JPH04180587A - Production of vapor-deposition material - Google Patents
Production of vapor-deposition materialInfo
- Publication number
- JPH04180587A JPH04180587A JP2307547A JP30754790A JPH04180587A JP H04180587 A JPH04180587 A JP H04180587A JP 2307547 A JP2307547 A JP 2307547A JP 30754790 A JP30754790 A JP 30754790A JP H04180587 A JPH04180587 A JP H04180587A
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- vapor
- electrolyte
- alloy
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 36
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 19
- 239000000956 alloy Substances 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 6
- 239000003792 electrolyte Substances 0.000 abstract description 8
- 238000002844 melting Methods 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract description 5
- 150000004767 nitrides Chemical class 0.000 abstract description 5
- 239000002253 acid Substances 0.000 abstract description 4
- 238000005266 casting Methods 0.000 abstract description 3
- 150000003839 salts Chemical class 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000004663 powder metallurgy Methods 0.000 abstract description 2
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000008151 electrolyte solution Substances 0.000 description 7
- 238000005019 vapor deposition process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Physical Vapour Deposition (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は蒸着工程に際してスプラッシュの発生を防止す
ることができる蒸着用材料の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for producing a material for vapor deposition which can prevent the occurrence of splash during a vapor deposition process.
［従来の技術］
従来、蒸着用材料は所定の組成になるように、材料を溶
解した後、この溶湯を鋳造し、得られた鋳塊を塑性加工
することにより製造するか、又は構成成分の純金属粉と
純金属粉とを混合して、加圧した後、焼結して製造して
いる。[Prior Art] Conventionally, materials for vapor deposition have been manufactured by melting the material, casting the molten metal, and plastic working the obtained ingot so as to have a predetermined composition, or by mixing the constituent components. It is manufactured by mixing pure metal powder and pure metal powder, pressurizing the mixture, and then sintering it.
［発明が解決しようとする課題］
しかしながら、前者の溶解鋳造法により蒸着用材料を製
造しようとすると、溶解時に酸化物及び窒化物が混入す
るという欠点がある。このため、得られた蒸着用材料は
、蒸着工程時に電子線の照射等により高温に加熱される
と、前記酸化物及び窒化物が分解し、ガスが発生すると
いう問題点がある。また、蒸着工程時に、溶解した金属
が飛散してスプラッシュが発生するという欠点もある。[Problems to be Solved by the Invention] However, when a vapor deposition material is manufactured by the former melting and casting method, there is a drawback that oxides and nitrides are mixed in during melting. Therefore, when the obtained vapor deposition material is heated to a high temperature by electron beam irradiation or the like during the vapor deposition process, the oxides and nitrides are decomposed and gas is generated. Another drawback is that molten metal scatters during the vapor deposition process, causing splash.
一方、後者の粉末冶金法により蒸着用材料を製造しよう
とすると、その粉末の表面が酸化し易く、この酸化膜の
形成によりスプラッシュが発生し易くなるという欠点が
ある。On the other hand, when a material for vapor deposition is manufactured by the latter powder metallurgy method, the surface of the powder is easily oxidized, and the formation of this oxide film tends to cause splashes, which is a drawback.
本発明はかかる問題点に鑑みてなされたものであって、
酸化物等の混入又は発生がなく、蒸着工程に際してスプ
ラッシュの発生を防止することができる蒸着用材料の製
造方法を提供することを目的とする。The present invention has been made in view of such problems, and includes:
It is an object of the present invention to provide a method for producing a material for vapor deposition, which does not include or generate oxides, etc., and can prevent the occurrence of splash during the vapor deposition process.
［課題を解決するための手段］
本発明に係る蒸着用材料の製造方法は、所定の組成の金
属又は合金からなる材料を電気分解により生成すること
を特徴とする。[Means for Solving the Problems] A method for producing a material for vapor deposition according to the present invention is characterized in that a material made of a metal or an alloy having a predetermined composition is produced by electrolysis.
［作用］
本発明においては、電気分解により蒸着用材料を製造す
るから、この蒸着用材料中に酸化物及び窒化物等の混入
がなく、このため、蒸着に際してスプラッシュの発生を
防止できる。[Function] In the present invention, since the material for vapor deposition is produced by electrolysis, there is no mixing of oxides, nitrides, etc. into the material for vapor deposition, and therefore, it is possible to prevent the occurrence of splash during vapor deposition.
