JPH04164308A - Chip type solid electrolytic tantalum capacitor - Google Patents
Chip type solid electrolytic tantalum capacitorInfo
- Publication number
- JPH04164308A JPH04164308A JP2291535A JP29153590A JPH04164308A JP H04164308 A JPH04164308 A JP H04164308A JP 2291535 A JP2291535 A JP 2291535A JP 29153590 A JP29153590 A JP 29153590A JP H04164308 A JPH04164308 A JP H04164308A
- Authority
- JP
- Japan
- Prior art keywords
- tantalum
- solid electrolytic
- foil
- elements
- type solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 229910052715 tantalum Inorganic materials 0.000 title claims abstract description 57
- 239000003990 capacitor Substances 0.000 title claims abstract description 17
- 239000007787 solid Substances 0.000 title claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011888 foil Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 229910002804 graphite Inorganic materials 0.000 abstract 1
- 239000010439 graphite Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は固体電解タンタルコンデンサに関し、特に並列
接続してなるチップ型固体電解タンタルコンデンサに関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to solid electrolytic tantalum capacitors, and particularly to chip-type solid electrolytic tantalum capacitors connected in parallel.
従来、この種のチップ型固体電解タンタルコンデンサと
しては第４図に示すように、Ｔａ線１０をタンタル焼結
体３１に植立したタンタル素子を作成し、陽極端子板５
１及び陰極端子板４１に接続し、絶縁樹脂７で外装する
という構造を有していた。Conventionally, as shown in FIG. 4, this type of chip-type solid electrolytic tantalum capacitor has been manufactured by creating a tantalum element in which a Ta wire 10 is embedded in a tantalum sintered body 31, and an anode terminal plate 5 is attached to the tantalum element.
1 and a cathode terminal plate 41, and was covered with an insulating resin 7.
上述した従来のチップ型固体電解タンタルコンデンサは
、Ｔａ線１０をタンタル焼結体３１に植立したタンタル
素子を１個使用している。このタンタル素子を２個以上
並列に接続した構造にすれば、たとえば１μＦのタンク
Ｊし素子さえ作っておけば、２個並列で２μＦ、３個並
列で３μＦと効率の良い生産が可能になるが、構造上非
常に複雑になるため量産が難かしく、小型化に不向きで
あるという欠点を有している。The conventional chip-type solid electrolytic tantalum capacitor described above uses one tantalum element in which a Ta wire 10 is embedded in a tantalum sintered body 31. If you create a structure in which two or more of these tantalum elements are connected in parallel, for example, if you make a 1μF tank J element, you can achieve efficient production of 2μF for two tantalum elements in parallel and 3μF for three in parallel. However, since the structure is extremely complex, mass production is difficult and it is unsuitable for miniaturization.
本発明の目的は、従来の欠点を除去し、より量産的で、
かつより小型の並列接続構造のチップ型固体電解タンタ
ルコンデンサを提供することにある。The purpose of the present invention is to eliminate the traditional drawbacks, make it more mass-producible,
Another object of the present invention is to provide a chip-type solid electrolytic tantalum capacitor having a smaller parallel connection structure.
上述した従来のチップ型固体電解コンデンサに対し、本
発明はタンタル箔２にタンタル焼結体３を接続し、タン
タル焼結体３を接続した面を陽極酸化し、陰極層８を形
成し、導電性樹脂層９によりスズ箔１に接続した形のタ
ンタル素子により構成することにより、陽陰径のとり出
しが、導電性接着剤による接続だけでできるようになり
、量産がはるかに容易になる、また構造が単純になるた
め小型化しやすいという相違点を有する。In contrast to the conventional chip-type solid electrolytic capacitor described above, the present invention connects a tantalum sintered body 3 to a tantalum foil 2, anodizes the surface to which the tantalum sintered body 3 is connected, forms a cathode layer 8, and forms a conductive layer. By constructing the tantalum element connected to the tin foil 1 through the conductive resin layer 9, the positive and negative diameters can be taken out simply by connecting with conductive adhesive, making mass production much easier. Another difference is that the structure is simpler, making it easier to downsize.
Ｃ課題を解決するための手段〕
本発明のチップ型固体電解タンタルコンデンサは、タン
タル箔の片面にタンタル粉末を加圧成形し、焼結し、酸
化膜、半導体層、導体層を順次形成したタンタル素子を
２個以上並列接続した構造を有することを特徴とする。Means for Solving Problem C] The chip-type solid electrolytic tantalum capacitor of the present invention is made of tantalum, which is obtained by pressure-molding tantalum powder on one side of a tantalum foil, sintering it, and sequentially forming an oxide film, a semiconductor layer, and a conductor layer. It is characterized by having a structure in which two or more elements are connected in parallel.
次に、本発明について図面を参照して説明する。第１図
は、本発明の一実施例の縦断面図、第２図は第１図中の
タンタル素子部分の拡大図である。まず第２図に示すよ
うに５０μｍ厚のタンタル箔２にエンボス部２２を設け
、その上に巾１ｍｍ、長さ２ｍｍ、厚さ１ｍｍの大きさ
に、１２ｍｇのタンタル粉末を加圧成形し、１０−５Ｔ
ｏｒｒの真空中、１８００℃の温度で３０分間焼結を行
ない、タンタル箔２が溶着したタンタル焼結体３を得た
。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a longitudinal sectional view of one embodiment of the present invention, and FIG. 2 is an enlarged view of the tantalum element portion in FIG. 1. First, as shown in FIG. 2, an embossed part 22 is provided on a tantalum foil 2 with a thickness of 50 μm, and 12 mg of tantalum powder is pressure-molded onto the embossed part 22 to have a width of 1 mm, a length of 2 mm, and a thickness of 1 mm. -5T
Sintering was carried out for 30 minutes at a temperature of 1800° C. in a vacuum of 1000° C. to obtain a tantalum sintered body 3 to which the tantalum foil 2 was welded.
次に、タンタル箔２のタンタル焼結体３との溶着面及び
タンタル焼結体３を９０℃の０．１％リン酸水溶液中に
浸漬し、タンタル箔２のタンタル焼結体３が溶着してい
ない面を陽極とし、１００Ｖまで陽極酸化を行なった。Next, the welded surface of the tantalum foil 2 with the tantalum sintered body 3 and the tantalum sintered body 3 are immersed in a 0.1% phosphoric acid aqueous solution at 90°C, and the tantalum sintered body 3 of the tantalum foil 2 is welded. Anodization was performed up to 100V using the unprotected surface as an anode.
次に、タンタル箔２のタンタル焼結体３との溶着面及び
タンタル焼結体３を硝酸マンガン液に浸漬し、３００℃
で５分間熱分解を行なって二酸化マンガン層を形成し、
グラフディト層、銀ペースト層を順次形成して、定格３
５Ｖ・１μＦのタンタル素子を形成した。Next, the welded surface of the tantalum foil 2 with the tantalum sintered body 3 and the tantalum sintered body 3 are immersed in a manganese nitrate solution at 300°C.
pyrolysis for 5 minutes to form a manganese dioxide layer,
Graffito layer and silver paste layer are sequentially formed to achieve a rating of 3.
A tantalum element of 5V and 1 μF was formed.
次に、定格３５Ｖ・１μＦのタンタル素子を第１図に示
すように、平面に置き陰極層側に５０μｍ厚のスズ箔１
を接続した。スズ箔１との接続は第２図に示すように導
電性樹脂層９による。スズ箔１上に絶縁板６をのせその
上にもう１個の定格３５Ｖ・１μＦのタンタル素子をタ
ンタル箔２が下になるようにしてのせ、さらに陰極層側
に５０μｍ厚のスズ箔１を接続した。２個のタンタル素
子のタンタル箔２は右側を上に折り、陽極端子板５に接
続し、スズ箔ｌは左側を上に折り、陰極端子板４に接続
し、絶縁樹脂７で外装して、２μＦのタンタルコンデン
サを作成した。Next, as shown in Fig. 1, a tantalum element with a rating of 35 V and 1 μF is placed on a flat surface, and a tin foil of 50 μm thick is placed on the cathode layer side.
connected. Connection with the tin foil 1 is made by a conductive resin layer 9 as shown in FIG. Place the insulating plate 6 on the tin foil 1, place another tantalum element with a rating of 35V and 1 μF on top of it with the tantalum foil 2 facing down, and connect the 50 μm thick tin foil 1 to the cathode layer side. did. The tantalum foils 2 of the two tantalum elements are folded upward on the right side and connected to the anode terminal plate 5, and the tin foil l is folded on the left side upward and connected to the cathode terminal plate 4, and covered with insulating resin 7. A 2 μF tantalum capacitor was created.
第３図は本発明の実施例２の縦断面図である。FIG. 3 is a longitudinal sectional view of Example 2 of the present invention.
この実施例では、第２図のタンタル素子を金属板２１上
に並べ、陰極層側に金属板１１を接続した構造にするこ
とにより、実施例１と比ベコンデンサ本体が底面積は大
きくなるが、厚くならないという利点がある。In this embodiment, the tantalum elements shown in Fig. 2 are arranged on a metal plate 21, and the metal plate 11 is connected to the cathode layer side, so that the capacitor body has a larger base area than in Example 1. , it has the advantage of not becoming thick.
