JPH0418443U - - Google Patents
Info
- Publication number
- JPH0418443U JPH0418443U JP5855690U JP5855690U JPH0418443U JP H0418443 U JPH0418443 U JP H0418443U JP 5855690 U JP5855690 U JP 5855690U JP 5855690 U JP5855690 U JP 5855690U JP H0418443 U JPH0418443 U JP H0418443U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heating means
- temperature sensor
- substrate holder
- forming apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims 1
- 230000035515 penetration Effects 0.000 claims 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
Description
第１図は本考案の一実施例による基板温度測定
装置が採用されたプラズマＣＶＤ装置の縦断面部
分図、第２図は第１図の一部拡大図である。
１……チヤンバ、９……加熱手段、１０，１１
……熱板、１２……ヒータ、１６……基板ホルダ
、２２……付勢手段、２３……熱電対、２４……
ＰＢＮ、２７……スプリング、３０……基板。
FIG. 1 is a partial longitudinal sectional view of a plasma CVD apparatus employing a substrate temperature measuring device according to an embodiment of the present invention, and FIG. 2 is a partially enlarged view of FIG. 1. 1... Chamber, 9... Heating means, 10, 11
... Hot plate, 12 ... Heater, 16 ... Substrate holder, 22 ... Biasing means, 23 ... Thermocouple, 24 ...
PBN, 27... Spring, 30... Board.
Claims (1)
板ホルダに保持された基板上に成膜を行う成膜装
置の基板温度測定装置であつて、 前記加熱手段の裏面から表面にかけて貫通する
貫通孔を貫通して設けられた温度センサと、 前記温度センサの加熱手段貫通部外周を覆うよ
うに設けられ、前記加熱手段からの熱を、遮断す
る断熱部材と 前記温度センサを、加熱手段の基板ホルダが接
触する面側に付勢する温度センサ付勢手段と、 を備えた成膜装置の基板温度測定装置。[Claims for Utility Model Registration] A substrate temperature measuring device for a film forming apparatus that forms a film on a substrate held by the substrate holder by bringing a substrate holder into pressure contact with a heating means, the device comprising: a temperature sensor provided through a through hole extending through the surface; a heat insulating member provided to cover the outer periphery of the heating means penetration portion of the temperature sensor and blocking heat from the heating means; A substrate temperature measuring device for a film forming apparatus, comprising: a temperature sensor biasing device biasing a surface of the heating device that contacts a substrate holder;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5855690U JPH0418443U (en) | 1990-05-31 | 1990-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5855690U JPH0418443U (en) | 1990-05-31 | 1990-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0418443U true JPH0418443U (en) | 1992-02-17 |
Family
ID=31584276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5855690U Pending JPH0418443U (en) | 1990-05-31 | 1990-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0418443U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008064551A (en) * | 2006-09-06 | 2008-03-21 | Tokyo Electron Ltd | Temperature measuring apparatus |
-
1990
- 1990-05-31 JP JP5855690U patent/JPH0418443U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008064551A (en) * | 2006-09-06 | 2008-03-21 | Tokyo Electron Ltd | Temperature measuring apparatus |
| TWI403702B (en) * | 2006-09-06 | 2013-08-01 | Tokyo Electron Ltd | Temperature measuring device |
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