JPH0420244U - - Google Patents

Info

Publication number
JPH0420244U
JPH0420244U JP1990060562U JP6056290U JPH0420244U JP H0420244 U JPH0420244 U JP H0420244U JP 1990060562 U JP1990060562 U JP 1990060562U JP 6056290 U JP6056290 U JP 6056290U JP H0420244 U JPH0420244 U JP H0420244U
Authority
JP
Japan
Prior art keywords
base
semiconductor element
storing
package
mounting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990060562U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990060562U priority Critical patent/JPH0420244U/ja
Publication of JPH0420244U publication Critical patent/JPH0420244U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/07554
    • H10W72/547
    • H10W72/884

Landscapes

  • Die Bonding (AREA)
JP1990060562U 1990-06-07 1990-06-07 Pending JPH0420244U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990060562U JPH0420244U (enExample) 1990-06-07 1990-06-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990060562U JPH0420244U (enExample) 1990-06-07 1990-06-07

Publications (1)

Publication Number Publication Date
JPH0420244U true JPH0420244U (enExample) 1992-02-20

Family

ID=31588034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990060562U Pending JPH0420244U (enExample) 1990-06-07 1990-06-07

Country Status (1)

Country Link
JP (1) JPH0420244U (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961948A (ja) * 1982-09-30 1984-04-09 Kyocera Corp 半導体パツケ−ジ
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961948A (ja) * 1982-09-30 1984-04-09 Kyocera Corp 半導体パツケ−ジ
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

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