JPH04182087A - Condensing device for laser beam machining - Google Patents
Condensing device for laser beam machiningInfo
- Publication number
- JPH04182087A JPH04182087A JP2312132A JP31213290A JPH04182087A JP H04182087 A JPH04182087 A JP H04182087A JP 2312132 A JP2312132 A JP 2312132A JP 31213290 A JP31213290 A JP 31213290A JP H04182087 A JPH04182087 A JP H04182087A
- Authority
- JP
- Japan
- Prior art keywords
- mirror
- laser
- laser beam
- condensing device
- beams
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 title 1
- 230000002265 prevention Effects 0.000 claims description 4
- 238000009826 distribution Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、レーザ加工用集光装置に係り、特にレーザ溶
接用に適するレーザ加工用集光装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a condensing device for laser processing, and particularly to a condensing device for laser processing suitable for laser welding.
（従来の技術及び解決しようとする課題）従来より、レ
ーザによる熱源は、溶接１表面改質等々の様々な加工用
途に利用されており、熱源としてもＣ○２レーザ、ＹＡ
Ｇレーザ等々の種々のものが利用されている。(Prior art and problems to be solved) Conventionally, laser heat sources have been used for various processing applications such as welding and surface modification, and heat sources such as C○2 laser and YA
Various types such as G laser are used.
従来、Ｃ○２レーザ等の高出力レーザの集光系には、球
面又は放物面のミラーやＺｎ５ｅ等のレンズが用いられ
ており、これらによってレーザビームを絞って、パワー
密度を上げた状態で溶接等に利用されていた。Conventionally, spherical or parabolic mirrors and lenses such as Zn5e have been used in the condensing systems of high-power lasers such as C○2 lasers, which narrow down the laser beam and increase the power density. It was used for welding, etc.
しかし、このようなビーム系では、表面処理鋼板等の溶
接の場合、溶接欠陥が発生し易いという問題があり、ま
た、ＡＱ等の熱伝導率の良い金属の溶接の場合にはビー
トが乱れるという問題があった。更に、高張力鋼板等の
溶接の場合、溶接金属や熱影響部（ＨＡＺ）が硬化する
という問題があった・
その原因は、従来のレーザビーム集光装置では、一定の
強度パターンでしか集光できず、任意の強度パターンが
得られないので５種々の加工態様に適した対応が不可能
なためである。However, with such a beam system, there is a problem that welding defects are likely to occur when welding surface-treated steel plates, etc., and the beat is disturbed when welding metals with good thermal conductivity such as AQ. There was a problem. Furthermore, when welding high-strength steel plates, etc., there was a problem of hardening of the weld metal and heat-affected zone (HAZ). This is because it is not possible to obtain a desired intensity pattern, and it is therefore impossible to respond appropriately to various processing modes.
そこで、従来は、複雑なスキャン機構を取付けてレーザ
ビームをスキャニング（振動）させて対応していた。し
かし、スキャン機構は高価であり、装置のコスト高をも
たらしていた。Conventionally, this problem has been dealt with by installing a complicated scanning mechanism to scan (vibrate) the laser beam. However, the scanning mechanism is expensive, resulting in an increase in the cost of the device.
一方、他の問題として、溶接施工時に溶接スパッタがレ
ンズやミラーに付着して損傷するので、高価なレンズや
ミラーを頻繁に交換する必要があり、コスト高であった
。On the other hand, another problem is that welding spatter adheres to lenses and mirrors during welding and damages them, making it necessary to frequently replace expensive lenses and mirrors, resulting in high costs.
本発明は、上記従来技術の問題点を解決して。The present invention solves the problems of the prior art described above.
任意のビーム強度パターンが容易に得られる安価なレー
ザ加工用集光装置を提供することを目的とするものであ
る。The object of the present invention is to provide an inexpensive condensing device for laser processing that can easily obtain an arbitrary beam intensity pattern.
