JPH04173385A - Substrate fitted with mask and cream solder printing method - Google Patents
Substrate fitted with mask and cream solder printing methodInfo
- Publication number
- JPH04173385A JPH04173385A JP2303632A JP30363290A JPH04173385A JP H04173385 A JPH04173385 A JP H04173385A JP 2303632 A JP2303632 A JP 2303632A JP 30363290 A JP30363290 A JP 30363290A JP H04173385 A JPH04173385 A JP H04173385A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- substrate
- cream solder
- printing
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 52
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 44
- 239000006071 cream Substances 0.000 title claims abstract description 39
- 238000007639 printing Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000007650 screen-printing Methods 0.000 claims abstract description 14
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Screen Printers (AREA)
- Printing Methods (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はスクリーン印刷法により、クリーム半田をマス
クの印刷パターンに対応するようにして基板上に印刷す
るクリーム半田印刷方法と、このクリーム半田印刷方法
に用いられるマスク付き基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a cream solder printing method for printing cream solder on a substrate in a manner corresponding to a printing pattern of a mask using a screen printing method, and to this cream solder printing method. The present invention relates to a masked substrate to be used.
従来の技術
スクリーン印刷法によりクリーム半田印刷を行うとき、
従来は印刷パターンが形成された金属マスクを用いてい
た。When performing cream solder printing by traditional technology screen printing method,
Conventionally, a metal mask on which a printed pattern was formed was used.
発明が解決しようとする課題
前記金属マスクを用いる場合、基板にはソリがあるため
、金属マスクと基板の表面との間に微小ギャップが生じ
、このような状態でスクリーン印刷を行うと、クリーム
半田が微小ギャップに滲み出し、基板上に印刷されたク
リーム半田のパターンに滲みが生じ、不正確なりリーム
半田印刷しか行うことができなかった。Problems to be Solved by the Invention When using the metal mask described above, the substrate has warp, so a minute gap is created between the metal mask and the surface of the substrate.If screen printing is performed in such a state, cream solder The solder paste oozed into the tiny gap, causing the pattern of cream solder printed on the board to bleed, and only inaccurate or ream solder printing could be performed.
を
課題が解決するための手段
本願の第１発明は上記問題点を解消するため、スクリー
ン印刷法によりクリーム半田印刷される基板において、
印刷パターンが形成されたフィルム状のマスクを基板表
面に粘着されてなるマスク付き基板を採用したことを特
徴とする。Means for Solving the Problems In order to solve the above problems, the first invention of the present application provides a substrate printed with cream solder by a screen printing method,
It is characterized by employing a masked substrate in which a film-like mask on which a printed pattern is formed is adhered to the substrate surface.
又本願の第２発明は、スクリーン印刷法により、クリー
ム半田をマスクの印刷パターンに対応するようにして基
板上に印刷するクリーム半田印刷方法において、印刷パ
ターンが形成されたフィルム状のマスクが基板表面に粘
着されてなるマスク付き基板を用い、このマスク付き基
板上に直接クリーム半田を供給しスキージで展延するこ
とにより印刷することを特徴とする。Further, the second invention of the present application is a cream solder printing method in which cream solder is printed on a substrate by a screen printing method in a manner corresponding to a printed pattern of a mask, in which a film-like mask on which a printed pattern is formed is applied to a surface of a substrate. The present invention is characterized in that printing is performed by using a masked substrate adhered to a masked substrate, and by supplying cream solder directly onto the masked substrate and spreading it with a squeegee.
作用
本発明によれば、マスクとしてフィルム状のシートを用
いているので、ソリのある基板に対しても、その表面に
沿ってフィルム状のマスクを密着させることができ、マ
スクと基板の表面との間に微小ギャップが生じることを
防ぐことができる結果、基板上に印刷されたクリーム半
田のパターンに滲みが生じることを防ぎ、正確なりリー
ム半田印刷を可能とすることができる、又スクリーン印
刷の前の工程で予めフィルム状のマスクを基板の表面に
粘着することができ、これを大量かつ正確に行うことが
できる一方、スクリーン印刷工程において、マスクと基
板との間の位置合わせ作業を省略することができる結果
、作業能率の向上を図ることができる。According to the present invention, since a film-like sheet is used as a mask, the film-like mask can be brought into close contact with the surface of a warped substrate, and the mask and the surface of the substrate can be closely connected. As a result, the cream solder pattern printed on the board can be prevented from bleeding, making it possible to perform accurate ream solder printing, as well as screen printing. A film-like mask can be attached to the surface of the substrate in advance in the previous process, which can be done in large quantities and accurately, while omitting the alignment work between the mask and the substrate in the screen printing process. As a result, work efficiency can be improved.
