JPH042052U - - Google Patents
Info
- Publication number
- JPH042052U JPH042052U JP4296090U JP4296090U JPH042052U JP H042052 U JPH042052 U JP H042052U JP 4296090 U JP4296090 U JP 4296090U JP 4296090 U JP4296090 U JP 4296090U JP H042052 U JPH042052 U JP H042052U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- height
- view
- perspective
- upper edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図、第２図は本考案リードフレームの一つ
の実施例を説明するためのもので、第１図は斜視
図、第２図は端面図、第３図は本考案リードフレ
ームの収納に用いることのできる治具の斜視図、
第４図は本考案リードフレームの変形例の断面図
、第５図は従来のリードフレームの斜視図、第６
図は従来のリードフレームの収納に用いる専用マ
ガジンの斜視図、第７図Ａ，Ｂは考案が解決しよ
うとする問題点の説明図で、同図Ａは撓んだリー
ドフレームの側面図、同図Ｂは長さと撓み量の関
係図である。
符号の説明、１……リードフレーム、２……ダ
イパツト、３……リード、５……半導体素子、８
……折り曲げ部、Ｈ……折り曲げ部上縁のリード
フレーム表面からの高さ、ｈ……ワイヤのリード
フレーム表面からの高さ。
Figures 1 and 2 are for explaining one embodiment of the lead frame of the present invention. Figure 1 is a perspective view, Figure 2 is an end view, and Figure 3 is a view of how the lead frame of the present invention is stored. A perspective view of a jig that can be used,
Fig. 4 is a sectional view of a modified example of the lead frame of the present invention, Fig. 5 is a perspective view of a conventional lead frame, and Fig. 6 is a perspective view of a conventional lead frame.
The figure is a perspective view of a conventional dedicated magazine used for storing lead frames, Figures 7A and 7B are explanatory diagrams of the problems that the invention aims to solve, and Figure A is a side view of a bent lead frame. Figure B is a diagram showing the relationship between length and amount of deflection. Explanation of symbols, 1... Lead frame, 2... Die pad, 3... Lead, 5... Semiconductor element, 8
...Bending portion, H...Height of the upper edge of the bending portion from the lead frame surface, h...Height of the wire from the lead frame surface.
Claims (1)
角度折り曲げ、 上記折り曲げ部の上縁の高さをダイパツド部に
ボンデイングされる半導体素子の表面あるいは素
子とリードとを接続する接続部材のうちの最も高
い部分の高さよりも高くした ことを特徴とするリードフレーム。[Claim for Utility Model Registration] Both edges are bent toward one surface at an angle greater than 90 degrees, and the height of the upper edge of the bent portion is set to the surface of the semiconductor element to be bonded to the die pad, or the element and the leads. A lead frame characterized in that the height is higher than the height of the highest part of the connecting members to which the lead frame is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4296090U JPH042052U (en) | 1990-04-21 | 1990-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4296090U JPH042052U (en) | 1990-04-21 | 1990-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042052U true JPH042052U (en) | 1992-01-09 |
Family
ID=31554962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4296090U Pending JPH042052U (en) | 1990-04-21 | 1990-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042052U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545601A (en) * | 1978-09-26 | 1980-03-31 | Toyo Jozo Co Ltd | Long-acting cephalexin and its preparation |
| JPS57208166A (en) * | 1981-06-17 | 1982-12-21 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
-
1990
- 1990-04-21 JP JP4296090U patent/JPH042052U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545601A (en) * | 1978-09-26 | 1980-03-31 | Toyo Jozo Co Ltd | Long-acting cephalexin and its preparation |
| JPS57208166A (en) * | 1981-06-17 | 1982-12-21 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
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