（課題を解決するための手段）
前記課題を解決するため、本発明者等は、レーザビーム
系について鋭意研究を重ねた結果、ここに本発明をなし
たものである。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present inventors have conducted extensive research on laser beam systems, and have hereby accomplished the present invention.
すなわち、本発明は、レーザ発振器からのレーザビーム
を全反射ミラーにて屈曲させ、これを更に他のミラーに
て反射させて加工部に集光させるレーザビーム系におい
て、後者の他のミラーとして、二重焦点ミラーを用いる
ことにより、２つのビームに分割して集光させる構成に
したことを特徴とするレーザ加工用集光装置を要旨とす
るものである。That is, the present invention provides a laser beam system in which a laser beam from a laser oscillator is bent by a total reflection mirror, and further reflected by another mirror to be focused on a processing part. The gist of the present invention is a condensing device for laser processing, which is characterized by having a configuration in which the beam is divided into two beams and condensed by using a bifocal mirror.
また、レーザビーム方向と同軸方向又は交差する方向に
ガスを流すスパッタ付着防止装置を集光ビームの回りに
設けたことを特徴とするものである。Further, the present invention is characterized in that a sputter adhesion prevention device is provided around the condensed beam to flow gas in a direction coaxial with or perpendicular to the direction of the laser beam.
以下に本発明を更に詳細に説明する。The present invention will be explained in more detail below.
（作用） 前述のように、従来のレーザビーム集光装置は。(effect) As mentioned above, the conventional laser beam focusing device.
レーザ発振器からのレーザビームを１枚のレンズ（球面
レンズ、放物面レンズ）又はミラー（球面ミラー、放物
面ミラー）を用いて集光するビーム系であるので、一定
のビーム強度分布のものしが得られない。Since this is a beam system that focuses the laser beam from a laser oscillator using a single lens (spherical lens, parabolic lens) or mirror (spherical mirror, parabolic mirror), it has a constant beam intensity distribution. I can't get it.
一方、本発明は、１枚のレンズ又はミラーに代えて、全
反射ミラーと二重焦点ミラーとを組合せて用いるビーム
系とし、二重焦点ミラーによって２つのビームに分割し
てこれらを集光させるので。On the other hand, the present invention uses a beam system that uses a combination of a total reflection mirror and a bifocal mirror instead of one lens or mirror, and the bifocal mirror splits the beam into two beams and focuses them. So.
各ビームのビーム強度パターンを任意に組合せて種々の
ビーム強度パターンを得ることが可能である。It is possible to obtain various beam intensity patterns by arbitrarily combining the beam intensity patterns of each beam.
第１図は本発明のレーザビーム系の一例を示したもので
、レーザ発振器からのレーザビームを、まず全反射ミラ
ーｌにて反射させ、次いで二重焦点ミラー２．３にて反
射させて２つのビームに分割し、これらを集光させるビ
ーム系である。したがって、１つのビームを分割した２
つのビームをそれぞれ微小距離（Ｑ：１〜５ＩＩＩ１１
程度）離れた２つの点に集光させることができる。FIG. 1 shows an example of a laser beam system according to the present invention, in which a laser beam from a laser oscillator is first reflected by a total reflection mirror 1, then reflected by a bifocal mirror 2.3. This is a beam system that splits into two beams and focuses them. Therefore, one beam is divided into two
two beams each at a very small distance (Q:1~5III11
It is possible to focus light on two distant points.
全反射ミラーとしては、ビームを屈曲させるミラーであ
れば如何なるものでもよい。Any mirror that bends the beam may be used as the total reflection mirror.
二重焦点ミラーとしては、適当なミラーを２枚組み合わ
せて構成し、放物面ミラー、球面ミラー及びセミシリン
ドリカルミラーなどを２枚組合せて用いられる。表面に
Ｃｕや、Ａｕなどの貴金属を被覆したミラーでよいので
安価で耐久性もよい。The bifocal mirror is constructed by combining two suitable mirrors, and is used by combining two parabolic mirrors, spherical mirrors, semi-cylindrical mirrors, etc. A mirror whose surface is coated with a noble metal such as Cu or Au may be used, so it is inexpensive and has good durability.
