JPH04199566A - Integrated circuit - Google Patents

Abstract

PURPOSE:To increase the packing density of a semiconductor device by encapsulating a plurality of chips in one package, connecting an external address input to different chip select pads on the chips to select arbitrary chip in the package depending an the most significant bit of the address. CONSTITUTION:A plurality of chip select pads are provided on a semiconductor chip 1. When a plurality of chips 1 are contained in a single package 5, a specific input address is coupled to individual chip select pads to select a chip. As a result, the individual chips are selected or not depending on input address information. The memory capacity of a device can be increased by the multiply of the number of chips contained in the package, thereby increasing packing density.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to semiconductor integrated circuits, particularly to improving the degree of integration.

[Conventional technology]

FIGS. 3 and 4 are a plan view and a sectional view of a semiconductor device in which a conventional semiconductor integrated circuit is packaged in a zigzag in-line package. In the figure, (]) is a semiconductor chip with an integrated circuit built into its surface, (2) is an input/output terminal that transmits signals to the outside, and (3) is an input/output terminal provided on the semiconductor chip (1). (4) is a wire that connects the input/output pad (3) and the input/output terminal (2), and (5) is a package that protects the entire device.

Next, the operation will be explained. When operating a semiconductor integrated circuit, by applying external power supply voltage, control signals, address input, and data input signals to the input/output terminals (2), the information is transmitted through the wires (4) to the semiconductor chip. (1) is transmitted to the upper pad (3). This control signal causes the semiconductor integrated circuit provided on the semiconductor chip (11) to operate.

[Problem to be solved by the invention]

Conventional semiconductor integrated circuits were configured as described above, so there was only one integrated circuit in one pancake.
Therefore, in order to increase the storage capacity in a single package, it is necessary to make the integrated circuit itself smaller to accommodate the increased storage capacity, which poses the problem of being subject to significant process constraints. In addition, it is necessary to increase the number of semiconductor devices to increase the storage capacity without changing the integrated circuit itself.
In this case, there was also the problem that the degree of integration was poor.

This invention was made in order to solve the above-mentioned problems, and by providing a plurality of semiconductor chips in one package, it can be viewed from the outside as if it were a semiconductor device containing a chip with a large memory capacity. The aim is to obtain semiconductor integrated circuits that can be used.

[Means to solve the problem]

In the semiconductor device according to the present invention, when a plurality of chip selection pads are provided on a chip and a plurality of chips are placed in the same package, input signals of specific addresses are connected to different chip selection pads. Chips are selected or unselected depending on the input address.

[Function] The semiconductor integrated circuit according to the present invention allows a plurality of chips to be simultaneously assembled in one package by providing chip selection pads on the chip, and when used, it is possible to select and select chips based on address information. Since non-selection can be determined, the storage capacity of the semiconductor device is multiplied by the number of chips that can be assembled at the same time.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
In Figure 2, (1) is a semiconductor chip with an integrated circuit built into its surface, (2) is an input/output terminal for transmitting signals to the outside, and (3) is a semiconductor chip on the semiconductor chip (1). The input/output pad provided (4) is the input/output bat (3)
and the wire connecting the input/output terminal (2), (5) is the pan cage that protects the whole, (6) is provided on the semiconductor chip (1), and is connected to the input/output terminal (2) by the wire (4). This is a chip selection bat that selects or deselects the chip (1>) according to the input t near trace.

Next, the operation will be explained.

Externally, it is exactly the same as in the case of conventional semiconductor devices,
By applying a power supply voltage, control signal, address input, and data signal to the input/output terminal (2) from the outside, the information is transmitted through the wire (4) to the semiconductor chip (1).
) is transmitted to the pad (3) above.

This control signal causes the semiconductor integrated circuit provided on the semiconductor chip (1) to operate, but the semiconductor integrated circuit of this embodiment has multiple chips assembled in one package. The selection or non-selection of each chip can be determined by an external signal (usually the highest address) by selectively bonding the chip select pad (6) provided on the semiconductor chip (1). .

As described above, the semiconductor integrated circuit in this embodiment can be controlled externally in exactly the same way as conventional semiconductor devices, and the degree of integration (memory and capacity) is similar to that of next-generation semiconductor devices. You can get the equipment.

In addition, although the above embodiment shows the case where the input/output signal terminal (2) and the chip select bat (6) are connected by the wire (4), the connection may not be made by the wire (4), for example, by using a bump or the like. The connection may be made using polysilicon, polysolicide, or the like, and the same effect as in the above embodiment can be obtained.

Further, it goes without saying that the same effect can be achieved even if the chip selection bat (6) is not provided and the internal wiring is directly connected to the input/output signal terminal, and this is of course included in the present invention.

〔Effect of the invention〕

As described above, according to the present invention, one semiconductor device is constructed in such a way that a plurality of identical chips are assembled into one package, so that highly integrated semiconductor integrated circuits can be produced at low cost, and the development period can be shortened. This has the effect of allowing you to obtain something shorter.

[Brief explanation of the drawing]

1 and 2 are a plan view and a sectional view of a semiconductor integrated circuit according to an embodiment of the present invention, and FIGS. 3 and 4 are a plan view and a sectional view of a conventional semiconductor integrated circuit. In the figure, (]) is a semiconductor chip, (2) is an input/output terminal, (3) is an input/output pad, (4) is a wire (wiring), (5) is a package, and (6) is a bat for chip selection. shows. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] A plurality of semiconductor chips each having a semiconductor integrated circuit having a plurality of chip select pads on the chip are housed in the same package, and an external terminal for inputting an address is connected to a different chip select pad of each chip. A semiconductor integrated circuit characterized in that the chip within the package can be arbitrarily selected based on an upper address.