JPH0419820Y2 - - Google Patents
Info
- Publication number
- JPH0419820Y2 JPH0419820Y2 JP11227684U JP11227684U JPH0419820Y2 JP H0419820 Y2 JPH0419820 Y2 JP H0419820Y2 JP 11227684 U JP11227684 U JP 11227684U JP 11227684 U JP11227684 U JP 11227684U JP H0419820 Y2 JPH0419820 Y2 JP H0419820Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lead wire
- wire
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11227684U JPS6127368U (ja) | 1984-07-24 | 1984-07-24 | プリント回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11227684U JPS6127368U (ja) | 1984-07-24 | 1984-07-24 | プリント回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6127368U JPS6127368U (ja) | 1986-02-18 |
| JPH0419820Y2 true JPH0419820Y2 (enEXAMPLES) | 1992-05-06 |
Family
ID=30671338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11227684U Granted JPS6127368U (ja) | 1984-07-24 | 1984-07-24 | プリント回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127368U (enEXAMPLES) |
-
1984
- 1984-07-24 JP JP11227684U patent/JPS6127368U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6127368U (ja) | 1986-02-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0419820Y2 (enEXAMPLES) | ||
| JPS609188U (ja) | 電気回路を備えたほうろう基板のリ−ド線取付け構造 | |
| JPH0351934Y2 (enEXAMPLES) | ||
| JPS60172360U (ja) | プリント基板 | |
| JPS5844871U (ja) | 配線基板 | |
| JPS6210469U (enEXAMPLES) | ||
| JPS6220985Y2 (enEXAMPLES) | ||
| JPH0382567U (enEXAMPLES) | ||
| JPH04101908U (ja) | 複合磁気ヘツド | |
| JPS5852631U (ja) | 薄膜磁気ヘツドの接続装置 | |
| JPS59146915U (ja) | チツプインダクタ | |
| JPH0361336U (enEXAMPLES) | ||
| JPS6113931U (ja) | 半導体装置 | |
| JPH06205560A (ja) | 端子装置 | |
| JPS6020117U (ja) | インダクタ−素子 | |
| JPS60141173U (ja) | 基板への電気部品の実装構造 | |
| JPS62184776U (enEXAMPLES) | ||
| JPS5918472U (ja) | 金属ベ−ス回路基板のリ−ド線取付装置 | |
| JPH05283234A (ja) | インダクタ素子 | |
| JPS62141690A (ja) | 接続装置 | |
| JPS62133382U (enEXAMPLES) | ||
| JPH0395568U (enEXAMPLES) | ||
| JPS60172359U (ja) | プリント基板 | |
| JPS6120045U (ja) | 半導体装置 | |
| JPH0351805U (enEXAMPLES) |