２枚のミラーは、同じ焦点距離のミラーが好ましく、例
えば、１枚のミラーを半分に分割し、第１図に示すよう
に両者が僅かに重なるように配列する。The two mirrors preferably have the same focal length; for example, one mirror is divided into halves and arranged so that the two mirrors slightly overlap each other as shown in FIG.
ここで、セミシリンドリカルミラーとは、通常のシリン
ドリカルミラーが有する曲率方向と直交する方向にも曲
率を設けたミラーを云う。すなわち、全体が第２図に示
すような形状のミラーであり、そのＡ断面は第３図に示
すようにシリンドリカル面（円柱側面）が曲率ｆの局面
を有し、Ｂ断面は第４図に示すようにシリンドリカル面
がａＸｆの曲率（１＜ａ）を有している。このａの値が
大きいほど、第５図に示すようにｙ軸方向（Ｂ断面方向
）のビーム幅を拡げることができる。Here, the semi-cylindrical mirror refers to a mirror that also has curvature in a direction orthogonal to the curvature direction of a normal cylindrical mirror. In other words, the entire mirror is shaped as shown in Figure 2, and its cross-section A has a cylindrical surface (cylindrical side surface) with a curvature f as shown in Figure 3, and the cross-section B has a curve as shown in Figure 4. As shown, the cylindrical surface has a curvature of aXf (1<a). The larger the value of a, the wider the beam width in the y-axis direction (cross-sectional direction B), as shown in FIG.
また、２枚のミラーは、第１図に示すように、各々を回
転可能にしたり、或いは加工線方向（Ｘ軸方向）に移動
可能にすることができる。回転角度は僅かでよい。また
、回転軸の高さをそれぞれ変えたり１曲率を変えたりし
て、加工部上に焦点を作ることも可能である。Furthermore, as shown in FIG. 1, the two mirrors can each be made rotatable or movable in the processing line direction (X-axis direction). The rotation angle may be small. It is also possible to create a focal point on the processing part by changing the height or curvature of the rotating shafts.
本発明のレーザビーム集光系は上述の構成であるので、
以下のような利用態様が可能である。Since the laser beam focusing system of the present invention has the above-mentioned configuration,
The following usage modes are possible.
まず、二重焦点ミラーに入る前のビーム強度分布が第６
図に示すようなビーム強度パターンの場合、二重焦点ミ
ラーの２枚のミラーを回転することにより、例えば第７
図、第８図、第９図に示すように、１つのビームを２点
に集光でき、しかも、各ビームのビーム強度と距離を変
えた種々のビーム強度パターンを得ることができる。第
７図は２つのビームの距離を比較的大きくした場合、第
８図は近接した場合、第９図は重なるようにした場合で
ある。First, the beam intensity distribution before entering the bifocal mirror is
For the beam intensity pattern shown in the figure, for example, by rotating two mirrors of the bifocal mirror,
As shown in FIGS. 8 and 9, one beam can be focused on two points, and various beam intensity patterns can be obtained by changing the beam intensity and distance of each beam. FIG. 7 shows a case where the distance between the two beams is relatively large, FIG. 8 shows a case where they are close to each other, and FIG. 9 shows a case where they overlap.
したがって、２つのビームのうち弱い強度パターンのビ
ームを予熱処理、後熱処理などに利用できる。また、表
面処理鋼板の溶接の場合は、弱い強度パターンで表面皮
膜を除去した後に強い強度パターンのビームで本溶接す
ることにより、皮膜に起因する溶接欠陥を防止できる。Therefore, of the two beams, the beam with the weaker intensity pattern can be used for preheating treatment, post-heating treatment, etc. Furthermore, in the case of welding surface-treated steel sheets, welding defects caused by the coating can be prevented by removing the surface coating using a weak intensity pattern and then performing main welding using a beam with a strong intensity pattern.
