JPH04176193A - Cream solder printing board - Google Patents
Cream solder printing boardInfo
- Publication number
- JPH04176193A JPH04176193A JP30363190A JP30363190A JPH04176193A JP H04176193 A JPH04176193 A JP H04176193A JP 30363190 A JP30363190 A JP 30363190A JP 30363190 A JP30363190 A JP 30363190A JP H04176193 A JPH04176193 A JP H04176193A
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- board
- mask
- oxidation
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 38
- 239000006071 cream Substances 0.000 title claims abstract description 33
- 238000007639 printing Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000003647 oxidation Effects 0.000 claims abstract description 12
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 27
- 230000003064 anti-oxidating effect Effects 0.000 claims description 13
- 238000007650 screen-printing Methods 0.000 claims description 7
- 229920006015 heat resistant resin Polymers 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 11
- 229920001721 polyimide Polymers 0.000 abstract description 5
- 239000004642 Polyimide Substances 0.000 abstract description 4
- 230000000740 bleeding effect Effects 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XTKDAFGWCDAMPY-UHFFFAOYSA-N azaperone Chemical compound C1=CC(F)=CC=C1C(=O)CCCN1CCN(C=2N=CC=CC=2)CC1 XTKDAFGWCDAMPY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はスクリーン印す１１法により、クリーム半田が
所定パターンに印刷されるクリーム半田印刷用基板に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a cream solder printing board on which cream solder is printed in a predetermined pattern by the screen printing method.
従来の技術
基板上には銅箔等により導電部がパターン形成されてお
り、後のクリーム半田印刷工程、チッブ部品搭載工程、
リフロー工程等によって、前記導電部にチップ部品等の
電子回路部品が半田付すされる。基板製作後クリーム半
田印刷を行うまでの間に長時間が経過すると、銅箔等の
導電部が酸化し、酸化膜による半田濡れ性の悪化等によ
り半田付けに不都合が生ずる。そこで従来は、前記酸化
を防止するため、ブリツジ。Conventional technology A pattern of conductive parts is formed on the board using copper foil, etc., and the subsequent cream solder printing process, chip component mounting process,
Electronic circuit components such as chip components are soldered to the conductive portion by a reflow process or the like. If a long period of time elapses between the time the board is manufactured and the time when cream solder printing is performed, the conductive parts such as copper foil will oxidize, causing problems in soldering due to deterioration of solder wettability due to the oxide film. Therefore, in the past, bridges were used to prevent the oxidation.
クスを施していた。He was wearing a mask.
発明が解決しようとする課題
しかし基板を長期放置するような場合ブリフランクス自
体の劣化Ｃコより酸化防止機能が劣化するという問題が
あった。又両面にチップ部品を半田付けする場合、第一
面のクリーム半田印刷、チップ部品搭載、リフローの一
連の工程を円滑に行うことができても、第一面のりフロ
ー工程における熱によって、第二面の導電部が酸化する
ので、第二面のチップ部品の半田付けを適切に行うこ七
ができないという問題があった。Problems to be Solved by the Invention However, there is a problem in that when the substrate is left for a long period of time, the anti-oxidation function deteriorates due to deterioration of the brieflux itself. In addition, when soldering chip components on both sides, even if the series of processes of cream solder printing, chip component mounting, and reflow on the first side can be performed smoothly, the heat in the soldering process on the first side may cause the second side to Since the conductive parts on the surface are oxidized, there is a problem in that the chip components on the second surface cannot be properly soldered.
本発明は上記問題点を解消することを目的とする。又本
発明は上記問題点を解消すると共に、滲みのない正確な
りリーム半田印刷を行うことができるクリーム半田印刷
用基板を提供することを他の目的とする。The present invention aims to solve the above problems. Another object of the present invention is to solve the above-mentioned problems and to provide a cream solder printing board that can perform accurate ream solder printing without bleeding.
