JPH04173959A - Production of metallic sheet plated with al alloy by vapor deposition - Google Patents
Production of metallic sheet plated with al alloy by vapor depositionInfo
- Publication number
- JPH04173959A JPH04173959A JP30146390A JP30146390A JPH04173959A JP H04173959 A JPH04173959 A JP H04173959A JP 30146390 A JP30146390 A JP 30146390A JP 30146390 A JP30146390 A JP 30146390A JP H04173959 A JPH04173959 A JP H04173959A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- vapor
- evaporation
- deposited
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000007740 vapor deposition Methods 0.000 title description 10
- 238000001704 evaporation Methods 0.000 claims abstract description 55
- 238000005275 alloying Methods 0.000 claims abstract description 27
- 230000008020 evaporation Effects 0.000 claims description 49
- 238000007747 plating Methods 0.000 claims description 42
- 239000000203 mixture Substances 0.000 claims description 25
- 229910045601 alloy Inorganic materials 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 22
- 229910000831 Steel Inorganic materials 0.000 abstract description 19
- 239000010959 steel Substances 0.000 abstract description 19
- 238000010438 heat treatment Methods 0.000 abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 abstract description 9
- 229910052719 titanium Inorganic materials 0.000 abstract description 9
- 238000000151 deposition Methods 0.000 abstract description 4
- 229910018575 Al—Ti Inorganic materials 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 9
- 229910052725 zinc Inorganic materials 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、蒸着法によってAl合金めっき金属板を製造
する方法の改良に関し、殊に金属板上にAl合金めっき
層を形成するに際し、該Al合金めっき層の厚さ方向に
おけるめっき組成の不均一性を軽減してできるだけ均一
な組成の蒸着Al合金めっき層が得られる様にした方法
に関するものである。Detailed Description of the Invention [Industrial Application Field] The present invention relates to an improvement in a method for manufacturing an Al alloy plated metal plate by a vapor deposition method, and in particular, when forming an Al alloy plated layer on a metal plate. The present invention relates to a method for reducing non-uniformity of the plating composition in the thickness direction of the Al alloy plating layer so as to obtain a vapor deposited Al alloy plating layer having as uniform a composition as possible.
尚本発明は、様々の金属板を対象として蒸着法によりA
l合金めつき処理し得るものであれば、金属板の種類は
特に制限されないが、本明細書では最近特に注目されて
いる蒸着Al合金めつき鋼板を主体にして説明する。In addition, the present invention targets various metal plates by applying A by a vapor deposition method.
The type of metal plate is not particularly limited as long as it can be subjected to l-alloy plating treatment, but in this specification, the description will focus mainly on vapor-deposited Al alloy-plated steel sheets, which have recently attracted particular attention.
[従来の技術]
Al合金めっ鎗鋼板は耐熱性、耐食性、成形加工性、熱
反射性、審美性等において優れたものであり、また生産
コストも比較的安価であるところから、自動車排気系部
材、焼却炉部材、家庭用各種電気製品用部材、建材等を
はじめとして広く利用されている。[Prior art] Al alloy plated steel sheets are excellent in heat resistance, corrosion resistance, formability, heat reflection, aesthetics, etc., and are relatively inexpensive to produce, so they are used in automobile exhaust systems. It is widely used for parts, incinerator parts, parts for various household electrical appliances, building materials, etc.
中でもAlにCr、Ti、Zn、Cu等の合金化成分を
組合せた蒸着Al合金めつきは、合金元素の種類や含有
量を変えることによフて用途に応じた特性を与えること
ができることから、最近その需要は大幅に増大してきて
いる。Among these, vapor-deposited Al alloy plating, which combines Al with alloying components such as Cr, Ti, Zn, and Cu, is useful because it is possible to provide properties depending on the application by changing the type and content of the alloying elements. , the demand for which has recently increased significantly.
