JPH04197716A - Method for sealing substrate - Google Patents
Method for sealing substrateInfo
- Publication number
- JPH04197716A JPH04197716A JP33179590A JP33179590A JPH04197716A JP H04197716 A JPH04197716 A JP H04197716A JP 33179590 A JP33179590 A JP 33179590A JP 33179590 A JP33179590 A JP 33179590A JP H04197716 A JPH04197716 A JP H04197716A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sealing material
- printed substrate
- air bubbles
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 title abstract description 27
- 239000000565 sealant Substances 0.000 claims description 2
- 239000003566 sealing material Substances 0.000 abstract description 24
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000005266 casting Methods 0.000 abstract 1
- 238000001125 extrusion Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 5
- 238000007599 discharging Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
Description
【発明の詳細な説明】
〔概 要〕
ケース内に実装される基板の封止方法に関し、該基板に
貫通孔を形成し、該貫通孔より基板下部に封止材を注入
して該基板を封止することにより、基板下部における気
泡の発生を防止する。[Detailed Description of the Invention] [Summary] Regarding a method of sealing a board mounted in a case, a through hole is formed in the board, a sealing material is injected into the lower part of the board through the through hole, and the board is sealed. By sealing, the generation of bubbles at the bottom of the substrate is prevented.
本発明はケース内に実装される基板の封止方法に関する
。The present invention relates to a method for sealing a substrate mounted in a case.
電子機器にはケース内に電子部品を搭載したプリント基
板等の基板が実装されている。この内、エンジンルーム
に搭載される電子機器のように、電子部品を防湿する必
要のあるものは、通常電子部品を含む基板全体を封止材
で封止することが行われている。BACKGROUND OF THE INVENTION Electronic devices have a case mounted with a board, such as a printed circuit board, on which electronic components are mounted. Among these devices, for electronic devices that require moisture-proofing of electronic components, such as electronic devices installed in an engine room, the entire board containing the electronic components is usually sealed with a sealing material.
第３図は一般的な封止構造を示す図であり、ケース１２
の内部に電子部品１５を搭載したプリント基板１１を固
定し、上部から封止材１４を吐出ノズル１３より吐出し
て電子部品１５を含むプリント基板１１全体を覆った後
硬化することで封止を行っている。その際、ボイドと称
される封止材内部に気泡が発生する現象か生しると、気
泡自体が水分を含むことから防湿が不十分になり、また
、封止材を硬化する際気泡が熱により膨張して封止材の
一部を破り外気と連なるブローホールと称される現象が
生しるとやはり防湿か不十分になる。FIG. 3 is a diagram showing a general sealing structure, and the case 12
The printed circuit board 11 with the electronic components 15 mounted thereon is fixed, and the sealing material 14 is discharged from the top from the discharge nozzle 13 to cover the entire printed circuit board 11 including the electronic components 15, and then hardened to perform sealing. Is going. At that time, if a phenomenon called voids occurs in which air bubbles are generated inside the encapsulant, the air bubbles themselves contain moisture, making moisture proofing insufficient. If a phenomenon called a blowhole occurs, which expands due to heat and ruptures a part of the sealing material and communicates with the outside air, the moisture proofing will be insufficient.
そこで従来ては、このボイドやブローホールを防ぐため
にワークを温めたり、封止材の温度を温めたりすること
で封止材の回り込みをよくしていた。Conventionally, in order to prevent these voids and blowholes, the encapsulant wraps better by warming the workpiece or increasing the temperature of the encapsulant.
しかしながら、第４図に示すようにプリント基板１１の
上部から封止材１４を吐出する方法ては、封止材１４が
プリント基板１１の周囲から下部へ回り込むため、プリ
ント基板１１の中央部に気泡１６が残ってしまう。また
、第５図に示すようにプリント基板１１の側面から封止
材を吐出する方法では、封止材１４はまずプリント基板
１１の図面左側から下部へ入り込み、その後右側から遅
れて下部へ入り込むため、プリント基板１１の下側部に
気泡１６か残ってしまう。However, in the method of discharging the sealing material 14 from the upper part of the printed circuit board 11 as shown in FIG. That leaves 16. Furthermore, in the method of discharging the sealing material from the side surface of the printed circuit board 11 as shown in FIG. , some air bubbles 16 remain on the lower side of the printed circuit board 11.