乞
課題が解決するための手段
本願の第１発明はスクリーン印刷法により、クリーム半
田が所定パターンに印刷される基仮において、基板印刷
面上に剥離可能に酸化防止用シートが設けられたことを
特徴とする。Means for Solving the Problems The first invention of the present application is based on a screen printing method, in which cream solder is printed in a predetermined pattern, and a peelable anti-oxidation sheet is provided on the printed surface of the substrate. Features.
本願の第２発明は、第１発明の構成において、基板の両
面が印刷面であり、両面に設けられた酸化防止用シート
の内、少なくとも一方が耐熱性樹脂で形成されたことを
特徴とする。A second invention of the present application is characterized in that, in the configuration of the first invention, both sides of the substrate are printed surfaces, and at least one of the anti-oxidation sheets provided on both sides is formed of a heat-resistant resin. .
本願の第３発明はスクリーン印刷法により、クリーム半
田が所定パターンに印刷される基板において、印刷パタ
ーンが形成されたフィルム状のマスクを基板印刷面に粘
着し、このマスク上に剥離可能に酸化防止用シートを設
けたことを特徴とする。The third invention of the present application uses a screen printing method to adhere a film-like mask on which a printed pattern is formed to the printed surface of the substrate on which cream solder is printed in a predetermined pattern. It is characterized by having a seat for use.
作用
本願の第１発明によれば、基板印刷面上に酸化防止用シ
ーＩ・が設けられ、基板の銅箔等の導電部に空気が触れ
ることが妨げられるので、長期にわたって前記導電部の
酸化を防止することができる。Effects According to the first invention of the present application, the oxidation preventing sheet I is provided on the printed surface of the board, and air is prevented from coming into contact with the conductive parts such as copper foil of the board, so that the oxidation of the conductive parts is prevented over a long period of time. can be prevented.
本願の第２発明によれば、第１発明の作用効果δこ加え
、両面にチップ部品等を半田付けする場合において、酸
化防止用シートの内、少なくとも一方が耐熱性樹脂で形
成されているので、この耐熱性樹脂で形成された酸化防
止用シートにより、第一面のりフロー工程中においても
第二面の導電部の酸化を防止することができるという作
用効果がある。According to the second invention of the present application, in addition to the effects δ of the first invention, when chip components etc. are soldered to both sides, at least one of the oxidation-preventing sheets is formed of a heat-resistant resin. The oxidation-preventing sheet formed of this heat-resistant resin has the effect of preventing oxidation of the conductive portion on the second surface even during the adhesive flow process on the first surface.
本願の第３発明によれば、第１発明の作用効果に加え、
次のような作用効果がある。すなわち、ソリのある基板
に対しても、その印刷面に沿ってフィルム状のマスクを
密着させることができ、マスクと基板の印刷面との間に
微小ギヤングが生じることを防くことができる結果、フ
ィルム状のマスクの印刷パターンどおりに基板上に印刷
されたクリーム半田のパターンに滲みが生ずることを防
ぎ、正確なりリーム半田印刷を行うことができる。According to the third invention of the present application, in addition to the effects of the first invention,
It has the following effects. In other words, the film-like mask can be brought into close contact with the printed surface of the substrate even if the substrate has warp, and it is possible to prevent the formation of minute gigangs between the mask and the printed surface of the substrate. This prevents the cream solder pattern printed on the substrate from bleeding in accordance with the printed pattern of the film-like mask, and enables accurate ream solder printing.
実施例
第１図は本発明の一実施例であるクリーム半田印刷用基
板Ｐを示している。Embodiment FIG. 1 shows a cream solder printing board P which is an embodiment of the present invention.
第１図において、１は基板本体、２は銅箔等の導電部、
３はソルダーレジスト、４はフィルム状のマスク、５は
酸化防止用シートである。In Fig. 1, 1 is the board body, 2 is a conductive part such as copper foil,
3 is a solder resist, 4 is a film-like mask, and 5 is an antioxidant sheet.
