JPH04186714A - Mold-chip type solid electrolytic capacitor - Google Patents

Abstract

PURPOSE:To share a lead frame, a mold lower mold and an outer lead terminal metal mold in common by leading an anode lead in a mold body to one of surfaces connected to a bottom with height from the bottom constant while various values of capacitance are supported by varying the height. CONSTITUTION:A bottom of 1.0mmX1.0mm with height of 1.5mm is pressure- molded, while an anode lead is led to one of surfaces connected to the bottom from a position with height of 0.5mm from the bottom to form an anode body 1, and a dielectric coating 2, a semiconductor layer 3 and a cathode layer 4 are formed to manufacture of a capacitor element of capacitance of 1.5muF. Then a frame is used to manufacture an outer lead terminal 6, and then a metal mold having a size of 1.3mum of an upper metal mold and 0.8mm of a lower metal mold is used to package the mold by epoxy resin 7. Then a terminal metal mold is used to mold a terminal.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a molded chip type solid electrolytic capacitor, in particular an anode lead is led out in a molded pair of metal powder having a valve action, and a sintered anode body is formed. This invention relates to an anode lead drawer structure.

[Conventional technology]

In conventional molded chip solid electrolytic capacitors, an anode lead is led out from the center of the molded body into a molded body of valve-acting metal powder, and the anode lead is sintered to form the anode body. A capacitor element is formed by forming the layers and the cathode body layer.

Next, the anode lead of the capacitor element and the lead frame are welded using the lead frame that will serve as the external lead terminals of the anode and cathode, and the cathode side and the lead frame are connected using conductive adhesive. After this, epoxy resin etc. Mold forming and external lead terminal forming were performed.

[Problem to be solved by the invention]

In the conventional molded chip type solid electrolytic capacitor described above, in which the anode lead of the anode body is drawn out, the size of the capacitor element differs depending on the capacitance of the capacitor, so in order to manufacture products with limited external shapes, it is necessary to 1. A lead frame that matches the size of the capacitor element is required.

2. An upper mold and a lower mold are required in the mold to match the size of the capacitor element.

3. A mold is required for bending the external lead terminals to match the size of the lower mold.

There are problems such as, and the disadvantage is that the cost is significantly higher.

[Means to solve the problem]

The molded chip type solid electrolytic capacitor of the present invention has a dielectric layer 1, a semiconductor layer, and a cathode layer formed on an anode body made of a substantially rectangular parallelepiped metal powder molded body having a valve action from which an anode lead is led out, and an external lead terminal In a molded chip type solid electrolytic capacitor formed by connection, resin molding, and external lead terminal molding, the shape of the adjacent surface of the anode lead lead-out surface, which is the bottom surface of the molded body, and the height of the anode lead lead-out part from the bottom surface. The feature is that the volume is constant and the volume is changed depending on the height of the molded body.

As mentioned above, the molded chip solid electrolytic capacitor of the present invention is made by molding metal powder with valve action into a rectangular parallelepiped shape with a constant bottom shape and size, and by changing the height, various capacitances can be created. Correspondingly, the anode lead is placed on one side of the molded body connected to the bottom surface with a constant height from the bottom surface, resulting in a structure that allows the lead frame, lower mold mold, and external lead terminal mold to be shared. It has become.

〔Example〕

Next, the present invention will be explained with reference to the drawings. FIGS. 1(a) to (d) and FIGS. 2(a) and (b) are cross-sectional views of a molded chip solid capacitor and an anode body for explaining one embodiment of the present invention.

As shown in FIGS. 2(a) and (b), tantalum powder is pressure-molded on the bottom surface to a height of 1.0 dragon x 10 fins, 1.0 + ai+, and while connected to the bottom surface, one surface has a height of 0.0 mm from the bottom surface. Anode body 1 is obtained by applying pressure to the anode lead from a position of 5 mm and sintering it in a high vacuum. A dielectric film 2 of tantalum pentoxide is electrochemically formed on this surface in an electrolytic solution, and then immersion and thermal decomposition in a manganese nitrate solution are repeated several times to form a semiconductor layer 3 of manganese dioxide. Furthermore, a graphite silver paste is baked to form a cathode layer 4, and the electrode voltage is 16V and the capacitance is 1.
．． A 0 μF capacitor element was manufactured.

