JPH0419795Y2 - - Google Patents
Info
- Publication number
- JPH0419795Y2 JPH0419795Y2 JP6680486U JP6680486U JPH0419795Y2 JP H0419795 Y2 JPH0419795 Y2 JP H0419795Y2 JP 6680486 U JP6680486 U JP 6680486U JP 6680486 U JP6680486 U JP 6680486U JP H0419795 Y2 JPH0419795 Y2 JP H0419795Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cavity
- block
- heating
- oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 42
- 239000011347 resin Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6680486U JPH0419795Y2 (ko) | 1986-05-01 | 1986-05-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6680486U JPH0419795Y2 (ko) | 1986-05-01 | 1986-05-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62178534U JPS62178534U (ko) | 1987-11-12 |
| JPH0419795Y2 true JPH0419795Y2 (ko) | 1992-05-06 |
Family
ID=30905139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6680486U Expired JPH0419795Y2 (ko) | 1986-05-01 | 1986-05-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419795Y2 (ko) |
-
1986
- 1986-05-01 JP JP6680486U patent/JPH0419795Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62178534U (ko) | 1987-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7798798B2 (en) | Rotary injection molding apparatus and method for use | |
| GB2252746A (en) | Resin sealing of electronic parts | |
| JPH0419795Y2 (ko) | ||
| CN112677422B (zh) | 树脂成形品的制造方法及树脂成形装置 | |
| JP6164715B1 (ja) | カセット式金型装置 | |
| JP2802272B2 (ja) | 多品種少量生産に適した半導体装置の製造方法 | |
| JPH0432755Y2 (ko) | ||
| JPH056094Y2 (ko) | ||
| KR100443316B1 (ko) | 반도체 패키지 몰딩장치 | |
| JPH0719146Y2 (ja) | 半導体素子の樹脂封止用金型装置 | |
| JP2609849B2 (ja) | 多品種少量生産に適した半導体封止用のマルチプランジヤー型樹脂モールド装置 | |
| JPH11126787A (ja) | 電子部品の樹脂封止成形方法及び金型 | |
| JP2916677B2 (ja) | 多品種少量生産に適した半導体装置の製造用金型装置 | |
| JP2903042B2 (ja) | 多品種少量生産に適した半導体封止用のマルチプランジャー型樹脂モールド装置 | |
| JPH0744192B2 (ja) | 半導体素子の樹脂封止成形用金型 | |
| JP2772486B2 (ja) | 電子部品の樹脂封止成形用金型 | |
| KR102315776B1 (ko) | 냉각기능을 가지는 스프루 부시를 포함하는 사출 성형 금형 | |
| JPS62269331A (ja) | 多品種少量生産に適した半導体装置の製造方法 | |
| JPS6382717A (ja) | トランスファー成形型の金型装置 | |
| JPS62269329A (ja) | 半導体素子の樹脂封止成形用金型 | |
| JPH0356341Y2 (ko) | ||
| JPH0238447Y2 (ko) | ||
| JP3542177B2 (ja) | 樹脂モールドの製造装置 | |
| JPH09169045A (ja) | 射出成形用金型 | |
| JPH02134833A (ja) | 樹脂モールド装置 |