Al合金めっき法としては主に溶融めっきか採用されて
いたが、最近、帯状鋼板を連続走行させながらその下面
側にAIおよび合金化元素の蒸気を供給して鋼板表面に
付着させる真空蒸着法が開発されるに及び(特開昭64
−21060号、同64−28359号等)、合金組成
の調整が容易で連続生産に通しているという理由もあっ
て脚光をあびている。Hot-dip plating has been mainly used as the Al alloy plating method, but recently, a vacuum evaporation method has been developed in which vapors of AI and alloying elements are supplied to the lower surface of the steel strip while it is continuously running, and the vapor is deposited on the surface of the steel strip. As it was developed (Japanese Unexamined Patent Publication No. 1983
No. 21060, No. 64-28359, etc.), it is attracting attention partly because the alloy composition can be easily adjusted and it can be produced continuously.
ところで、蒸着Al合金めっきを行なう際に最も問題と
なるのは、Al合金めっき層における厚さ方向の均一性
である。たとえば第3図は、従来の蒸着Al合金めフき
法を示す概念図であり、矢印A方向に連続走行する帯状
鋼板1の下側に金属蒸発槽2a、2bを帯状鋼板1の走
行方向に沿って配置し、一方の蒸発槽2aにAlを装入
すると共に他方の蒸発槽2bには合金元素(以下、合金
元素というときは、Ti、Cr、Cu、Ni。By the way, the most important problem when performing vapor-deposited Al alloy plating is the uniformity of the Al alloy plating layer in the thickness direction. For example, FIG. 3 is a conceptual diagram showing a conventional vapor-deposited Al alloy cleaning method, in which metal evaporators 2a and 2b are placed below a steel strip 1 that is continuously running in the direction of arrow A, and metal evaporators 2a and 2b are placed in the direction of travel of the steel strip 1. One evaporation tank 2a is charged with Al, and the other evaporation tank 2b is filled with alloying elements (hereinafter referred to as alloying elements: Ti, Cr, Cu, Ni).
Zn、Fe、Si等の元素のほか、Al2O3やSin
、等のセラミックス成分も包含するか、以下、Tiで代
表する)を装入して電子ビーム等(図示せず)によって
加熱蒸発せしめ、これらの蒸気を帯状鋼板1の下面側に
蒸着させる。このとき、第3図からも明らかである様に
、帯状鋼板1にはまず最初にAl!#独もしくはAlリ
ッチの蒸気が蒸着し、次いでAIとT1の混合蒸気か蒸
着した後、最後にTi1l独もしくはTiリッチの蒸気
が蒸着することになり、蒸着層の合金組成は厚さ方向に
見て不均一なものとなる。この様にめっき層の合金組成
が徐々に変化しているものは、用途、目的によっては「
傾斜機能材料」として好まれる場合もあるが、−船釣に
は厚さ方向で合金組成の均一なめっき材を望む場合の方
か多い。In addition to elements such as Zn, Fe, and Si, Al2O3 and Sin
(hereinafter represented by Ti) is charged and heated and evaporated by an electron beam or the like (not shown), and these vapors are deposited on the lower surface side of the strip steel plate 1. At this time, as is clear from FIG. 3, the strip steel plate 1 is first coated with Al! #German or Al-rich vapor is deposited, then a mixed vapor of AI and T1 is vaporized, and finally Ti1l-rich or Ti-rich vapor is vapor deposited, and the alloy composition of the deposited layer is determined in the thickness direction. This results in non-uniformity. In this way, the alloy composition of the plating layer gradually changes, depending on the use and purpose.
In some cases, it is preferred as a functionally graded material, but in many cases, for boat fishing, a plated material with a uniform alloy composition in the thickness direction is desired.
そこで、第4図に示す如く1つの蒸発槽2にAlとTi
を装入して同時に加熱蒸発させることも検討されたが、
この方法では次の様な問題を生じる。即ちAlとTiの
平衡蒸気圧は異なるため、合金浴組成と蒸気組成を同一
に保つことはむつかしい。たとえばTiはAlに比べて
平衡蒸気圧が小さいので、混合蒸気中のTi含量は合金
洛中のTi含量よりも少なく、しかも最初は相対的に多
量のAlが蒸発して蒸気組成はAlリッチとなるが、処
理時間が経過しめっき浴のAl含量が低下してくるにつ
れて蒸気中のTi含量は次第に増大してくる。従って蒸
気組成、即ちめっき組成を一定に保つには、合金浴組成
および浴温度を常に一定に維持しなければならず、蒸気
組成を一定に維持する為の制御は決して容易なことでは
ない。こうした問題は、3成分系以上の多成分系合金め
フきを行なう場合には更に顕著になってくる。Therefore, as shown in Fig. 4, one evaporation tank 2 contains Al and Ti.