このように、従来の封止方法では基板下部に気泡が残り
易く、ボイド、ブローホールの発生を押えることかでき
なかった。As described above, with conventional sealing methods, air bubbles tend to remain at the bottom of the substrate, and the generation of voids and blowholes cannot be suppressed.
そこで本発明は、基板下部における気泡をなくすことを
目的とする。Therefore, an object of the present invention is to eliminate air bubbles at the bottom of the substrate.
前記問題点を解決するため、本発明はケース内に実装さ
れる基板の封止方法において、該基板に貫通孔を形成し
、該貫通孔より基板下部に封止材を注入して該基板を封
止することを特徴とする。In order to solve the above problems, the present invention provides a method for sealing a board mounted in a case, in which a through hole is formed in the board, a sealing material is injected into the lower part of the board through the through hole, and the board is sealed. It is characterized by being sealed.
基板に形成された貫通孔から基板下部に封止材を注入す
ると、封止材は基板下部から基板周囲を通って基板上部
へ回り込むため、気泡も基板下部から上部へ押し呂され
基板の下部に気泡か残ることはなくなる。When the sealing material is injected into the bottom of the substrate through the through-hole formed in the substrate, the sealing material flows from the bottom of the substrate through the circumference of the substrate to the top of the substrate, and air bubbles are also pushed from the bottom of the substrate to the top, causing them to flow to the bottom of the substrate. No more air bubbles will remain.
以下、図面を用いて本発明の実施例について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例を示す図であり、第２図は本
発明に関するプリント基板の平面図である。プリント基
板１には電子部品５か搭載されており、またプリント基
板１の中央部には封止材吐出用の貫通孔６が形成されて
いる。貫通孔６．の大きさは封止材吐出ノズル３か入り
こめるだけの大きさに設定されている。このプリント基
板１かケース２の内部に実装される。FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a plan view of a printed circuit board related to the present invention. An electronic component 5 is mounted on the printed circuit board 1, and a through hole 6 for discharging a sealant is formed in the center of the printed circuit board 1. Through hole 6. The size is set to be large enough to allow the sealing material discharge nozzle 3 to enter. This printed circuit board 1 is mounted inside the case 2.
かかるプリント基板ｌを封止する場合、まず吐出ノズル
３の先端部をプリント基板１に形成された貫通孔６に挿
入し、その後封止材４を吐出する。When sealing such a printed circuit board 1, the tip of the discharge nozzle 3 is first inserted into the through hole 6 formed in the printed circuit board 1, and then the sealing material 4 is discharged.
すると封止材４はプリント基板ｌの下部から矢印Ａ及び
Ｂの経路でプリント基板１の上部へ押し出され、やがて
第３図で示したようにプリント基板ｌ及び電子部品５全
体か封止材４で覆われる。その際、プリント基板１の下
部に気泡か存在しても、その気泡は封止材４と一緒にプ
リント基板ｌの上部へ押し出され、プリント基板ｌの下
部に気泡か残ることかなくなる。この状態で加熱して封
止材４を硬化させることで封止か完了する。尚、プリン
ト基板１の上部にある封止材４中に気泡か存在しても硬
化前に自然に外部へ抜は出るか、封止材４あるいはプリ
ント基板ｌを予め温めておくことてより一層気泡は外部
へ抜は８易（なる。Then, the sealing material 4 is pushed out from the lower part of the printed circuit board l to the upper part of the printed circuit board 1 in the path of arrows A and B, and eventually the entire printed circuit board l and electronic components 5 or the sealing material 4 is pushed out as shown in FIG. covered with At this time, even if air bubbles exist in the lower part of the printed circuit board 1, the air bubbles are pushed out to the upper part of the printed circuit board 1 together with the sealing material 4, and no air bubbles remain in the lower part of the printed circuit board 1. The sealing is completed by heating in this state to harden the sealing material 4. It should be noted that even if there are bubbles in the sealing material 4 on the top of the printed circuit board 1, they will naturally come out before curing, or it will be even better if the sealing material 4 or the printed circuit board 1 is warmed in advance. It is easy to remove air bubbles to the outside.
