JPH04181985A - Liquid crystal display device - Google Patents

Abstract

PURPOSE:To reduce the size of the entire part of a panel by providing a driving circuit constituted of a 2nd switch means which is extended from a 2nd connecting electrode group and has substantially the same structure as the structure of a 1st switch means. CONSTITUTION:First TFTs, display electrodes, gate lines, drain lines, and auxiliary capacities, etc., are formed on a 1st glass substrate 11 and a counter electrode is formed on a 2nd glass substrate 12. The 1st and 2nd glass substrates 11, 12 are stuck to each other and a liquid crystal is packed between these substrates. The 1st connecting electrode group 13 is formed of ITO on the rear side of the 1st glass substrate 11. An insulating substrate 15 formed with the 2nd connecting electrode group 14 superposed on the 1st connecting electrode group 13 at the end is electrically connected by, for example, an anisotropic electric conductive resin or solder, etc., to the periphery of the 1st glass substrate 11. This insulating substrate 15 is preferably formed of the glass which is substantially the same material as the material of the 1st glass substrate 11. The formation of the panel to the finer sizes is possible in this way and the size over the entire part of the panel is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a liquid crystal display device, and particularly relates to the arrangement structure around the panel.

(b) Prior art In recent years, flat-type liquid crystal display devices for lamp-top computers, televisions, etc. have been studied and commercialized.

The main reason for these products is that they are thin and lightweight, and each company is focusing on this point in their development.

An example of this is the liquid crystal display device disclosed in Japanese Unexamined Patent Publication No. 02-29621.The structure thereof will be explained below with reference to FIG.

First, a pair of glass substrates (41) are filled with liquid crystal.
, (42+ so-called liquid crystal) <The flannel is sandwiched between a pair of cabinets, but for the sake of clarity, the drawing of this Tojabi Poetry/Nodo is omitted here.

Next, on the glass substrate (41+1421), a spacer (
A printed circuit board (44) is provided via the spacer (43), and since the spacer (43) and printed circuit board (44) employ the Batterite method, they have a ring shape with a hollow center.

Also, on the side of this glass substrate (41), a thin flexible substrate ( 46) is the substrate (43), (44)
) is bent to cover the sides.

The flexible substrate (46) is made of a resin such as polyimide, and its surface is formed into a copper foil or a predetermined shape, and the copper foil is decorated with gold or tin patterns. Further, both sides of the flexible substrate (46) are formed of the above-mentioned copper foil, and connection electrode groups are formed perpendicularly to the sides.
One group of connection electrodes is connected to the first group of connection electrodes (45) on the glass substrate, and the other group of connection electrodes is connected to the electrodes on the printed circuit board.

(c) Problems to be Solved by the Invention Here, an IC chip (47) for driving the LCD is mounted on the flexible substrate (46).

The output of this IC is led out to a group of connection electrodes on one side of the flexible substrate (46). Further, this connection electrode group and the first connection electrode group (45) provided on the glass substrate (41) are bonded together by applying heat, pressure, etc. via an anisotropic conductive film or the like.

Naturally, this IC chip is thick, and for this reason, there is a problem in that the spacer must be formed thickly.

In addition, if the output of the JC is 240 or more, the number of electrodes in one connection electrode group provided on the flexible substrate (46) will need to be 240 or more, and the pinch of the connection electrode group will be
For example, it becomes 0.2 mm or less. However, as the number of pixels increases and the size becomes smaller, there is a limit to the method of etching copper foil, and it is difficult to contact the first connection electrode group (45) with one of the connection electrode groups of the flexible substrate (46). There was a problem.

(d) Further means for solving the problems The present invention has been made in view of the above-mentioned problems.
A pair of transparent insulating substrates [11L N
2).

The first connection electrode group (13) formed on the side of this transparent insulating substrate (11) and the transparent insulating □ substrate (11) corresponding to this first connection electrode group (]3) and the end portion An overlapping insulating substrate (15), a second connection electrode group (14) formed at the end of this insulating substrate (15), and a second connection electrode group (14) extending from the second connection electrode group (14), 1
The first connection electrode group (13) and the second connection electrode group (14) are electrically connected to a drive circuit comprising at least a second switch means having substantially the same structure as the switch means of This problem is solved by having a connecting means.