［実施例コ 次に、本発明の実施例について、具体的に説明する。[Example code] Next, examples of the present invention will be specifically described.
先ず、電気分解より生成する材料の組成が所望の組成に
なるように、電解液を調整する。この電解液の調整は具
体的には下記のようにすればい。First, an electrolytic solution is adjusted so that the material produced by electrolysis has a desired composition. Specifically, the electrolytic solution can be adjusted as follows.
■ 所望の組成の合金を溶製し、酸等で溶解して電解液
とする。目的組成の電解液が得られなかった場合には、
金属塩を添加してその組成を所望のものに調整する。(2) An alloy with a desired composition is melted and dissolved with acid to form an electrolyte. If an electrolyte with the desired composition cannot be obtained,
Metal salts are added to adjust the composition to the desired one.
■ 所望の組成が得られるように金属塩を配合し、これ
を溶解することにより電解液とする。(2) Mix metal salts to obtain the desired composition and dissolve them to form an electrolytic solution.
この場合に、電解液のｐＨを調整するために、はう酸等
を添加しても良い。In this case, in order to adjust the pH of the electrolytic solution, hydrolic acid or the like may be added.
次いで、この電解液を所定の条件で電気分解して所定の
組成の材料を陰極上に電着させる。即ち、陰極として金
属板を使用し、陽極として、液の組成を変化させないよ
うに、使用する電解液に溶解しない組成の金属、例えば
白金又はチタン等の金属を使用して、１０乃至５０００
Ａ／ｄｍ２の電流密度で電気分解する。Next, this electrolytic solution is electrolyzed under predetermined conditions to electrodeposit a material having a predetermined composition onto the cathode. That is, a metal plate is used as the cathode, and a metal with a composition that does not dissolve in the electrolytic solution used, such as platinum or titanium, is used as the anode so as not to change the composition of the solution.
Electrolyze at a current density of A/dm2.
この場合に、電流密度を高くしたときには、陰極の近傍
で金属イオンの濃度が低下することを防止するために、
陰極に向けて電解液を噴射し、攪拌することが必要であ
る。In this case, when increasing the current density, in order to prevent the concentration of metal ions from decreasing near the cathode,
It is necessary to spray the electrolyte toward the cathode and stir it.
また、通常、蒸着工程においては、蒸着材料（蒸着源）
は、銅板又は内部水冷可能の構造を有するジャケット状
の銅板若しくはその他の金属板に、ロウ付は又は溶接に
より取着される。このように、熱伝導度が優れた銅板又
は銅若しくはその他の金属からなる水冷構造のジャケッ
ト板を支持体として蒸着用材料を設置することにより、
蒸着源を冷却しつつ電子線を照射して蒸着を行うことが
できる。この場合に、本実施例において、蒸着用材料を
、このように熱伝導度が優れた銅板又は銅若しくはその
他の金属からなる水冷構造のジャケット板上に直接生成
させることにより、蒸着源と冷却装置との間を高接合強
度で接着することが可能になる。従って、蒸着工程にお
いて、蒸着源の冷却効率が向上する。電着法で製造され
た蒸着用材料は、その中に水素原子を多量に含有する。In addition, usually in the vapor deposition process, the vapor deposition material (the vapor deposition source)
is attached by brazing or welding to a copper plate or a jacket-like copper plate or other metal plate having a structure that allows internal water cooling. In this way, by installing the deposition material using a copper plate with excellent thermal conductivity or a water-cooled jacket plate made of copper or other metals as a support,
Vapor deposition can be performed by irradiating an electron beam while cooling the vapor deposition source. In this case, in this example, the deposition material is directly produced on a copper plate with excellent thermal conductivity or on a jacket plate of a water-cooled structure made of copper or other metals. It becomes possible to bond with high bonding strength between the two. Therefore, in the vapor deposition process, the cooling efficiency of the vapor deposition source is improved. A vapor deposition material produced by an electrodeposition method contains a large amount of hydrogen atoms.
しかし、通常水素原子は、金属中で容易に移動するので
常温で放置しておくだけでも水素原子含有量は低下する
が、積極的に水素原子を除去するには電着後に加熱する
ことが有効である。加熱雰囲気は、特に限定されないが
、電着層の酸化等を防止するために真空中又は不活性ガ
ス若しくは還元性ガス雰囲気中で加熱することが望まし
い。加熱温度は、通常４００℃以下であるが、特に上限
を定める必要はない。However, since hydrogen atoms usually move easily in metals, the hydrogen atom content decreases even if the metal is left at room temperature, but heating after electrodeposition is effective in actively removing hydrogen atoms. It is. The heating atmosphere is not particularly limited, but it is desirable to heat in vacuum or in an inert gas or reducing gas atmosphere in order to prevent oxidation of the electrodeposited layer. The heating temperature is usually 400° C. or lower, but there is no need to set an upper limit.
次に、本発明の実施例方法により、磁気記録用テープの
製造に使用される蒸着用材料を製造した結果について説
明する。Next, a description will be given of the results of manufacturing a deposition material used for manufacturing a magnetic recording tape using an example method of the present invention.
先ず、硫酸ニッケルと硫酸コバルトとを、ニッケルイオ
ンとコバルトイオンとが重量で等量になるように、水に
溶解した。そして、ｐＨが４になるように、はう酸を添
加して電解液を得た。この電解液中に、陰極として銅板
を浸漬し、陽極として白金板を浸漬し、５０Ａ／ｄａ＋
”の電流密度で２４時間電気分解を行った。得られた電
着板を蒸着源として電子線を照射し、ＮｉＣ０合金をポ
リエステルテープ上に蒸着した。このときに、発生した
スプラッシュは１時間当たりに３回であった。比較のた
めに、Ｎ ｉ ５０Ｘ及びＣｏ５０％（いずれも重量Ｘ
）の合金を、１．３３Ｘ１０−”Ｐａの真空溶解炉で溶
解し、溶湯を鋳造した後、この鋳塊に対して１ｈ＋ｍの
厚さになるまで圧延を繰り返した。そして、この圧延板
の表面を切削加工した後、銅板上に銀ロウ材を使用して
接合し、前述の実施例の場合と同一の条件で蒸着した。First, nickel sulfate and cobalt sulfate were dissolved in water so that the nickel ions and cobalt ions were equal in weight. Then, hydric acid was added so that the pH became 4 to obtain an electrolytic solution. A copper plate was immersed as a cathode and a platinum plate was immersed as an anode in this electrolyte.
Electrolysis was carried out for 24 hours at a current density of For comparison, N i 50X and Co 50% (both by weight
) was melted in a vacuum melting furnace of 1.33 x 10-''Pa, the molten metal was cast, and the ingot was repeatedly rolled until it had a thickness of 1h+m.Then, the surface of this rolled plate was After cutting, it was bonded onto a copper plate using a silver brazing material, and vapor deposition was performed under the same conditions as in the previous example.
この場合に、スプラッシュの回数は１時間当たり３２回
であった。従って、本実施例により製造した蒸着用材料
はそのスプラッシュの回数が従来方法により製造した蒸
着用材料の場合の約１割と極めて少なかった。In this case, the number of splashes was 32 per hour. Therefore, the number of splashes of the vapor deposition material produced by this example was extremely small, about 10% of that of the vapor deposition material produced by the conventional method.
［発明の効果コ
以上説明したように、本発明方法により、蒸着時のスプ
ラッシュの発生が抑制された蒸着用材料を製造すること
ができる。[Effects of the Invention] As explained above, by the method of the present invention, it is possible to produce a vapor deposition material in which the occurrence of splash during vapor deposition is suppressed.
Claims (2)
解により生成することを特徴とする蒸着用材料の製造方
法。(1) A method for producing a material for vapor deposition, characterized in that a material made of a metal or alloy of a predetermined composition is produced by electrolysis.
支持体上に、前記材料を直接生成させることを特徴とす
る請求項１に記載の蒸着用材料の製造方法。(2) The method for producing a vapor deposition material according to claim 1, characterized in that the material is directly produced on a support used to support the vapor deposition material in the vapor deposition step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2307547A JPH04180587A (en) | 1990-11-13 | 1990-11-13 | Production of vapor-deposition material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2307547A JPH04180587A (en) | 1990-11-13 | 1990-11-13 | Production of vapor-deposition material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04180587A true JPH04180587A (en) | 1992-06-26 |
Family
ID=17970407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2307547A Pending JPH04180587A (en) | 1990-11-13 | 1990-11-13 | Production of vapor-deposition material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04180587A (en) |
-
1990
- 1990-11-13 JP JP2307547A patent/JPH04180587A/en active Pending
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