フィルム状のマスク４は、ポリイミド、フッ素系樹脂（
例えばテフロン−登録商標）、ポリプロピレン、ポリエ
チレン、塩化ビニールなどを素材として形成され、５０
〜２００ｐｍの厚みを有している。このフィルム状のマ
スク４は粘着剤６によって、基板本体１の表面に粘着さ
れており、スクリーン印刷工程の前工程において正確な
位置に位置合わせされ、かつ密着状態に粘着されている
。なお、粘着剤６を用いずに、フィルム状のマスク４自
身の有する熱融着性、化学粘着性等を利用して、フィル
ム状のマスク４を基板本体１に粘着することも可能であ
る。The film-like mask 4 is made of polyimide, fluorine resin (
For example, it is made of materials such as Teflon (registered trademark), polypropylene, polyethylene, vinyl chloride, etc.
It has a thickness of ~200 pm. This film-like mask 4 is adhered to the surface of the substrate body 1 with an adhesive 6, and is aligned in an accurate position and adhered tightly in a pre-screen printing process. Note that it is also possible to adhere the film-like mask 4 to the substrate main body 1 without using the adhesive 6, by utilizing the thermal adhesiveness, chemical adhesiveness, etc. of the film-like mask 4 itself.
前記フィルム状のマスク４には、開口部より成る印刷パ
ターン７が形成されている。この印刷パターン７の形成
方法は、公知のエツチング法やレーザ穿孔法等を用いれ
ばよく、第２図にはレーザ穿孔法による場合を示してい
る。第２図の（ａ）において、４ａはフィルム状のマス
ク素材、８は前記印刷パターン７に対応するパターンが
形成された金属マスク、９はレーザ光である。前記レー
ザ光９を金属マスク８で覆われたフィルム状のマスク素
材４ａに照射することにより、第２図の（ｂ）に示すよ
うに所定の印刷パターン７が形成されたフィルム状のマ
スク４が得られる。第３図にはフィルム状のマスク４の
Ｉ例を示している。The film-like mask 4 has a printed pattern 7 formed of openings. The printing pattern 7 may be formed by a known etching method or laser perforation method, and FIG. 2 shows a case where the laser perforation method is used. In FIG. 2(a), 4a is a film-like mask material, 8 is a metal mask on which a pattern corresponding to the printed pattern 7 is formed, and 9 is a laser beam. By irradiating the laser beam 9 onto the film-like mask material 4a covered with the metal mask 8, the film-like mask 4 with a predetermined printed pattern 7 formed thereon is formed as shown in FIG. 2(b). can get. FIG. 3 shows an example of a film-like mask 4.
前記酸化防止用ソート５は、ポリイミド、フッ素系樹脂
、ポリプロピレン、ポリエチレン、塩化ビニールなどを
素材として形成され、２５〜３００μｍの厚みを有して
いる。この酸化防止用シート５は粘着剤１０によって、
フィルム状のマスク４上に、その全面を覆うようにして
剥離可能に接着されている。そして、フィルム状のマス
ク４を基板本体１上に粘着した後、ひき続いてフィルム
状のマスク４上に接着したものである。なお、粘着剤１
０を用いずに、酸化防止用シート５自身の有する熱融着
性、化学粘着性等を利用して、酸化防止用シー１−５を
フィルム状のマスク４上に剥離可能に設けることができ
る。The antioxidant sort 5 is made of polyimide, fluororesin, polypropylene, polyethylene, vinyl chloride, or the like, and has a thickness of 25 to 300 μm. This anti-oxidation sheet 5 is made of adhesive 10,
It is releasably adhered to the film-like mask 4 so as to cover the entire surface thereof. After the film-like mask 4 is adhered onto the substrate body 1, it is subsequently adhered onto the film-like mask 4. In addition, adhesive 1
0, the antioxidant sheet 1-5 can be releasably provided on the film-like mask 4 by utilizing the thermal adhesiveness, chemical adhesiveness, etc. of the antioxidant sheet 5 itself. .