It was also considered to charge and heat evaporate at the same time, but
This method causes the following problems. That is, since the equilibrium vapor pressures of Al and Ti are different, it is difficult to keep the alloy bath composition and the vapor composition the same. For example, Ti has a lower equilibrium vapor pressure than Al, so the Ti content in the mixed vapor is lower than the Ti content in the alloy, and initially a relatively large amount of Al evaporates, making the vapor composition rich in Al. However, as the treatment time passes and the Al content of the plating bath decreases, the Ti content in the steam gradually increases. Therefore, in order to keep the vapor composition, that is, the plating composition constant, the alloy bath composition and bath temperature must always be kept constant, and control to keep the vapor composition constant is by no means easy. These problems become even more noticeable when performing multi-component alloy polishing of three or more components.
またAI単独であれば、アルミナ系等のセラミックス製
蒸発槽を使用することによって支障なく蒸着処理を行な
うことができるが、TiをAIと共にセラミックス製蒸
発槽へ装入して加熱すると、蒸発槽構成材が溶融状態の
Tiによって還元・侵食を受けて耐火材中の酸素やMg
、Ca。In addition, if AI is used alone, the vapor deposition process can be carried out without any problems by using an evaporator made of ceramics such as alumina, but if Ti is charged together with AI into a ceramic evaporator and heated, the evaporator structure will be Oxygen and Mg in the refractory material are reduced and eroded by molten Ti.
, Ca.
Si等が洛中に混入して融点や粘性を変化させるばかり
でなく、蒸気中にもこれらの不純元素が混入してめフき
層の品質を劣化させる。そこでAlおよびTi等の合金
化成分の両方に耐えるものとして銅製の水冷式蒸発槽が
用いられているが、水冷構造の蒸発槽では蒸発の為に加
えられる熱の大半が蒸発槽に吸収されるため熱効率が極
端に悪くなる。Not only do Si and the like get mixed into the steam and change the melting point and viscosity, but these impurity elements also get mixed into the steam, degrading the quality of the cleaning layer. Therefore, water-cooled evaporation tanks made of copper are used to withstand both alloying components such as Al and Ti, but in evaporation tanks with a water-cooled structure, most of the heat added for evaporation is absorbed by the evaporation tank. As a result, thermal efficiency becomes extremely poor.
[発明が解決しようとする課題]
本発明は上記の様な事情に着目してなされたものてあっ
て、その目的は、金属板に蒸着法によってAl合金めっ
きを形成するに当たり、AIと合金元素を個別の蒸発槽
で加熱蒸発させる方法を採用することによって、浴組成
の制御に要する困難を排除すると共に、蒸発槽構成材の
侵食等の問題を解消し、且つ個別の蒸発槽から蒸発させ
ることによって生じるめっき層の厚さ方向の不均一を軽
減し、均一な合金組成の蒸着Al合金めっき金属板を得
ることのできる方法を提供しようとするものである。[Problems to be Solved by the Invention] The present invention has been made with attention to the above-mentioned circumstances, and its purpose is to form an Al alloy plating on a metal plate by vapor deposition, in which AI and an alloying element are combined. By adopting a method of heating and evaporating the water in separate evaporation tanks, it is possible to eliminate the difficulty required to control the bath composition, solve problems such as erosion of the evaporation tank constituent materials, and evaporate from the individual evaporation tanks. The present invention aims to provide a method that can reduce the non-uniformity in the thickness direction of the plating layer caused by the method and obtain a vapor-deposited Al alloy plated metal plate having a uniform alloy composition.
