JPH0419495B2 - - Google Patents
Info
- Publication number
- JPH0419495B2 JPH0419495B2 JP19245482A JP19245482A JPH0419495B2 JP H0419495 B2 JPH0419495 B2 JP H0419495B2 JP 19245482 A JP19245482 A JP 19245482A JP 19245482 A JP19245482 A JP 19245482A JP H0419495 B2 JPH0419495 B2 JP H0419495B2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- strain
- pressure
- measuring
- differential pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19245482A JPS5983023A (ja) | 1982-11-04 | 1982-11-04 | 半導体圧力差圧検出器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19245482A JPS5983023A (ja) | 1982-11-04 | 1982-11-04 | 半導体圧力差圧検出器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5983023A JPS5983023A (ja) | 1984-05-14 |
| JPH0419495B2 true JPH0419495B2 (zh) | 1992-03-30 |
Family
ID=16291565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19245482A Granted JPS5983023A (ja) | 1982-11-04 | 1982-11-04 | 半導体圧力差圧検出器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5983023A (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2532806A (en) * | 2014-11-25 | 2016-06-01 | Continental Automotive Systems Us Inc | Piezoresistive pressure sensor device |
| US9964458B2 (en) * | 2016-05-12 | 2018-05-08 | Continental Automotive Systems, Inc. | Pressure sensor device with anchors for die shrinkage and high sensitivity |
| JP2021039043A (ja) * | 2019-09-05 | 2021-03-11 | ミツミ電機株式会社 | 圧力感知素子及び圧力センサ |
| JP7571976B2 (ja) * | 2021-09-08 | 2024-10-23 | ミネベアミツミ株式会社 | 脈波センサ |
| JP2023085754A (ja) * | 2021-12-09 | 2023-06-21 | ミネベアミツミ株式会社 | 脈波測定装置 |
| WO2023167172A1 (ja) * | 2022-03-04 | 2023-09-07 | ミネベアミツミ株式会社 | 脈波センサ |
-
1982
- 1982-11-04 JP JP19245482A patent/JPS5983023A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5983023A (ja) | 1984-05-14 |
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