前記基板Ｐは、クリーム半田印刷を行う直前に、その表
面をカバーしていた酸化防止用シート５が剥離される。Immediately before cream solder printing is performed on the substrate P, the anti-oxidation sheet 5 covering the surface of the substrate P is peeled off.
この剥離に際して、前記粘着剤１０等を紫外線照射によ
って、非粘着状態になるように構成すると紫外線照射に
より自動的に酸化防止用シート５を剥離することが可能
となるので好適である。At the time of this peeling, it is preferable to configure the adhesive 10 and the like to become non-adhesive by irradiating ultraviolet rays, since this makes it possible to automatically peel off the anti-oxidation sheet 5 by irradiating ultraviolet rays.
酸化防止用シート５がＭｌｌ離された基板Ｐは、第４図
に示すスクリーン印刷装置１３において、クリーム半田
印刷される。すなわち所定位置にマスク付き基板Ｐを配
し、この上に供給されたクリーム半田１１をスキージ１
２によって展延することにより、フィルム状のマスク４
の印刷パターン７を透過したクリーム半田１１が基板本
体１上に印刷される。The substrate P with the anti-oxidation sheet 5 separated by Mll is printed with cream solder in a screen printing device 13 shown in FIG. That is, a masked board P is placed at a predetermined position, and cream solder 11 supplied thereon is applied with a squeegee 1.
2, a film-like mask 4 is formed.
The cream solder 11 that has passed through the printed pattern 7 is printed on the substrate body 1.
上記のようにしてクリーム半田印刷が行なわれた後、前
記フィルム状のマスク４は基板本体１より剥離される。After cream solder printing is performed as described above, the film-like mask 4 is peeled off from the substrate body 1.
なお、酸化防止用シート５の剥離の場合と同様、前記粘
着剤６等を紫外線照射によって、非粘着状態になるよう
に構成すると、紫外線照射により自動的にフィルム状の
マスク４を基板本体１より剥離することが可能となるの
で好適である。Note that, as in the case of peeling off the antioxidant sheet 5, if the adhesive 6 etc. is configured to become non-adhesive by UV irradiation, the film-like mask 4 is automatically removed from the substrate body 1 by UV irradiation. This is suitable because it allows peeling.
第５図は本発明の他の実施例であるクリーム半田印刷用
基板Ｑを示している。この基板Ｑは両面が印刷面であっ
て、両面に設りられたフィルム状のマスク４、酸化防止
用シート５のいずれもが、耐熱性樹脂、例えばポリイミ
ド、フッ素系樹脂で形成されたものである。他の構成は
、第１図に示すものと共通しているので、共通符号を付
すにとどめ、説明を省略する。 この基板Ｑによれば、
第一面のクリーム半田印刷を第４図に示すように行った
後、第一面にチップ部品を搭載し、次いでリフロー工程
に移行するが、このリフロー工程における熱に対し、第
二面のフィルム状のマスク４及び酸化防止用シート５が
耐えることができる。従って、基板Ｑの第二面における
酸化を防止することができると共に、第二面のクリーム
半田印刷時においてフィルム状のマスク４はその機能を
十全に果すことができる。FIG. 5 shows a cream solder printing board Q which is another embodiment of the present invention. This substrate Q has printing surfaces on both sides, and both the film-like mask 4 and the anti-oxidation sheet 5 provided on both sides are made of heat-resistant resin, such as polyimide or fluororesin. be. Since the other configurations are the same as those shown in FIG. 1, the same reference numerals are given and the explanation will be omitted. According to this board Q,
After cream solder printing is performed on the first side as shown in Figure 4, chip components are mounted on the first side, and then the reflow process is carried out, but the film on the second side is The mask 4 and the anti-oxidation sheet 5 can withstand this condition. Therefore, oxidation on the second surface of the substrate Q can be prevented, and the film-like mask 4 can fully perform its function when printing cream solder on the second surface.