[課題を解決するための手段]
上記課題を解決することのできた本発明に係る製法の構
成は、走行する帯状金属板の下側に、Alと合金元素の
各蒸発槽を上記帯状金属板の走行方向に沿って配置し、
各蒸発槽からの蒸発物を前記帯状金属板の下側表面に混
合付着させて蒸着Al合金めっき層を形成する蒸着Al
合金めっき金属板の製法において、Alおよび合金元素
の少なくとも一方は2以上の蒸発槽に分けて収納すると
共に、Alまたは合金元素の蒸発槽が他方の合金元素ま
たはAIの蒸発槽によって分断される様に配置すること
により、Al合金めっき層におけるめっき組成の厚さ方
向の不均一性を軽減するところに要旨を有するものであ
る。[Means for Solving the Problems] The structure of the manufacturing method according to the present invention that can solve the above problems is that evaporation tanks for Al and alloying elements are provided below the running belt-shaped metal plate. Placed along the running direction,
Evaporated Al is mixed and deposited on the lower surface of the strip-shaped metal plate to form a vapor-deposited Al alloy plating layer with evaporated substances from each evaporation tank.
In the method for manufacturing alloy plated metal sheets, at least one of Al and the alloying element is stored separately in two or more evaporation tanks, and the evaporation tank for Al or the alloying element is separated by the evaporation tank for the other alloying element or AI. The purpose is to reduce the non-uniformity of the plating composition in the Al alloy plating layer in the thickness direction by arranging the aluminum alloy plating layer.
[作用コ
以下、再び鋼板にAlとTiよりなる合金蒸着めっきを
施す場合を主体として、図面を参照しつつ本発明の構成
および作用効果を具体的に説明する。[Function] Hereinafter, the structure and effects of the present invention will be specifically explained with reference to the drawings, mainly focusing on the case where a steel plate is coated with an alloy vapor deposition of Al and Ti.
第1図は本発明に係る最も基本的な構成を示す概念図で
あり、矢印A方向に走行する帯状鋼板1の下側に、該帯
状鋼板1の走行方向に沿って3個の蒸発槽2a、2b、
2cを隣接して配置し、蒸発[2bにはTiを装入する
と共に蒸発槽2a。FIG. 1 is a conceptual diagram showing the most basic configuration according to the present invention, in which three evaporation tanks 2a are arranged below the steel strip 1 running in the direction of arrow A along the running direction of the steel strip 1. , 2b,
2c are placed adjacent to each other, and evaporation is carried out [2b is charged with Ti and the evaporation tank 2a is placed.
2cにはAIを装入する。そして図示しない加熱源(電
子ビーム等)によって各蒸発槽内の金属を加熱蒸発させ
る。尚該蒸発雰囲気は、従来の蒸着めっ詮法と同様高真
空状態に状態に維持される。Charge AI to 2c. Then, the metal in each evaporation tank is heated and evaporated by a heating source (such as an electron beam) not shown. Note that the evaporation atmosphere is maintained at a high vacuum state as in the conventional vapor deposition plating method.
この方法であれば、第1図からも明らかである様に蒸着
Al合金めっき層の初層部および最表層側はAIリッチ
となるが、中間層部はAIとT1がほぼ均一に蒸着した
合金めっき層となる。しかも各蒸発槽2a〜2Cは、装
入される金属に応じた耐食性材料を選択して使用するこ
とにより蒸発槽の侵食は効果的に抑えられ、且つ不純物
が蒸着めっき層内へ混入する恐れもなくなる。またAl
およびTiの蒸発量は、各蒸発槽2a〜2cに電子ビー
ム等によって加えられる熱エネルギーを調節することに
よって任意に変更することができるので、めっき層に要
求される特性(耐食性、光沢、めっき後の加工性等)に
応じて希望に応じた組成のめっき層を得ることができる
。With this method, as is clear from Figure 1, the initial layer and the outermost layer of the vapor-deposited Al alloy plating layer will be rich in AI, but the intermediate layer will be an alloy in which Al and T1 are almost uniformly vapor-deposited. It becomes a plating layer. Moreover, by selecting and using a corrosion-resistant material according to the metal to be charged in each of the evaporation tanks 2a to 2C, corrosion of the evaporation tank can be effectively suppressed, and there is also a risk that impurities may be mixed into the vapor-deposited plating layer. It disappears. Also, Al
The amount of evaporation of Ti can be arbitrarily changed by adjusting the thermal energy applied to each evaporation tank 2a to 2c by an electron beam or the like, so the properties required for the plating layer (corrosion resistance, gloss, It is possible to obtain a plating layer with a desired composition depending on the processability, etc.).