以上の実施例では貫通孔を基板の中央部に形成したか、
本発明は特にこの位置に限定するものではない。しかし
なから、中央部に形成するのか最も望ましい。なぜなら
基板の一端近傍に形成すると、基板とケースとの間隔に
もよるが封止材か基板下部から基板の他端へ押し出され
る前に基板−端から上部へ押し出された封止材か基板の
上部より他端へ回り込む可能性かあり、これにより気泡
か残ってしまう恐れかあるからである。In the above embodiments, the through hole was formed in the center of the substrate, or
The present invention is not particularly limited to this position. However, it is most desirable to form it in the center. This is because if it is formed near one end of the board, depending on the distance between the board and the case, the encapsulant may be pushed out from the bottom of the board to the other end of the board, or the encapsulant may be pushed out from the end of the board to the top. This is because there is a possibility that the air bubbles may wrap around from the top to the other end, resulting in air bubbles remaining.
以上、詳細に説明したように、本発明によれば基板下部
の気泡を除去することができる。As described above in detail, according to the present invention, air bubbles at the bottom of the substrate can be removed.
第１図は本発明の一実施例を示す図、
第２図は本発明に係るプリント基板の平面図、第３図は
封止構造を示す図、
第４図は従来の問題点を示す図、
第５図は従来の他の問題点を示す図である。
出 願 人 富士通テン株式会社Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a plan view of a printed circuit board according to the present invention, Fig. 3 is a diagram showing a sealing structure, and Fig. 4 is a diagram showing conventional problems. , FIG. 5 is a diagram showing other problems with the conventional method. Applicant Fujitsu Ten Ltd.
Claims (1)
材を注入して該基板を封止することを特徴とする基板の
封止方法。1. A method for sealing a board mounted in a case, the board being sealed by forming a through hole in the board, and injecting a sealant into the lower part of the board through the through hole to seal the board. How to stop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2331795A JPH0669691B2 (en) | 1990-11-29 | 1990-11-29 | Substrate sealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2331795A JPH0669691B2 (en) | 1990-11-29 | 1990-11-29 | Substrate sealing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04197716A true JPH04197716A (en) | 1992-07-17 |
| JPH0669691B2 JPH0669691B2 (en) | 1994-09-07 |
Family
ID=18247731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2331795A Expired - Fee Related JPH0669691B2 (en) | 1990-11-29 | 1990-11-29 | Substrate sealing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0669691B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006078255A (en) * | 2004-09-08 | 2006-03-23 | Yazaki Corp | Current sensor |
| US8582042B2 (en) | 2010-02-04 | 2013-11-12 | Kabushiki Kaisha Toshiba | Stereoscopic image display apparatus |
| US8743113B2 (en) | 2009-09-16 | 2014-06-03 | Kabushiki Kaisha Toshiba | Stereoscopic image display apparatus |
| JP2016027533A (en) * | 2013-12-19 | 2016-02-18 | ミツミ電機株式会社 | Method of manufacturing switch, and switch |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164815A (en) * | 1980-05-26 | 1981-12-18 | Toshiba Corp | Production of resin-sealed type module |
-
1990
- 1990-11-29 JP JP2331795A patent/JPH0669691B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164815A (en) * | 1980-05-26 | 1981-12-18 | Toshiba Corp | Production of resin-sealed type module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006078255A (en) * | 2004-09-08 | 2006-03-23 | Yazaki Corp | Current sensor |
| US8743113B2 (en) | 2009-09-16 | 2014-06-03 | Kabushiki Kaisha Toshiba | Stereoscopic image display apparatus |
| US8582042B2 (en) | 2010-02-04 | 2013-11-12 | Kabushiki Kaisha Toshiba | Stereoscopic image display apparatus |
| JP2016027533A (en) * | 2013-12-19 | 2016-02-18 | ミツミ電機株式会社 | Method of manufacturing switch, and switch |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0669691B2 (en) | 1994-09-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
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| FPAY | Renewal fee payment (event date is renewal date of database) |
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| LAPS | Cancellation because of no payment of annual fees |