Thereafter, using a lead frame with a cathode bent portion depth of 0.5 liters, the anode lead was welded, and the cathode portion was connected to an external lead terminal 6 using a conductive adhesive 5. Next, depth 0.8
Using a mold having the dimensions of an upper mold of m+a and a lower mold of depth 0.8 mm, the mold is covered with epoxy resin 7, and then terminal molding is performed using an external lead terminal mold. Dimensions: Width 1.6mm Height 1.6
A molded chip type tantalum solid electrolytic capacitor with a length of 3.2 mm was manufactured.

Next, as shown in Fig. 1 (a) and (b), the bottom surface is 1.0 mm.
Pressure mold it to x1.0 x height 1-15 mm, and lead out the anode lead from the position of 0.5u+ from the bottom, which is the same height as Fig. 2 (b), on one side connected to the bottom. to form an anode body 1, and a dielectric coating 2. as shown in FIG. 2(a). Semiconductor layer 3.
By forming the cathode layer 4, the rated voltage is 16V and the capacitance is 1.5μ.
A capacitor element of F was manufactured.

Thereafter, external lead terminals 6 were connected using the same frame as in FIG. 2<a). Next, using a mold having the dimensions of an upper mold with a depth of 1.31 and a lower mold with the same depth of 0.8 + * m as in Fig. 2 (a), the mold is covered with epoxy resin 7, and then The terminal was formed using the same terminal forming mold as in Figure 2 (a), width 1.6, height 2.0, length 3.
．． Twenty-one molded chip solid electrolytic capacitors were manufactured.

Figures 1(c) and (d) are manufactured using the conventional standard structure of Figures 1(a) and (b).As shown in Figure 1(d), the bottom surface 1, 0anX 1, Om+a height length 1.5mm
The anode body 1 is formed by pressure-forming the anode body 1 by leading out an anode lead from a position of 0.75 degrees, which corresponds to the center of the height from the bottom surface, on one surface connected to the bottom surface, and forming a dielectric body as shown in FIG. 2(a). layer 2
．． Semiconductor layer 3. A cathode layer 4 was formed, and a capacitor element having a rated voltage of 16V and a capacitance of 1.5 μF was formed. Next, external lead terminals 6 were connected using a lead frame with a cathode bending depth of 0.8+u. Next, using a mold having dimensions of an upper mold with a depth of 1.05 mm and a lower mold with a depth of 1.05 mm, which are different from those shown in FIG. 2(a), the mold is covered with epoxy resin 7. After that, a second mold that matches the dimensions of the lower mold of the main mold.
Terminals were formed using a terminal molding die different from that shown in Figure (a), and the width was 1.6mm and the height was 2mm. ．． A molded chip type tantalum solid electrolytic capacitor with a length of 1 mm and a length of 3.2 mm was manufactured.

FIGS. 3(a) to 3(d) are cross-sectional views of a molded chip solid electrolytic capacitor and an anode body for explaining a second embodiment of the present invention. As shown in FIG. 3(b), the bottom surface 1.
0■mX1. o■l Pressure molded to a height of 0.7 m + *, and led out the anode lead from the position of 0.5 mm from the bottom, the same height as the standard Fig. 2 (b), on one side connected to the bottom. Anode body 1 and dielectric coating 2. as shown in FIG. 2(a).
Semiconductor layer 3. A cathode layer 4 was formed to produce a capacitor element with a rated voltage of 16V and a capacitance of 0.68 μF.

Thereafter, external lead terminals 6 were connected using the same frame as in FIG. 2(a). Next, using an upper mold with a depth of 0-4 mm and a lower mold with the same depth of 0.8 mm as in Figure 2 (a), the mold is covered with epoxy resin 7, and then the second The terminal was formed using the same terminal forming mold as in figure (a). Width: 1.6 m + m Height: 1.2 Dragon length: 3
．． Two molded chip type tantalum solid electrolytic capacitors were manufactured.

Regarding conventional manufacturing, as shown in Fig. 3(c) and (d), the bottom surface 1, ClmmX1, Os+m height 0.7
(2), and an anode lead is led out from a position of 0.35 mm from the bottom on one surface connected to the bottom to form the anode body 1, and a dielectric layer 2, as shown in FIG. 2(a), Semiconductor layer 3. The cathode layer 4 is formed to have a rated voltage of 16V and a capacitance of 0.
A capacitor element of 68 μF was formed. Next, external lead terminals 6 were connected using a lead frame with a cathode bending depth of 0.4 mm. Next, we used an upper mold with a depth of 0.6+u and a depth of 0.6v, which is different from that used in Fig. 2 (a) as standard.
Using a mold having the dimensions of the lower mold e, the mold is covered with epoxy resin 7, and then similarly shown in Fig. 2 (
A molded chip type tantalum solid electrolytic capacitor with a width of 1.6 cm and a height of 1.2 cm and a length of 3.2 cm was formed using a terminal mold that matches the lower mold dimensions of this mold, which are different from a). was manufactured.

In addition, 1. In the second embodiment, a molded chip solid electrolytic capacitor using tantalum has been described, but similar effects can be obtained with a molded chip solid electrolytic capacitor using other valve metals such as aluminum.

〔Effect of the invention〕

As explained above, the present invention molds metal powder having a valve action into a rectangular parallelepiped shape with a constant bottom shape and size, and by changing the height, it can accommodate various types of capacitance. By leading the anode lead to one surface connected to the bottom surface with a constant height from the bottom surface, there is an effect that the lead frame, the lower mold mold, and the external lead terminal molding mold can be shared.

[Brief explanation of the drawing]

Figure 1 (a) to (d, ), Figure 2 (a>, (b)
1(a) is a vertical sectional view of a molded chip tantalum solid electrolytic capacitor and an anode body used therein for explaining one embodiment of the present invention. (b) is a longitudinal sectional view of a chip-type tantalum solid electrolytic capacitor to which the present invention is applied, which has a larger capacitance than the reference capacitance shown in FIGS. 2(a) and (b), and FIGS. 1(c) and (d) are 1st
Figures (a) and (b) are vertical cross-sectional views of conventional structures with the same capacitance; Figure 2 is a vertical cross-sectional view of standard structures with standard capacitance;
3(a) to 3(d) are vertical sectional views of a chip-type tantalum solid electrolytic capacitor and an anode body used therein for explaining another embodiment of the present invention; FIG. (b) is a longitudinal sectional view of another embodiment applied to a chip-type tantalum solid electrolytic capacitor having a capacitance smaller than the reference capacitance shown in FIGS. 2(a) and (b), and FIG. 3(c) ,(
d) is Figure 3(a). FIG. 6 is a vertical cross-sectional view of a conventional structure having the same capacitance as in FIG. DESCRIPTION OF SYMBOLS 1... Anode body, 2... Dielectric coating, 3... Semiconductor layer, 4... Cathode layer, 5... Conductive adhesive, 6...
External lead terminal, 7...Epoxy resin.

Claims (1)

[Claims] A dielectric layer, a semiconductor layer, a dielectric layer, a semiconductor layer,
In a molded chip type solid electrolytic capacitor in which a cathode layer is formed, external lead terminals are connected, molded with resin, and external lead terminals are formed, the shape of the adjacent surface of the anode lead lead-out surface that is the bottom surface of the molded body and the anode lead A molded chip type solid electrolytic capacitor characterized by having a constant height from the bottom of the lead-out part and varying the volume depending on the height of the molded body.