第2図は本発明の他の実施例を示すものであり、帯状鋼
板1の走行方向に沿って配置した蒸発槽2a〜2dに、
夫々交互にAIとTiを装入して加熱蒸発させる構成と
した以外は第1図の例と実質的に変わらない。FIG. 2 shows another embodiment of the present invention, in which evaporation tanks 2a to 2d arranged along the running direction of the strip steel plate 1,
The structure is substantially the same as the example shown in FIG. 1, except that AI and Ti are alternately charged and heated to evaporate.
尚第1.2図では2種の金属元素(AIとTi)よりな
る合金めっきを行なう場合について説明したが、Alと
他の合金化成分(たとえばCr、Cu、Ni、Zn、F
e、SL等)よりなる合金層を形成する場合においても
、上記方法に準じて同様に実施すればよく、またこの方
法を利用すれば、金属以外にAl2O3や5i02等の
セラミックスをAlと併用して複合AIめっきを得るこ
とも可能である。In Fig. 1.2, the case was explained in which alloy plating is made of two metal elements (AI and Ti), but when Al and other alloying components (such as Cr, Cu, Ni, Zn, F
In the case of forming an alloy layer consisting of Al, SL, etc.), the above method can be carried out in the same manner. If this method is used, ceramics such as Al2O3 and 5i02 can be used in combination with Al in addition to metals. It is also possible to obtain composite AI plating.
要するに本発明では、AIと1種または2種以上の合金
元素からなる蒸着Al合金めっきを行なうに当り、Al
と合金元素を夫々別個の蒸発槽から蒸発させることとし
、且つAIおよび合金元素の少なくとも一方は2以上の
蒸発槽に分けて収納すると共に、他方の合金元素または
AIの蒸発槽によって分断される様に配置して蒸着Al
合金めっきを行なうものである。そしてAIおよび合金
元素の蒸発領域を相互にオーバーラツプさせ、それらを
帯状金属板の下面側で混合させることにより、蒸着Al
合金めっき層の厚さ方向における成分組成の不均一性を
軽減するところに特徴を有するものである。従ってこう
した特徴を有効に生かし得る限り、Alと組合わされる
合金元素の種類や数、あるいは帯状金属の種類等にも一
切制限がなく、また蒸発の為の熱源も電子ビーム加熱以
外に抵抗加熱、高周波加熱、レーザービーム加熱等を利
用することができる。また本発明において蒸着めっき法
とは広義の蒸着めっ籾法を意味するものであり、イオン
ブレーティング法、スパッタリング法、CVD法等もす
べて本発明で採用される蒸着めっき法の範噴に含まれる
。In short, in the present invention, when performing vapor-deposited Al alloy plating consisting of AI and one or more alloying elements,
and alloying element are evaporated from separate evaporation tanks, and at least one of AI and alloying element is stored separately in two or more evaporation tanks, and is separated by the evaporation tank of the other alloying element or AI. evaporated Al
Alloy plating is performed. Then, by overlapping the evaporation regions of AI and alloying elements with each other and mixing them on the lower surface side of the strip metal plate, the evaporated Al
It is characterized by reducing the non-uniformity of the composition in the thickness direction of the alloy plating layer. Therefore, as long as these characteristics can be effectively utilized, there are no restrictions on the type or number of alloying elements that can be combined with Al, or the type of metal strip, and the heat source for evaporation can also be resistance heating, in addition to electron beam heating. High frequency heating, laser beam heating, etc. can be used. In addition, in the present invention, the vapor deposition plating method refers to a vapor deposition plating method in a broad sense, and ion blating methods, sputtering methods, CVD methods, etc. are all included in the scope of vapor deposition plating methods employed in the present invention. It can be done.
[実施例コ
実施例1
第1図に示した蒸発槽2a〜2cの配置を採用し、下記
の条件で蒸着Al−Cr合金めっき鋼板を製造した。[Example 1] The arrangement of the evaporation tanks 2a to 2c shown in FIG. 1 was adopted, and a vapor-deposited Al--Cr alloy plated steel sheet was manufactured under the following conditions.
