JPH0420244U - - Google Patents
Info
- Publication number
- JPH0420244U JPH0420244U JP1990060562U JP6056290U JPH0420244U JP H0420244 U JPH0420244 U JP H0420244U JP 1990060562 U JP1990060562 U JP 1990060562U JP 6056290 U JP6056290 U JP 6056290U JP H0420244 U JPH0420244 U JP H0420244U
- Authority
- JP
- Japan
- Prior art keywords
- base
- semiconductor element
- storing
- package
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 239000007772 electrode material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Description
第１図ａは本考案にかかる半導体素子収納用パ
ツケージの一実施例を示す断面図、第１図ｂは第
１図ａの丸部拡大断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。
１……基体、１ａ……半導体素子載置部、２…
…絶縁枠体、４……容量素子。
FIG. 1a is a sectional view showing an embodiment of a package for storing semiconductor elements according to the present invention, FIG. 1b is an enlarged cross-sectional view of the circle part of FIG. FIG. 1...Base body, 1a...Semiconductor element mounting portion, 2...
...Insulating frame, 4...Capacitive element.
Claims (1)
有する基体上に、該載置部を囲繞するようにして
絶縁枠体を取着して成る半導体素子収納用パツケ
ージにおいて、前記基体を熱伝導率が５０．０Ｗ
／ｍ・Ｋ以上の高熱伝導性材料で形成し、且つ基
体の半導体素子載置部に薄膜形成技術により電極
材料及び誘電材料を被着させて形成した容量素子
を取着したことを特徴とする半導体素子収納用パ
ツケージ。 In a package for storing a semiconductor element, which is formed by attaching an insulating frame to a base having a mounting part on which a semiconductor element is mounted in the center of the upper surface so as to surround the mounting part, the base is heated. Conductivity is 50.0W
The device is characterized by having a capacitive element made of a material with high thermal conductivity of /m·K or more, and formed by depositing an electrode material and a dielectric material on the semiconductor element mounting portion of the base using a thin film formation technique. Package cage for storing semiconductor elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990060562U JPH0420244U (en) | 1990-06-07 | 1990-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990060562U JPH0420244U (en) | 1990-06-07 | 1990-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420244U true JPH0420244U (en) | 1992-02-20 |
Family
ID=31588034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990060562U Pending JPH0420244U (en) | 1990-06-07 | 1990-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420244U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961948A (en) * | 1982-09-30 | 1984-04-09 | Kyocera Corp | Semiconductor package |
| JPS61108160A (en) * | 1984-11-01 | 1986-05-26 | Nec Corp | Semiconductor device with built-in capacitor and manufacture thereof |
-
1990
- 1990-06-07 JP JP1990060562U patent/JPH0420244U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961948A (en) * | 1982-09-30 | 1984-04-09 | Kyocera Corp | Semiconductor package |
| JPS61108160A (en) * | 1984-11-01 | 1986-05-26 | Nec Corp | Semiconductor device with built-in capacitor and manufacture thereof |