更には、溶融池内対流の制御にも利用できる。Furthermore, it can also be used to control convection within the molten pool.
なお、第６図の場合のビーム強度分布はｆＩｏｄＶ＝ｆ
工、ｄｖ工＋ｆ■２ｄＶ２で表わすことができ、第７図
〜第９図の場合、それぞれ図中左側のものはｆ１１ｄｖ
工、右側のものはｆ Ｉ２ｄ ｖ２と表わすことができ
る。Note that the beam intensity distribution in the case of Fig. 6 is fIodV=f
In the case of Figures 7 to 9, the left side in each figure is f11dv.
The one on the right can be expressed as f I2d v2.
また、二重焦点ミラーの２枚のミラーをＸ軸方向に平行
移動させることにより、第１ビームと第２ビームの強度
比を連続的に変えることができる。Further, by moving the two mirrors of the bifocal mirror in parallel in the X-axis direction, the intensity ratio of the first beam and the second beam can be continuously changed.
更に、二重焦点ミラーとしてセミシリンドリカルミラー
を２枚組み合わせることにより、第５図に示すようにセ
ミシリンドリカルミラーが焦点におけるＸ軸方向の幅を
狭くし及びｙ軸方向の幅を広くできるので、母材にギャ
ップのある溶接や、フィラーワイヤを用いる溶接に応用
できる。Furthermore, by combining two semi-cylindrical mirrors as a bifocal mirror, the semi-cylindrical mirror can narrow the width in the X-axis direction and widen the width in the y-axis direction at the focal point, as shown in FIG. It can be applied to welding with gaps in materials and welding using filler wire.
第１０図は上述のビーム系に設けるスパッタ付着防止装
置を示している。この装置は、二重焦点ミラーで反射し
た集光ビームの回りにガス流通部材４を配置したもので
ある。レーザビーム方向と同軸方向に流す場合（ａ）に
は、環状部材４の流出口をビームと同軸方向に向けるよ
うにする。一方、レーザビーム方向と交差する方向に流
す場合（ｂ）には、交差する方向に一対のガス流出口と
ガス吸引口をビーム周囲に対向させ、ガス流出口からガ
スを噴出させて、これをガス吸引口に吸引する構成にす
る。溶接スパッタは加工部からほぼ上方に飛散するので
、レーザビームと同軸方向にガスを流すのが好ましい。FIG. 10 shows a sputter adhesion prevention device provided in the above-mentioned beam system. In this device, a gas flow member 4 is arranged around a condensed beam reflected by a bifocal mirror. When flowing in the direction coaxial with the laser beam direction (a), the outlet of the annular member 4 is directed in the coaxial direction with the beam. On the other hand, when flowing in a direction that intersects the laser beam direction (b), a pair of gas outlets and a gas suction port are placed opposite to each other around the beam in the intersecting direction, and the gas is ejected from the gas outlet. Configure the gas to be sucked into the gas suction port. Since welding spatter is scattered almost upward from the processed area, it is preferable to flow the gas in the same axis direction as the laser beam.
ガスとしてはＮ２、Ａｒ−Ｈｅなどの不活性ガスが用い
られる。ガスを流す速度は適宜法められる。As the gas, an inert gas such as N2 or Ar-He is used. The speed at which the gas flows is determined as appropriate.
（発明の効果）
以上詳述したように、本発明によれば、二重焦点ミラー
用いて１つのビームを２つのビームに分割して集光させ
るので、ビーム強度及び距離の異なる種々のビーム強度
分布が得られる。また、複雑で高価なスキャン機構を必
要とせず、全体の機構が簡易であり、スパッタ付着防止
も可能であるのでミラーの耐久性が向上でき、経済的で
ある６(Effects of the Invention) As detailed above, according to the present invention, one beam is divided into two beams and focused using a bifocal mirror, so that various beam intensities with different beam intensities and distances can be generated. distribution is obtained. In addition, the overall mechanism is simple without requiring a complicated and expensive scanning mechanism, and it is possible to prevent spatter adhesion, improving the durability of the mirror and being economical6.