(実験条件)
被めっき材:フェライト系ステンレス鋼”I (SUS
4101)・・・アルカリ電解脱脂後、真空中で電子線
照射による加熱及び
Arイオンボンバードメントによ
り表面を活性化処理したものを使
用、予熱温度は350〜400℃
蒸発槽2a〜2c:いずれもアルミナ−シリカ系セラミ
ックス製のものを使用。(Experimental conditions) Material to be plated: Ferritic stainless steel "I" (SUS
4101)... After alkaline electrolytic degreasing, the surface is activated by heating with electron beam irradiation and Ar ion bombardment in vacuum, preheating temperature is 350 to 400°C Evaporation tanks 2a to 2c: All alumina -Uses one made of silica-based ceramics.
蒸発原料 =2aと2c内にCr、2b内にAlを装入
。Evaporation raw material = Cr is charged into 2a and 2c, and Al is charged into 2b.
加熱法 :ピアス型電子銃(最大出力300kw)を
使用し、磁場による電子線
の偏光、蒸発原料表面上の走査
(スキャニング)および蒸発槽間
のジャンピングを実施。Heating method: Using a piercing type electron gun (maximum output 300kW), polarization of the electron beam by a magnetic field, scanning on the surface of the evaporation raw material, and jumping between evaporation tanks were performed.
被めっき材−蒸発槽間距離、垂直距離で350〜500
mm
蒸着室の真空度:約1O−2Pa
めっき付着量:約20 g/m2
めっき組成:85%Al−15%Cr
得られた蒸着めっき層の厚さ方向の合金組成を調へたと
ころ、合金組成は厚さ方向でほぼ均一であり、Al.3
Cr2の金属間化合物相とAl相が均一に分散されたも
のであることが確認された。Distance between plated material and evaporation tank, vertical distance 350 to 500
mm Vacuum degree of vapor deposition chamber: Approximately 1O-2Pa Plating deposition amount: Approximately 20 g/m2 Plating composition: 85%Al-15%Cr When the alloy composition in the thickness direction of the obtained vapor-deposited plating layer was investigated, it was found that the alloy The composition is almost uniform in the thickness direction, and Al. 3
It was confirmed that the Cr2 intermetallic compound phase and the Al phase were uniformly dispersed.
実施例2
第2図に示した蒸発槽2a〜2dの配置を採用し、下記
の条件で蒸着Al−Zn合金めっき鋼板を製造した。Example 2 The arrangement of the evaporation tanks 2a to 2d shown in FIG. 2 was adopted, and a vapor-deposited Al-Zn alloy plated steel sheet was manufactured under the following conditions.
(実験条件) 被めっき材:前記実施例1と同じ。(Experimental conditions) Material to be plated: Same as in Example 1.
蒸発槽 :2a、2c・・・アルミナ−シリカ系セラ
ミックス製、
2b、2d・・・グラファイト製、
蒸発原料 +2a、2c内・・・Al
2b、2d内・・・Zn
加熱法 ・2個の電子銃(ピアス型、最大出力300
kw)を、蒸発槽群2a〜
2dを挟んで銅帯の走行方向の
前・後に配置し、一方の電子銃で
蒸発槽2a、2b内のAlとZn
を、また他方の電子銃で蒸発槽
2c、2d内のAlとZnを加熱
する。Evaporation tank: 2a, 2c... Made of alumina-silica ceramics, 2b, 2d... Made of graphite, Evaporation raw material + Inside 2a, 2c... Al Inside 2b, 2d... Zn Heating method ・2 electrons Gun (pierce type, maximum output 300
kw) are placed in front and behind the copper strip in the traveling direction with the evaporator groups 2a to 2d in between, and one electron gun is used to collect Al and Zn in the evaporators 2a and 2b, and the other electron gun is used to Heat Al and Zn in 2c and 2d.
被めっき材−蒸発槽間距離・垂直距離で350〜500
mDI
蒸着室の真空度:約1O−2Pa
めっき付着量:約40 g/m2
めっき組成 =50%Al−50%Zn得られた蒸着め
っき層の厚さ方向の合金組成を調べたところ、はぼ均一
なAlとZnのプロフィールを有しており、α−AIリ
ッチ相とβ−Znリッチ相が均一に混合されためっき層
となっていることが確認された。Distance/vertical distance between plated material and evaporation tank: 350 to 500
mDI Deposition chamber vacuum degree: Approximately 1O-2Pa Plating deposition amount: Approximately 40 g/m2 Plating composition = 50% Al-50% Zn When the alloy composition in the thickness direction of the obtained vapor-deposited plating layer was investigated, it was found that It was confirmed that the plated layer had a uniform Al and Zn profile, and the α-AI rich phase and the β-Zn rich phase were uniformly mixed.
[発明の効果]
本発明は以上の様に構成されており、Alと合金元素を
別々の蒸発槽から蒸発させる方法であるにもかかわらず
、蒸着Al合金めっき層の厚さ方向における組成不均一
を著しく軽減することができ、均質で安定した品質の蒸
着Al合金めつき金属板を優れた生産性のもとて効率良
く製造し得ることになった。しかも本発明ではAlと合
金元素を夫々別個の蒸発槽で加熱し蒸発させる方法であ
るから、各蒸発槽への熱量を調節して蒸発量を変えるこ
とによりめっき組成を自由に変更することができ、用途
、目的に応じた性能のAl合金めつき材を得ることがで
きる。[Effects of the Invention] The present invention is configured as described above, and although it is a method of evaporating Al and alloy elements from separate evaporation tanks, compositional non-uniformity in the thickness direction of the vapor-deposited Al alloy plating layer is avoided. As a result, it has become possible to significantly reduce the amount of stress, and to efficiently produce vapor-deposited Al alloy-plated metal plates of uniform and stable quality with excellent productivity. Moreover, since the present invention uses a method in which Al and alloying elements are heated and evaporated in separate evaporation tanks, the plating composition can be freely changed by adjusting the amount of heat to each evaporation tank and changing the amount of evaporation. , it is possible to obtain an Al alloy plated material with performance suitable for the application and purpose.
第1.2図は本発明の実施例を示す概念図、第3.4図
は従来例を示す概念図である。Fig. 1.2 is a conceptual diagram showing an embodiment of the present invention, and Fig. 3.4 is a conceptual diagram showing a conventional example.
Claims (1)
発槽を上記帯状金属板の走行方向に沿って配置し、各蒸
発槽からの蒸発物を前記帯状金属板の下側表面に混合付
着させて蒸着Al合金めっき層を形成する蒸着Al合金
めっき金属板の製法において、Alおよび合金元素の少
なくとも一方は2以上の蒸発槽に分けて収納すると共に
、Alまたは合金元素の蒸発槽が他方の合金元素または
Alの蒸発槽によって分断される様に配置することによ
り、Al合金めっき層におけるめっき組成の厚さ方向の
不均一性を軽減することを特徴とする蒸着Al合金めっ
き金属板の製法。Each evaporation tank for Al and alloying elements is arranged below the running metal strip along the running direction of the metal strip, and the evaporated matter from each evaporation tank is mixed on the lower surface of the metal strip. In a method for producing a vapor-deposited Al alloy plated metal plate in which a vapor-deposited Al alloy plating layer is formed, at least one of Al and the alloy element is stored separately in two or more evaporation tanks, and the evaporation tank for Al or the alloy element is stored in the other. A method for producing a vapor-deposited Al alloy plated metal sheet, characterized in that non-uniformity of the plating composition in the thickness direction of the Al alloy plated layer is reduced by arranging the plate so as to be separated by an evaporation tank of alloying elements or Al. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30146390A JPH04173959A (en) | 1990-11-06 | 1990-11-06 | Production of metallic sheet plated with al alloy by vapor deposition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30146390A JPH04173959A (en) | 1990-11-06 | 1990-11-06 | Production of metallic sheet plated with al alloy by vapor deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04173959A true JPH04173959A (en) | 1992-06-22 |
Family
ID=17897203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30146390A Pending JPH04173959A (en) | 1990-11-06 | 1990-11-06 | Production of metallic sheet plated with al alloy by vapor deposition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04173959A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009041098A (en) * | 2007-08-11 | 2009-02-26 | Sumitomo Electric Ind Ltd | Film deposition method |
-
1990
- 1990-11-06 JP JP30146390A patent/JPH04173959A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009041098A (en) * | 2007-08-11 | 2009-02-26 | Sumitomo Electric Ind Ltd | Film deposition method |
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