductor for distributed capacitance between the contacts of the test socket. 3. The high-frequency IC test socket according to claim 1 and claim 2, wherein a ground reinforcing conductor is provided around and on the lower surface of the test socket main body.