実施例
第１図は本発明のクリーム半田印刷方法に用いるマスク
付き基板１を示している。第１図において、２は基板、
３は銅箔、４はソルダーレジスト、５はフィルム状のマ
スクである。フィルム状のマスク５は、ポリイミド、フ
ッ素系樹脂（例えばテフロン−登録商標）、ポリプロピ
レン、ポリエチレン、塩化ビニールなどを素材として形
成され、５０〜２００μｍの厚みを有している。このフ
ィルム状のマスク５は粘着剤６によって、基板２の表面
に粘着されており、スクリーン印刷工程の前工程におい
て正確な位置に位置合わせされ、かつ密着状態に粘着さ
れている。なお、粘着剤６を用いずに、フィルム状のマ
スク５自身の有する熱融着性、化学粘着性等を利用して
、フィルム状のマスク５を基板２に粘着することも可能
である。Embodiment FIG. 1 shows a masked substrate 1 used in the cream solder printing method of the present invention. In FIG. 1, 2 is a substrate;
3 is a copper foil, 4 is a solder resist, and 5 is a film-like mask. The film-like mask 5 is made of polyimide, fluororesin (for example, Teflon-registered trademark), polypropylene, polyethylene, vinyl chloride, or the like, and has a thickness of 50 to 200 μm. This film-like mask 5 is adhered to the surface of the substrate 2 with an adhesive 6, and is aligned at an accurate position and adhered tightly in a pre-screen printing process. Note that it is also possible to adhere the film-like mask 5 to the substrate 2 without using the adhesive 6, using the thermal adhesiveness, chemical adhesiveness, etc. of the film-like mask 5 itself.
前記フィルム状のマスク５には、開口部より成る印刷パ
ターン７が形成されている。この印刷パターン７の形成
方法は、公知のエツチング法やレーザ穿孔法等を用いれ
ばよく、第２図にはレーザ穿孔法による場合を示してい
る。第２図の（ａ）において、５ａはフィルム状のマス
ク素材、８は前記印刷パターン７に対応するパターンが
形成された金属マスク、９はレーザ光である、前記レー
ザ光９を金属マスク８で覆われたフィルム状のマスク素
材５ａに照射することにより、第２図の（ハ）に示すよ
うに所定の印刷パターン７が形成されたフィルム状のマ
スク５が得られる。第３図にはフィルム状のマスク５の
１例を示している。The film-like mask 5 has a printed pattern 7 formed of openings. The printing pattern 7 may be formed by a known etching method or laser perforation method, and FIG. 2 shows a case where the laser perforation method is used. In FIG. 2(a), 5a is a film-like mask material, 8 is a metal mask on which a pattern corresponding to the printed pattern 7 is formed, and 9 is a laser beam.The laser beam 9 is emitted by the metal mask 8. By irradiating the covered film-like mask material 5a, a film-like mask 5 on which a predetermined printed pattern 7 is formed is obtained, as shown in FIG. 2(c). FIG. 3 shows an example of a film-like mask 5.
上記マスク付き基板ｌは、第４図に示すスクリーン印刷
装置工０において、クリーム半田印刷される。すなわち
所定位置にマスク付き基板１を配し、この上に供給され
たクリーム半田１１をスキージ１２によって展延するこ
とにより、フィルム状のマスク５の印刷パターン７を透
過したクリーム半田１１が基板２上に印刷される。上記
のようにしてクリーム半田印刷が行なわれた後、前記フ
ィルム状のマスク５は基板２より剥離される。なお、前
記粘着剤６等を紫外線照射によって、非粘着状態になる
ように構成すると、紫外線照射により自動的にフィルム
状のマスク５を基板２より剥離することが可能となるの
で好適である。The masked substrate 1 is printed with cream solder in a screen printing apparatus 0 shown in FIG. That is, by placing the masked substrate 1 at a predetermined position and spreading the cream solder 11 supplied thereon with the squeegee 12, the cream solder 11 that has passed through the printed pattern 7 of the film-like mask 5 is spread onto the substrate 2. printed on. After cream solder printing is performed as described above, the film-like mask 5 is peeled off from the substrate 2. Note that it is preferable to configure the adhesive 6 and the like to become non-adhesive by irradiation with ultraviolet rays, since this allows the film-like mask 5 to be automatically peeled off from the substrate 2 by irradiation with ultraviolet rays.