(e) Effect: For example, the material of the insulating substrate (15) is a glass substrate filled with liquid crystal, and the drive circuit is formed in a small amount (also By doing so, the IC chip (47) used in the conventional example becomes unnecessary, and the spacer (43) can be used without considering the thickness of the IC chip (47).

Furthermore, the method for forming TFTs and the like allows for further miniaturization than the method of etching copper foil, so it is possible to cope with an increase in the number of pixels and miniaturization of the size, and the overall size of the panel can be reduced.

Embodiments Below, embodiments of the present invention will be described with reference to the drawings.

For example, a liquid crystal television, etc., has a set of liquid crystal panel components (and
is clamped and fixed. The present invention will be explained with respect to the above-mentioned liquid crystal panel structure (1μ).

First, a pair of transparent insulating substrates, for example, a pair of glass substrates (11)
, (12). The first glass substrate (11) is formed larger than the second glass substrate (12) in order to provide the first connection electrode group (13) around it. This first
The glass substrate (11) has a first TFT, a display electrode, for displaying a liquid crystal display.

A gate line, a drain line, an auxiliary capacitor, etc. are formed. Further, a counter electrode is formed on the second glass substrate (12). This first glass substrate (11)
and a second glass substrate (12) are bonded together using an adhesive such as an epoxy adhesive, and a liquid crystal is filled between these two substrates (see FIG. 2).

Further, the first connection electrode group (13) is the first connection electrode group (13) in FIG.
It is formed of ITO on the back side of the glass substrate (12).

Next, around the first glass substrate (11), as shown in FIG. 4, a second connection electrode group (14) that overlaps with the first connection electrode group (13) is formed at the end. The insulating substrates (15) are electrically connected using, for example, anisotropic conductive resin or solder.

This insulating substrate (15) is the first glass substrate (1
Glass made of substantially the same material as 1) is preferred.

However, an 81 board or the like may also be used. On the insulating substrate (15), at least the LCD driving circuit described in the conventional example is formed within the broken line in FIG. 4, and other control circuits are formed to prevent the fixation of the chip. is omitted. The wiring of this drive circuit extends to the second connection electrode group (14). In addition, if a control circuit etc. is formed, the first glass substrate (
As shown in the corner of 11), interconnect wiring (16) is provided to interconnect the insulating substrates.

A feature of the present invention is that the insulating substrate (15) has substantially the same structure, the same material, or Si as the first TFT formed on the first glass substrate (11).
A technique for forming an 0 circuit on the glass substrate, in which at least a part of the drive circuit is constituted by a second TFT whose main component is a second TFT, has already been established in liquid crystal display cell technology.

Therefore, the fixation of the chip can be omitted, and the L
The CD factory line can be used as is, and it can be formed in a miniaturized state.

Specifically, the TFTs may both be made of amorphous silicon or polysilicon, or the TFTs may be made of amorphous silicon on the first glass substrate and the TFTs made of polysilicon on the insulating substrate. Generally, polysilicon has a higher mobility, so forming a polysilicon TFT on an insulating substrate has better characteristics.

Also, one side of the insulating substrate (15) can be substantially the same as or smaller than the side of the first glass substrate (11), and the other side can be substantially the same as or smaller than the side of the first glass substrate (11). ) can be achieved with a width smaller than Therefore, as shown in FIG. 1, the insulating substrate can also be accommodated within the outer shape of the first glass substrate (11), and in terms of manufacturing, the first glass substrate can be used to create one or more pieces in the shape of this glass substrate. Since it is possible to manufacture an insulating substrate of 1,000 yen, there is also the advantage that manufacturing can be simplified.

Further, this insulating substrate may be an 81 substrate. If it is formed by a normal semiconductor manufacturing method and a connection electrode group is formed at the end, it will have the same effect as the glass insulating substrate described above.