第６図は本発明の更に別の実施例であるクリーム半田印
刷用基板Ｒを示している。この基板Ｒは、基板本体１の
印刷面上に直接剥離可能に酸化防止用シート５を設けた
ものである。他の構成は第１図に示すものと共通してい
るので、共通符号を付すにとどめ、説明を省略する。FIG. 6 shows a cream solder printing board R which is still another embodiment of the present invention. This substrate R has an anti-oxidation sheet 5 provided on the printed surface of the substrate body 1 so as to be directly peelable. Since the other configurations are the same as those shown in FIG. 1, the same reference numerals will be given and the explanation will be omitted.
本発明は上記実施例に示す外、種々の態様に構成するこ
とができる。例えば、第６図に示す実施例は基板本体１
の片面のみが印刷面のものであるが、基板本体１の両面
が印刷面のものに対し、これら印刷面に直接、酸化防止
用シート５を剥離可能に設け、そして少なくきも一方の
酸化防止用シー１−５を耐熱性樹脂で形成することが可
能である。The present invention can be configured in various ways other than those shown in the above embodiments. For example, the embodiment shown in FIG.
Although only one side of the substrate main body 1 is a printed surface, the oxidation-preventing sheet 5 is removably provided directly on these printed surfaces, and at least one of the oxidation-preventing sheets 5 is removably provided on the printed surfaces. It is possible to form the seams 1-5 from heat-resistant resin.
発明の効果
本願の第１発明によれば、基板が長期放置されるような
場合でも、基板の導電部の酸化を確実に防止することが
できる。Effects of the Invention According to the first invention of the present application, even when the substrate is left for a long period of time, oxidation of the conductive portion of the substrate can be reliably prevented.
本願の第２発明によれば、上記第１発明の効果に加えて
、基板の両面にチップ部品等の電子部品を半田付けする
場合においても、第一面のりフロー工程中の熱に耐えて
、第二面の酸化を防止できるという効果がある。According to the second invention of the present application, in addition to the effects of the first invention, even when electronic parts such as chip parts are soldered to both sides of the board, the first side can withstand the heat during the glue flow process, This has the effect of preventing oxidation of the second surface.
本願の第３発明によれば、上記第１発明の効果に加え、
クリーム半田のパターンに滲みが生しない正確なりリー
ム半田印刷を行なうことができるという効果がある。According to the third invention of the present application, in addition to the effects of the first invention,
This has the advantage that accurate ream solder printing can be performed without bleeding in the cream solder pattern.
第１図ないし第４図は本発明の第」の実施例を示し、第
１図はクリーム半田印刷用基板の拡大断面図、第２図は
フィルム状のマスクの製造方法を示す断面図、第３図は
フィルＪ、状のマスクの平面図、第４図はクリーム半田
印刷方法を示す断面図、第５図は本発明の第２の実施例
におけるクリーム半田印刷用基板の拡大断面図、第６図
は本発明の第３の実施例におけるクリーム半田印刷用基
板の拡大断面図である。
Ｐ、Ｑ、Ｒ＝ クリーム半田印刷用基板１ −
一基板本体
４ ＝−−フィルム状のマスク
５ 酸化防止用シート
７ 印刷パターン。
代理人 弁理士 小鍜冶 明 ばか２名仕1 to 4 show an embodiment of the present invention, in which FIG. 1 is an enlarged sectional view of a cream solder printing board, FIG. 2 is a sectional view showing a method for manufacturing a film-like mask, and FIG. 3 is a plan view of a fill J-shaped mask, FIG. 4 is a sectional view showing a cream solder printing method, and FIG. 5 is an enlarged sectional view of a cream solder printing board according to a second embodiment of the present invention. FIG. 6 is an enlarged sectional view of a cream solder printing board according to a third embodiment of the present invention. P, Q, R = Cream solder printing board 1 -
One substrate body 4 =--Film-like mask 5 Anti-oxidation sheet 7 Printed pattern. Agent: Patent attorney Akira Kokaji Two idiots
Claims (3)
ターンに印刷される基板において、基板印刷面上に剥離
可能に酸化防止用シートが設けられたことを特徴とする
クリーム半田印刷用基板。(1) A cream solder printing board on which cream solder is printed in a predetermined pattern by a screen printing method, characterized in that a peelable oxidation prevention sheet is provided on the printing surface of the board.
