JPH02129731U - - Google Patents
Info
- Publication number
- JPH02129731U JPH02129731U JP3808689U JP3808689U JPH02129731U JP H02129731 U JPH02129731 U JP H02129731U JP 3808689 U JP3808689 U JP 3808689U JP 3808689 U JP3808689 U JP 3808689U JP H02129731 U JPH02129731 U JP H02129731U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thin film
- heat equalizing
- equalizing member
- holding frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 239000010409 thin film Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 238000002791 soaking Methods 0.000 description 1
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
第１図および第２図は本考案の一実施例にかか
り、第１図は基板ホルダを示す縦断面図、第２図
は基板が反つた状態を示す部分断面図である。第
３図は本考案の他の実施例の基板ホルダを示す縦
断面図である。また、第４図は従来例の基板ホル
ダを示す縦断面図である。
１……チヤンバ、３……保持枠、５……基板、
５１……基板の背面、５２……基板の表面、６…
…ヒータ、７……均熱板、７１……基板当接面。
1 and 2 show an embodiment of the present invention, in which FIG. 1 is a vertical sectional view showing a substrate holder, and FIG. 2 is a partial sectional view showing the substrate in a warped state. FIG. 3 is a longitudinal sectional view showing a substrate holder according to another embodiment of the present invention. Further, FIG. 4 is a longitudinal sectional view showing a conventional substrate holder. 1...Chamber, 3...Holding frame, 5...Substrate,
51... Back side of the board, 52... Front side of the board, 6...
... Heater, 7 ... Soaking plate, 71 ... Board contact surface.
Claims (1)
成すべき基板が装着される保持枠と、保持枠内部
に設けられ前記基板を加熱する加熱手段と、前記
基板の膜形成面の背面に当接され該基板を均一に
加熱させるための均熱部材とを具備した基板ホル
ダにおいて、 前記均熱部材の基板当接面を、基板とそれに形
成する被膜との両熱膨張率の差により生じる基板
の反りを相殺する形状に湾曲形成し、かつこの均
熱部材と基板とを圧接させる外圧付与手段を設け
たことを特徴とする薄膜形成装置の基板ホルダ。[Claims for Utility Model Registration] A holding frame disposed in a chamber of a thin film forming apparatus on which a substrate on which a thin film is to be formed is attached, a heating means provided inside the holding frame for heating the substrate, and a film of the substrate. In a substrate holder equipped with a heat equalizing member that is in contact with the back surface of the forming surface and uniformly heats the substrate, the substrate contacting surface of the heat equalizing member is arranged to absorb the thermal expansion of both the substrate and the coating formed on the substrate. 1. A substrate holder for a thin film forming apparatus, characterized in that the substrate holder is curved in a shape to offset the warpage of the substrate caused by a difference in rate, and is provided with an external pressure applying means for bringing the heat equalizing member and the substrate into pressure contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3808689U JPH02129731U (en) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3808689U JPH02129731U (en) | 1989-03-31 | 1989-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129731U true JPH02129731U (en) | 1990-10-25 |
Family
ID=31545778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3808689U Pending JPH02129731U (en) | 1989-03-31 | 1989-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129731U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007502538A (en) * | 2003-08-11 | 2007-02-08 | 東京エレクトロン株式会社 | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
-
1989
- 1989-03-31 JP JP3808689U patent/JPH02129731U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007502538A (en) * | 2003-08-11 | 2007-02-08 | 東京エレクトロン株式会社 | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02129731U (en) | ||
| JPS57785A (en) | Manufacture of information recording card | |
| JPH0460552U (en) | ||
| JPS62172021U (en) | ||
| JPS6157516U (en) | ||
| JPH0350440U (en) | ||
| JPS59168136U (en) | High temperature sample optical detection device | |
| JPH0455792U (en) | ||
| JPS61135137U (en) | ||
| JPS59157820U (en) | Transfer printing device | |
| JPH01122947U (en) | ||
| JPS6131836U (en) | Thermal transfer recording device | |
| JPS6351852B2 (en) | ||
| JPH021839U (en) | ||
| JPH0664143A (en) | Transfer base | |
| SU1750265A1 (en) | DEVICE FOR APPLYING THERMAL DIFFUSION COATING | |
| JPH0415539U (en) | ||
| JPS6147710B2 (en) | ||
| JPS63128690U (en) | ||
| JPH033744U (en) | ||
| JPS63176631U (en) | ||
| JPS58136494A (en) | Method and apparatus for relief printing | |
| JPS625635U (en) | ||
| JPS5829736U (en) | Formwork with built-in heating means | |
| JPH0330260U (en) |