In Figure 1, insulating substrates are provided on three sides of the glass substrate, but since it is possible to miniaturize the switch elements formed on the insulating substrate (15), the circuit on the drain side is provided with one insulating substrate. This can be achieved with a substrate, and can be achieved simply by providing an insulating substrate on two mutually orthogonal sides, further reducing the size of the channel.

Next, in the conventional example, circuit chips provided on the printed circuit board (44), such as circuit chips for controlling each drive circuit, etc., can also be integrated on the insulating substrate (15); Since only a few elements such as capacitors are required, the printed circuit board (17) can be simplified. Here, the insulating board (15) and the printed circuit board (17)
) can be connected using a flexible board (46) with a spacer (18) in between, as shown in Figure 5.
Contact may be made using a portion of the connector (18).

Here, the connector (18) is connected to a glass substrate (
11) or the printed circuit board (17).
When used, it may be connected to a printed circuit board in the same manner as shown in FIG.

In FIG. 3, the spacer printed circuit board in FIG. 1 is omitted for convenience of drawing, and the first glass substrate (11) is placed on the lower side, and the insulating substrate (15) is placed on the lower side. This figure shows a case where the glass substrate (11) protrudes from the outer shape. In this case, the switching elements integrated on the insulating substrate (15) do not overlap with the first glass substrate, thereby preventing deterioration of the elements over time during the process of connecting the connection electrode group, etc.

(G) Effects of the Invention As is clear from the above explanation, since miniaturization is possible, the size of the entire channel can be reduced. Further, there is no need to fix the chip to an insulating substrate, and a printed circuit board is not required at all or can be simplified. Furthermore, since the spacer does not require a chip that is fixed to the flexible substrate, it can be made thinner.

Furthermore, in the case of glass substrates, the LCD factory line can be used as is, and it can be formed without the need for any new equipment. Further, since the first connection electrode group and the second connection electrode group are formed of substrates made of the same material, there is no difference in coefficient of thermal expansion and they can be connected well.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a main part of a liquid crystal display device of the present invention, FIG. 2 is a perspective view of a glass substrate, FIG. 3 is a perspective view of a main part of another liquid crystal display device of the present invention, and FIG. , a perspective view of an insulating substrate FIG. 5 is a perspective view of a main part of a conventional liquid crystal display device. Figure 1 Figure 2 Figure 3 Figure 15 Snake snoring 1 class lδ41]3

Claims (7)

[Claims] (1) A pair of transparent insulating substrates filled with liquid crystal and having first switch means formed in a matrix shape on one substrate and counter electrodes formed on the other substrate; a first connection electrode group formed on a side; an insulating substrate whose end overlaps with the transparent insulating substrate corresponding to the first connection electrode group; and an insulating substrate formed at the end of the insulating substrate. a second connection electrode group; a drive circuit extending from the second connection electrode group and comprising at least a second switch means having substantially the same structure as the first switch means; A liquid crystal display device comprising a connecting electrode group and a connecting means for electrically connecting the second connecting electrode group. (2) The liquid crystal display device according to claim 1, wherein the transparent insulating substrate contains glass as a main component. (3) The liquid crystal display device according to claim 1, wherein the first switch means and the second switch means substantially contain Si as a main component. (4) The liquid crystal display device according to claim 1, wherein the insulating substrate is provided on two sides of the transparent insulating substrate that are in contact with each other. (5) A first TFT and a display electrode connected to the first TFT are arranged in a matrix as a set.
a second glass substrate provided with a counter electrode that performs liquid crystal display using a voltage between the display electrode, and a liquid crystal between the first glass substrate and the second glass substrate. a pasting means for injection; a first connection electrode group provided on a side of the first glass substrate and extending from the first TFT; and the first connection electrode group. A second connection electrode group is provided at the end and is connected to an insulating substrate provided on a side of the first glass substrate; TFT of
A liquid crystal display device comprising: a drive circuit having at least a second TFT having substantially the same structure as the first connection means and the second connection means. (6) Claim 5, characterized in that the first TFT and the second TFT substantially contain Si as a main component.
The liquid crystal display device described in Section 1. (7) The liquid crystal display device according to claim 5, wherein the insulating substrate is provided on two sides of the first glass substrate that are in contact with each other.