本発明は、上記実施例に示すようにマスクとしてフィル
ム状のシート５を用いたことを特徴とするものであるが
、上記実施例に示すものに限定されない０例えば、フィ
ルム状のマスク５を、スクリーン印刷の直前に基板２上
にセツティングしてクリーム半田印刷を行うことも可能
である。又上記実施例は基板２の片面にクリーム半田印
刷を行うものであるが、基板２の両面にクリーム半田印
刷を行えるようにしたもの、すなわち基板２の両面にフ
ィルム状のマスク５を粘着したものに、本発明を適用す
ることも可能である。この場合にはフィルム状のマスク
５を耐熱性のある樹脂、例えばポリイミド、フッ素系樹
脂で構成すると、第２面のフィルム状のマスク５が第１
面のクリーム半田印刷後に行なわれるリフロー工程の熱
に耐えることができる。The present invention is characterized in that a film-like sheet 5 is used as a mask as shown in the above embodiments, but is not limited to that shown in the above embodiments.For example, the film-like mask 5 may be It is also possible to perform cream solder printing by setting it on the substrate 2 immediately before screen printing. Further, in the above embodiment, cream solder printing is performed on one side of the substrate 2, but it is possible to perform cream solder printing on both sides of the substrate 2, that is, a film-like mask 5 is attached to both sides of the substrate 2. It is also possible to apply the present invention to. In this case, if the film-like mask 5 is made of heat-resistant resin, such as polyimide or fluororesin, the film-like mask 5 on the second side is
It can withstand the heat of the reflow process that is performed after printing cream solder on the surface.
又第５図に示すように、前記マスク付き基板１上に酸化
防止用シート１３を剥離可能に粘着した構成とすると、
マスク付き基板１の作成からクリーム半田印刷までの間
に長時間を要する場合でも、銅箔３等の酸化を防止でき
る。従って、プリフラックス等による特別の酸化防止策
を施すことなく、マスク付き基板１を長期保存すること
が可能となり、必要に応じてマスク付き基板１を取出し
、前記酸化防止用シート１３を剥離した後、クリーム半
田印刷等の一連の工程を実施することができる。Further, as shown in FIG. 5, if the anti-oxidation sheet 13 is removably adhered to the masked substrate 1,
Even if it takes a long time from creating the masked board 1 to printing the cream solder, oxidation of the copper foil 3 and the like can be prevented. Therefore, it is possible to store the masked substrate 1 for a long period of time without taking any special oxidation prevention measures such as pre-flux, and if necessary, after removing the masked substrate 1 and peeling off the oxidation prevention sheet 13, , cream solder printing, etc. can be performed.
発明の効果
本発明によれば、マスクと基板の表面との間に微小ギャ
ップが生じることを防ぎ、滲みのない正確なりリーム半
田印刷を行うことができる。Effects of the Invention According to the present invention, it is possible to prevent the formation of a minute gap between the mask and the surface of the substrate, and to perform accurate ream solder printing without bleeding.
又スクリーン印刷工程の前に能率良く正確にマスクと基
板との間の位置合わせを行うことができ、作業能率の向
上を図ることができる。Furthermore, it is possible to efficiently and accurately align the mask and the substrate before the screen printing process, thereby improving work efficiency.