化防止用シートの内、少なくとも一方が耐熱性樹脂で形
成された請求項１記載のクリーム半田印刷用基板。(2) The substrate for cream solder printing according to claim 1, wherein both surfaces of the substrate are printing surfaces, and at least one of the anti-oxidation sheets provided on both surfaces is made of a heat-resistant resin.
ターンに印刷される基板において、印刷パターンが形成
されたフィルム状のマスクを基板印刷面に粘着し、この
マスク上に剥離可能に酸化防止用シートを設けたことを
特徴とするクリーム半田印刷用基板。(3) On a board on which cream solder is printed in a predetermined pattern using the screen printing method, a film-like mask on which a printed pattern is formed is adhered to the printed surface of the board, and a removable anti-oxidation sheet is placed on top of this mask. A cream solder printing board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2303631A JP2900587B2 (en) | 1990-11-07 | 1990-11-07 | PCB for cream solder printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2303631A JP2900587B2 (en) | 1990-11-07 | 1990-11-07 | PCB for cream solder printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04176193A true JPH04176193A (en) | 1992-06-23 |
| JP2900587B2 JP2900587B2 (en) | 1999-06-02 |
Family
ID=17923313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2303631A Expired - Fee Related JP2900587B2 (en) | 1990-11-07 | 1990-11-07 | PCB for cream solder printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2900587B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009063883A1 (en) * | 2007-11-13 | 2009-05-22 | Seiren Co., Ltd. | Method for forming elecroconductive thin line |
-
1990
- 1990-11-07 JP JP2303631A patent/JP2900587B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009063883A1 (en) * | 2007-11-13 | 2009-05-22 | Seiren Co., Ltd. | Method for forming elecroconductive thin line |
| JP2009123791A (en) * | 2007-11-13 | 2009-06-04 | Seiren Co Ltd | Method of forming electroconductive thin line |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2900587B2 (en) | 1999-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0341273B2 (en) | ||
| US5499756A (en) | Method of applying a tacking agent to a printed circuit board | |
| JPH04176193A (en) | Cream solder printing board | |
| JPH11297890A (en) | Forming method of solder bump | |
| JPH04173385A (en) | Substrate fitted with mask and cream solder printing method | |
| JP2003198078A (en) | Printed wiring board and method of manufacturing the same | |
| JP3954753B2 (en) | TAB tape manufacturing method and TAB tape solder resist coating apparatus therefor | |
| JP2000312073A (en) | Member for masking printed board | |
| JPH04276692A (en) | Coating method for cream solder and metal mask for coating cream solder | |
| JPH04135056A (en) | Solder transferring film | |
| JPH0738239A (en) | Flexible printed wiring board | |
| JPH01276695A (en) | Surface mounted-type electronic device and its taped body | |
| JPH0373593A (en) | Manufacture of flexible printed wiring board | |
| JPH0785509B2 (en) | Flexible circuit board with carrier tape and manufacturing method thereof | |
| JPH04250687A (en) | Manufacture of flexible circuit board | |
| JPH02248099A (en) | Manufacture of printed wiring board | |
| JP2533009B2 (en) | Method for manufacturing adhesive tape for film carrier | |
| JPH02113595A (en) | Flexible circuit board | |
| JPH0342894A (en) | Packaging of semiconductor device | |
| JPH0453296A (en) | Manufacture of thin film resistor built-in printed wiring board | |
| JPH0476986A (en) | Printed circuit board | |
| JPH08125328A (en) | Joint method for electronic component | |
| JPH04144191A (en) | Metal mask for cream solder printing | |
| JPH05154438A (en) | Transfer method of self-adhesive and mounting method for electronic parts using the same | |
| JPS6191995A (en) | Manufacture of printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |