JPH04186644A - Assembling apparatus for semiconductor device - Google Patents

Abstract

PURPOSE:To enable accurate bonding by constituting an apparatus in such manner that the apparatus has the function of adjusting some misregistration of a bonding pad with lead after aligning a film carrier and semiconductor device to some degree and by bonding respective one-several leads while adjusting the misregistration. CONSTITUTION:Bonding is first conducted in a state where a bump 2a and inner lead 23a coincide with each other, and the next lead 23b is adjusted in position and aligned with a bump 2b. Similarly, bonding is conducted in such manner that the inner lead 23b and a bump 2b are bonded together and the next but one inner lead 23c and a bump 2c are aligned with each other. As a method for aligning leads at that time, a film carrier tape and semiconductor device 1 are placed in a fixed state, the inner lead 23 is caught by a clamper 6 and moved forcibly so as to be aligned with the bump 2, and bonding is conducted by a bonding tool 4.

Description

[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to a film carrier f! The present invention relates to an assembly apparatus for r:f semiconductor devices.

[Conventional technology]

Figures 5 and 6 show conventional T A B (Tape Au
FIG. 2 is a front view and a plan view of an assembly device using the toma ted Bondin) method.

In Figure VC, III is a half-unit element, 1! (31 is a film carrier, an inner lead' (Sa), a tape base material (31) is a protruding electrode formed on the semiconductor element 111,
3b) and a device hole (3C)'i.

・41 is a bonding tool for bonding the inner lead (3a) and the protruding electrode 12I, 15) is a stage for fixing the semiconductor element l1li, and (2a) to (2d) are protrusions'! very.

(13a) to (tsa) are inner leads. or,
(This is a denovo chair hole drilled in the 3aid tape base material (3b).

Next, the operation will be explained.

The figure is a schematic diagram of the TAB inner lead bonding method called single point bonding, and shows the position of the film carrier tape SL inner lead f3a) and the protruding electrode 21 of the semiconductor element 111 which is suctioned and fixed on the outer stay 61. Perform all the alignment, and perform all the ultrasonic bonding and heat/pressure bonding with the bonding tool (41) one lead at a time.

At this time, the pattern accuracy of the inner leads (8a) etc. formed on the film carrier tape 3) does not necessarily match the pitch sliding degree of the protruding electrodes (21) on the semiconductor element i). In the case of output terminals and four semiconductor elements on small pitch pads, even slight dimensional errors have a large effect, especially due to dimensional changes in the tape base material (3b) of the film carrier tape 13.

FIG. 6 shows a case where the center of the semiconductor element fi+ and the center of the pattern of the film carrier tape 3) coincide with each other, and the inner lead pitch of the film carrier tape 13) becomes slightly smaller. Here, inner lead r18
b), (IIC) and the protruding electrode [2b) (gc) are in positive position 6i! It fits, but the inner lead (13a)
(1!3d) and the protruding electrode (ga) (1#) are shown to be slightly misaligned (each side of the semiconductor element fi+ is also shown to be misaligned).

[Problem to be solved by the invention]

Since the conventional semiconductor device assembly system a is configured as described above, the inner leads and protruding electrodes are connected to each other, so even if the inner leads of the film carrier tape and the protruding electrodes are misaligned, it can be corrected. There was no machine ship, so the only option was to perform bonding in a slightly misaligned state, or to reject the film carrier tape. If the next bonding is performed while the position is misaligned, a short circuit may occur with the protruding electrode on the other side, leading to problems such as defective film carrier tapes, resulting in missing copies, and increased tape costs.

Father, in the case of outer lead bonding, it is the final few steps, and if the bonding is defective due to lead position deviation, the cost loss will be large.Since beam doming is performed in outer lead bonding, lead pitch deviation Since bonding is more likely to occur than inner leads, there have been problems such as bonding failures being more likely to occur.

Is there any problem like the above in this invention? A book was made to solve this problem, so it's a lead! Kuraguchi's objective is to modify 1M to obtain a semiconductor device assembly device that can accurately bond onto bonding pads.

[Means to solve the problem]

The semiconductor device assembly apparatus according to the present invention has a function of correcting a slight positional deviation between a bonding pad and a lead after aligning a film carrier and a semiconductor element to a certain degree, and has a function of correcting a slight positional deviation between a bonding pad and a lead while correcting the positional deviation. Bonding is performed one lead at a time.

[Effect]

The mechanism for correcting the relative position of the leads and bonding pads in this invention corrects positional deviations of the leads caused by shrinkage/expansion of the tape base material during production of the film carrier tape, dimensional changes due to photolithography, etc. Make sure to bond each lead one by one.

[Implementation-]]

An embodiment of the present invention will be described below with reference to the drawings. wc
1JLI-(d) are process front views showing the progress of bonding in a semiconductor device assembly apparatus according to an embodiment of the present invention. In the figure, )11 is a semiconductor element, (
ga) to (2e) form I2!2. on the semiconductor element DI.
(41 is a bonding tool for bonding) (2s~ (le) is an inner lead.

Figure 2. Figure 8 shows the positioning method shown in Figure 1.
(23a) ~ C23C) n innerly)", +
81 is a clamper for adjusting the reed position. Nt3
The inner lead in a) shows the position of the inner lead in (2sb) and the position before the rash.

Next, the operation will be explained.

Fig. 1&l is a diagram f showing the state before bonding.

Inner lead of film carrier tape (23a) ~
(g3e) shows a state in which the pitch of the IJ-ditch is different from the pitch of the protruding electrodes (2a) to (llc) of the semiconductor element Ill. Here, bonding is first performed with the protruding electrode (2a) and the inner lead (Ha) aligned, and then the next inner lead (23b) is bonded. Correct 1 and align with the protruding electrode (8b) (]b; figure)
. Similarly, the inner lead rgsb) and the protruding electrode (2b)
and the next inner lead (g3c
) and the protruding electrode (2C).
Bonding is performed as shown in (Figure +o1). The second method for positioning the leads at this time is
As shown in Figure 8, with the film carrier tape and the inside of the semiconductor element fixed, the inner lead! 3
clamper: 61, forcibly retract it, align it with the protruding electrode (21), and perform bonding with the bonding tool 14 (in the figure, the rH
The inner lead at position a) is grasped by Crano<-+S+ and corrected to position (Ll).

As the pitch, etc. of the inner leads becomes smaller, it becomes difficult to insert the clamper 181 between the leads, so as an alternative method, use a film carrier tape or a semiconductor element (1) for each bonding process. FIG. 4 shows a method in which bonding is carried out in a horizontal plane.

FIG. 4 11L1+b+ is a front view showing a positioning method according to another embodiment of the present invention.

Note that the numbers in the figure are 161 h @TI k, which are the same as the conventional one. In the figure, 171 indicates the moving direction of the stage, and (8) indicates the moving direction of the film carrier tape.

Figure 4 tjLI r1 When the semiconductor element Ill is aligned with the protrusion bipolar (2) to the inner lead (3a), the inner lead (8a) i protrusion The case of aligning to the position of one electrode is shown.

Although the above embodiments have been described using inner lead bonding as an example, the same mechanism can be applied to outer lead bonding performed after cutting the semiconductor device [--film carrier tape].

In addition, in the above implementation example, the clamper is used to correct the reed position, but since there is no need to hold the lead in 1), it is not necessary to hold the reed, so it is necessary to push the reed side horizontally with either the left or right side of the clamper. It may be a method.

〔Effect of the invention〕

As described above, according to the present invention, bonding is performed while correcting the 4Xf and @k1G of the inner lead or outer lead, so even if the lead pitch of the film carrier tape and the bonding pad pitch are slightly different, VC is used to ensure bonding, and semiconductor devices can be manufactured at a high yield without short circuits.Furthermore, because there are fewer defective film carrier tapes, it is possible to assemble semiconductor devices at a lower cost than before. It is effective◇

[Brief explanation of drawings]

FIG. 1 is a process front view showing the progress of bonding in a semiconductor device assembly apparatus according to an embodiment of the present invention, and FIGS. 2 and 8 are diagrams showing the positional deviation adjustment mechanism of FIG. Other embodiments of the invention are shown in front and plan views, FIG. 5 and 6 are a front view and a plan view of a conventional semiconductor device assembly apparatus. In the figure, (1) is a semiconductor element, (3a) to (2e)
is a protrusion tffi, 131 is a film carrier tape, 1
ea) o:tzi is the inner lead, 14) is the bonding tool, +U is the stage, (61 is the clamper, (
7) indicates the moving direction of the stage, and (8) indicates the moving direction of the Hafilm carrier tape.

Claims (1)

[Claims] In a semiconductor device assembly apparatus using a TAB method using a film carrier tape, the inner lead of the film carrier tape and the bonding pad of the semiconductor element, or the outer lead and the bonding pad of the substrate after the semiconductor device is partially separated from the film carrier tape. Equipped with a mechanism to correct the relative positional deviation of
A semiconductor device assembly device characterized by performing bonding.