第１図は本発明の一実施例のマスク付き基板を示す拡大
断面図、第２図はフィルム状のマスクの製造方法を示す
断面図、第３図はフィルム状のマスクの平面図、第４図
はクリーム半田印刷方法を示す断面図、第５図は本発明
の他の実施例のマスク付き基板を示す拡大断面図である
。
１・−・・・−・・・−・マスク付き基板２・・・・−
・・−・・一基板
５−・−・−・−・−フィルム状のマスク７−・−・・
−・−・−印刷パターン
１１−・・・・−・−・−クリーム半田。
１２・−・・・−−−−一−−−−−スキージ。
代理人 弁理士 小暇治 明 はが２名第１図 第
４図
１−−−マスクイセ（ト寧政 ５−−−フンノ１
Ａす（−マスク２−゛寿４及 ７−１：ｆ
斗・ＩＩぐ外ン １１−７“）−ム牛１）１２−−−
スＡ−ン。FIG. 1 is an enlarged sectional view showing a substrate with a mask according to an embodiment of the present invention, FIG. 2 is a sectional view showing a method for manufacturing a film-like mask, FIG. 3 is a plan view of a film-like mask, and FIG. The figure is a sectional view showing a cream solder printing method, and FIG. 5 is an enlarged sectional view showing a masked substrate according to another embodiment of the present invention. 1・-・・・・・・Substrate with mask 2・・・・−
・・・・One substrate 5−・−・−・−・−Film-like mask 7−・−・・
−・−・−Print pattern 11−・・・・−・−・−Cream solder. 12.------1------Squeegee. Agent Patent attorney Akira Koyaharu 2 people Figure 1 Figure 4 1 --- Maskuise (Tomei Masa 5 --- Funno 1)
Asu(-mask 2-゛ju 4 and 7-1: f
Dou II Gugain 11-7")-Mugyu 1) 12---
Sun A-n.
Claims (4)
基板において、印刷パターンが形成されたフィルム状の
マスクを基板表面に粘着されてなるマスク付き基板。(1) A board with a mask, which is a board printed with cream solder using a screen printing method, in which a film-like mask on which a printed pattern is formed is adhered to the surface of the board.
の印刷パターンに対応するようにして基板上に印刷する
クリーム半田印刷方法において、印刷パターンが形成さ
れたフィルム状のマスクが基板表面に粘着されてなるマ
スク付き基板を用い、このマスク付き基板上に直接クリ
ーム半田を供給しスキージで展延することにより印刷す
ることを特徴とするクリーム半田印刷方法。(2) In the cream solder printing method, in which cream solder is printed on the board in accordance with the printed pattern of the mask using the screen printing method, a film-like mask on which the printed pattern is formed is adhered to the surface of the board. A cream solder printing method using a masked substrate and printing by supplying cream solder directly onto the masked substrate and spreading it with a squeegee.
り剥離する請求項２記載のクリーム半田印刷方法。(3) The cream solder printing method according to claim 2, wherein after printing the cream solder, the adhered mask is peeled off from the substrate.
基板より剥離する請求項２記載のクリーム半田印刷方法
。(4) The cream solder printing method according to claim 2, wherein after printing the cream solder, the mask is peeled off from the substrate by irradiating ultraviolet rays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2303632A JPH04173385A (en) | 1990-11-07 | 1990-11-07 | Substrate fitted with mask and cream solder printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2303632A JPH04173385A (en) | 1990-11-07 | 1990-11-07 | Substrate fitted with mask and cream solder printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04173385A true JPH04173385A (en) | 1992-06-22 |
Family
ID=17923327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2303632A Pending JPH04173385A (en) | 1990-11-07 | 1990-11-07 | Substrate fitted with mask and cream solder printing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04173385A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001001739A1 (en) * | 1999-06-29 | 2001-01-04 | Mayer Carl P | Solder paste stenciling apparatus and method of use for rework |
| JP2005063780A (en) * | 2003-08-11 | 2005-03-10 | Nordson Corp | Electrolyte membrane. electrolyte membrane complex, manufacturing method of electrolyte membrane complex, electrolyte membrane/electrode assembly for fuel cell, manufacturing method of electrolyte membrane/electrode assembly for fuel cell, and fuel cell |
| TWI551461B (en) * | 2015-11-16 | 2016-10-01 | 茂迪股份有限公司 | Screen plate and method of manufacturing the same |
-
1990
- 1990-11-07 JP JP2303632A patent/JPH04173385A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001001739A1 (en) * | 1999-06-29 | 2001-01-04 | Mayer Carl P | Solder paste stenciling apparatus and method of use for rework |
| US6253675B1 (en) | 1999-06-29 | 2001-07-03 | Carl P. Mayer | Solder paste stenciling apparatus and method of use for rework |
| JP2005063780A (en) * | 2003-08-11 | 2005-03-10 | Nordson Corp | Electrolyte membrane. electrolyte membrane complex, manufacturing method of electrolyte membrane complex, electrolyte membrane/electrode assembly for fuel cell, manufacturing method of electrolyte membrane/electrode assembly for fuel cell, and fuel cell |
| TWI551461B (en) * | 2015-11-16 | 2016-10-01 | 茂迪股份有限公司 | Screen plate and method of manufacturing the same |
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