以上説明したように本発明は、タンタル箔にタンタル焼
結体を接続した構造のタンタル素子を使用することによ
り、より量産的に、またより小型の並列接続構造のチッ
プ型固体電解コンデンサを得ることができる効果がある
。As explained above, the present invention makes it possible to obtain a chip-type solid electrolytic capacitor with a parallel connection structure that is more mass-producible and smaller by using a tantalum element having a structure in which a tantalum sintered body is connected to a tantalum foil. It has the effect of
第１図は本発明のチップ型固体電解タンタルコンデンサ
の縦断面図、第２図は、第１図中のタンタル素子部の拡
大図、第３図は本発明の実施例２の縦断面図、第４図は
従来例の縦断面図である。
１・・・スズ箔、２・・・タンタル箔、３・・・タンタ
ル焼結体、４゛・・・陰極端子板、５・・・陽極端子板
、６・・・絶縁板、７・・・絶縁樹脂、８・・・陰極層
、９・・・導電性樹脂層、１０・・・タンタル線、１１
・・・金属板、２１・・・金属板、３１・・・タンタル
焼結体、４１・・・陰極端子板、５１・・・陽極端子板
、２２・・・エンボス部。FIG. 1 is a longitudinal cross-sectional view of a chip-type solid electrolytic tantalum capacitor of the present invention, FIG. 2 is an enlarged view of the tantalum element portion in FIG. 1, and FIG. 3 is a longitudinal cross-sectional view of Example 2 of the present invention. FIG. 4 is a longitudinal sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1...Tin foil, 2...Tantalum foil, 3...Tantalum sintered body, 4'...Cathode terminal plate, 5...Anode terminal plate, 6...Insulating plate, 7... - Insulating resin, 8... Cathode layer, 9... Conductive resin layer, 10... Tantalum wire, 11
... Metal plate, 21 ... Metal plate, 31 ... Tantalum sintered body, 41 ... Cathode terminal plate, 51 ... Anode terminal plate, 22 ... Embossed part.
Claims (3)
を行ない、酸化膜，半導体層，導体層を順次形成して成
るタンタル素子を２個以上並列接続した構造を有するこ
とを特徴とするチップ型固体電解タンタルコンデンサ。1. A chip type characterized in that it has a structure in which two or more tantalum elements are connected in parallel, each of which is formed by press-molding tantalum powder on one side of tantalum foil and sintering it to sequentially form an oxide film, a semiconductor layer, and a conductor layer. Solid electrolytic tantalum capacitor.
該スズ箔を陰極端子板に接続し、タンタル箔の未酸化部
分を陽極端子にそれぞれ接続し並列接続を構成したこと
を特徴とする請求項１記載のチップ型固体電解タンタル
コンデンサ。2. Connect tin foil to the cathode layer of multiple tantalum elements,
2. The chip type solid electrolytic tantalum capacitor according to claim 1, wherein the tin foil is connected to the cathode terminal plate, and the unoxidized portions of the tantalum foil are connected to the anode terminal to form a parallel connection.
ル箔と金属板と接続し、陰極層に接続したスズ箔は上部
金属板に接続し並列接続を構成したことを特徴とする請
求項１記載のチップ型固体電解タンタルコンデンサ。3. The chip according to claim 1, characterized in that a plurality of tantalum elements are arranged on the lower metal and connected to the tantalum foil and the metal plate, and the tin foil connected to the cathode layer is connected to the upper metal plate to form a parallel connection. type solid electrolytic tantalum capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2291535A JPH04164308A (en) | 1990-10-29 | 1990-10-29 | Chip type solid electrolytic tantalum capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2291535A JPH04164308A (en) | 1990-10-29 | 1990-10-29 | Chip type solid electrolytic tantalum capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04164308A true JPH04164308A (en) | 1992-06-10 |
Family
ID=17770163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2291535A Pending JPH04164308A (en) | 1990-10-29 | 1990-10-29 | Chip type solid electrolytic tantalum capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04164308A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6351371B1 (en) | 1999-04-16 | 2002-02-26 | Matsushita Electric Industrial Co., Ltd. | Electrode for electrolytic capacitor |
| US20190252127A1 (en) * | 2018-02-12 | 2019-08-15 | Avx Corporation | Solid Electrolytic Capacitor for a Tantalum Embedded Microchip |
| WO2023189736A1 (en) * | 2022-03-28 | 2023-10-05 | 株式会社村田製作所 | Electrolytic capacitor |
-
1990
- 1990-10-29 JP JP2291535A patent/JPH04164308A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6351371B1 (en) | 1999-04-16 | 2002-02-26 | Matsushita Electric Industrial Co., Ltd. | Electrode for electrolytic capacitor |
| US6464739B2 (en) | 1999-04-16 | 2002-10-15 | Matsushita Electric Industrial Co., Ltd. | Electrode for electrolytic capacitor and process of producing the same |
| US20190252127A1 (en) * | 2018-02-12 | 2019-08-15 | Avx Corporation | Solid Electrolytic Capacitor for a Tantalum Embedded Microchip |
| US11257629B2 (en) * | 2018-02-12 | 2022-02-22 | KYOCERA AVX Components Corporation | Solid electrolytic capacitor for a tantalum embedded microchip |
| WO2023189736A1 (en) * | 2022-03-28 | 2023-10-05 | 株式会社村田製作所 | Electrolytic capacitor |
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