第１図は本発明のレーザビーム系の構成例を示す説明図
、
第２図〜第４図はセミシリンドリカルミラーを説明する
図で、第２図は斜視図、第３図は第２図のＡ断面図、第
４図は第２図のＢ断面図であり。
第５図は二重焦点ミラーとしてセミシリンドリカルミラ
ーを用いた場合に集光されるビームの強度パターンを示
す図。
第６図は二重焦点ミラーに入る前のビーム強度分布を示
す図、
第７図〜第９図は二重焦点ミラーにより得られる異なる
ビーム強度分布の例を示す図、第１０図（ａ）、（ｂ）
はスパッタ付着防止装置を示す説明図である。
１・・・全反射ミラー、２．３・・・二重焦点ミラー、
４・・ガス流通部材。
第１図
第２図 第３図
↓′
第４図
第６図
第７図 第８図
第９図
第１０図
（ａ） （ｂ）FIG. 1 is an explanatory diagram showing a configuration example of a laser beam system of the present invention, FIGS. 2 to 4 are diagrams explaining a semi-cylindrical mirror, FIG. 2 is a perspective view, and FIG. 3 is a diagram similar to that of FIG. A sectional view, and FIG. 4 are B sectional views of FIG. 2. FIG. 5 is a diagram showing the intensity pattern of a beam focused when a semi-cylindrical mirror is used as a bifocal mirror. Figure 6 is a diagram showing the beam intensity distribution before entering the bifocal mirror, Figures 7 to 9 are diagrams showing examples of different beam intensity distributions obtained by the bifocal mirror, and Figure 10 (a). ,(b)
FIG. 2 is an explanatory diagram showing a sputter adhesion prevention device. 1... Total reflection mirror, 2.3... Bifocal mirror,
4. Gas distribution components. Figure 1 Figure 2 Figure 3 ↓' Figure 4 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 (a) (b)
Claims (4)
にて屈曲させ、これを更に他のミラーにて反射させて加
工部に集光させるレーザビーム系において、後者の他の
ミラーとして、二重焦点ミラーを用いることにより、２
つのビームに分割して集光させる構成にしたことを特徴
とするレーザ加工用集光装置。(1) In a laser beam system in which a laser beam from a laser oscillator is bent by a total reflection mirror, and further reflected by another mirror to focus it on the processing area, the other mirror of the latter is a double focal point. By using a mirror, 2
A condensing device for laser processing, characterized by having a configuration in which the light is divided into two beams and condensed.
びセミシリンドリカルミラーのうちのいずれかで、かつ
、２枚を組み合わせて用いる請求項１に記載のレーザ加
工用集光装置。(2) The condensing device for laser processing according to claim 1, wherein the bifocal mirror is any one of a parabolic mirror, a spherical mirror, and a semi-cylindrical mirror, and two of them are used in combination.
に移動可能に設けた請求項２に記載のレーザ加工用集光
装置。(3) The condensing device for laser processing according to claim 2, wherein the two mirrors are provided rotatably or movably in the processing direction.
ガスを流すスパッタ付着防止装置を集光ビームの回りに
設けた請求項１に記載のレーザ加工用集光装置。(4) The condensing device for laser processing according to claim 1, further comprising a sputter adhesion prevention device that causes gas to flow in a direction coaxial with or perpendicular to the direction of the laser beam, provided around the condensed beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2312132A JPH04182087A (en) | 1990-11-17 | 1990-11-17 | Condensing device for laser beam machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2312132A JPH04182087A (en) | 1990-11-17 | 1990-11-17 | Condensing device for laser beam machining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04182087A true JPH04182087A (en) | 1992-06-29 |
Family
ID=18025639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2312132A Pending JPH04182087A (en) | 1990-11-17 | 1990-11-17 | Condensing device for laser beam machining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04182087A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5378582A (en) * | 1992-09-29 | 1995-01-03 | Bausch & Lomb Incorporated | Symmetric sweep scanning technique for laser ablation |
| US5498508A (en) * | 1992-09-29 | 1996-03-12 | Bausch & Lomb Incorporated | Symmetric scanning technique for laser ablation |
| FR2746047A1 (en) * | 1996-03-13 | 1997-09-19 | Alphatech Ind Sa | Bifocal optomechanical head for laser welding and cutting |
| EP0865863A1 (en) * | 1997-03-19 | 1998-09-23 | Alphatech-Industrie | Bifocalisation-Optics-Head |
| US5841097A (en) * | 1995-12-27 | 1998-11-24 | Toyota Jidosha Kabushiki Kaisha | Process and apparatus for welding workpieces with two or more laser beams whose spots are oscillated across welding direction |
| DE10261422A1 (en) * | 2002-12-30 | 2004-07-08 | Volkswagen Ag | Laser welding and soldering method involves adjusting sub-beams in respect of their energy distribution, focal point rotation and/or working point separation by adjusting beam separating devices |
| EP2774712A1 (en) * | 2013-03-07 | 2014-09-10 | Siemens Aktiengesellschaft | Laser method with different laser beam areas within a beam |
| EP2774713A1 (en) * | 2013-03-07 | 2014-09-10 | Siemens Aktiengesellschaft | Laser method with different laser beam areas within a beam and devices |
-
1990
- 1990-11-17 JP JP2312132A patent/JPH04182087A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5378582A (en) * | 1992-09-29 | 1995-01-03 | Bausch & Lomb Incorporated | Symmetric sweep scanning technique for laser ablation |
| US5498508A (en) * | 1992-09-29 | 1996-03-12 | Bausch & Lomb Incorporated | Symmetric scanning technique for laser ablation |
| US5841097A (en) * | 1995-12-27 | 1998-11-24 | Toyota Jidosha Kabushiki Kaisha | Process and apparatus for welding workpieces with two or more laser beams whose spots are oscillated across welding direction |
| FR2746047A1 (en) * | 1996-03-13 | 1997-09-19 | Alphatech Ind Sa | Bifocal optomechanical head for laser welding and cutting |
| EP0865863A1 (en) * | 1997-03-19 | 1998-09-23 | Alphatech-Industrie | Bifocalisation-Optics-Head |
| DE10261422B4 (en) * | 2002-12-30 | 2014-04-03 | Volkswagen Ag | Laser welding and soldering method and device |
| DE10261422A1 (en) * | 2002-12-30 | 2004-07-08 | Volkswagen Ag | Laser welding and soldering method involves adjusting sub-beams in respect of their energy distribution, focal point rotation and/or working point separation by adjusting beam separating devices |
| EP2774712A1 (en) * | 2013-03-07 | 2014-09-10 | Siemens Aktiengesellschaft | Laser method with different laser beam areas within a beam |
| EP2774713A1 (en) * | 2013-03-07 | 2014-09-10 | Siemens Aktiengesellschaft | Laser method with different laser beam areas within a beam and devices |
| WO2014135358A1 (en) * | 2013-03-07 | 2014-09-12 | Siemens Aktiengesellschaft | Laser method with different laser beam areas within a beam and devices |
| WO2014135362A1 (en) * | 2013-03-07 | 2014-09-12 | Siemens Aktiengesellschaft | Laser method with different laser beam areas within a beam |
| US9884391B2 (en) | 2013-03-07 | 2018-02-06 | Siemens Aktiengesellschaft | Laser method with different laser beam areas within a beam and devices |
| US10144092B2 (en) | 2013-03-07 | 2018-12-04 | Siemens Aktiengesellschaft | Laser method with different laser beam areas within a beam |
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