JPH0417015B2

JPH0417015B2 -

Info

Publication number: JPH0417015B2
Application number: JP17847684A
Authority: JP
Inventors: Toshio Matsukura; Toshasu Takei; Ichiro Iwase; Saburo Iida; Toshiichi Yasuoka; Masao Furukawa
Original assignee: Oki Electric Industry Co Ltd
Current assignee: Oki Electric Industry Co Ltd
Priority date: 1984-08-29
Filing date: 1984-08-29
Publication date: 1992-03-25
Also published as: JPS6158185A

Description

【発明の詳細な説明】（産業上の技術分野）本発明は位置決め性の良い簡便な混成IC搭載
保安器（Hybrid Intergrated Surge Protector、
以下HISPという）の製造方法に関するものであ
る。[Detailed Description of the Invention] (Industrial Technical Field) The present invention provides a hybrid integrated surge protector (Hybrid Intergrated Surge Protector) which is simple and has good positioning properties.
This article relates to a manufacturing method for HISP (hereinafter referred to as HISP).

（従来の技術）従来のHISPの製造方法について第３図、第４
図及び第５図を用いて説明する。第３図は従来の
製造方法によるHISPの平面図、第４図、第５図
はそれぞれHISPの正面図を示す。図において１
は厚膜電気回路を形成したアルミナ基板、２はバ
リスタ、３は溶断抵抗器、４は避雷管、５は入出
力及び接地用端子（以下端子と略す。）、５−１，
５−２は従来の端子の側面形状を示し、５−１は
アルミナ基板１をはさみ込む場合、５−２は端子
５にダボを形成した場合である。６はアルミナ基
板１とバリスタ２、溶断抵抗器３、避雷管４、端
子５をリフロー装置を使用して半田接続する際の
治具である。(Conventional technology) Figures 3 and 4 show the conventional HISP manufacturing method.
This will be explained using FIG. FIG. 3 is a plan view of the HISP manufactured by the conventional manufacturing method, and FIGS. 4 and 5 are front views of the HISP. In the figure 1
is an alumina substrate on which a thick film electric circuit is formed, 2 is a varistor, 3 is a fusing resistor, 4 is a detonator, 5 is an input/output and grounding terminal (hereinafter abbreviated as a terminal), 5-1,
5-2 shows the side shape of a conventional terminal, 5-1 shows the case where the alumina substrate 1 is sandwiched, and 5-2 shows the case where the terminal 5 is formed with a dowel. Reference numeral 6 denotes a jig for soldering the alumina substrate 1, varistor 2, fusing resistor 3, detonator 4, and terminal 5 using a reflow device.

このような構成において、その半田接続方法は
治具６にアルミナ基板１をセツトし、基板１上に
バリスタ２、溶断抵抗器３、避雷管４及び端子５
−１又は５−２を搭載し、その後、リフロー装置
で半田接続する。 In such a configuration, the solder connection method is to set the alumina substrate 1 on the jig 6, and place the varistor 2, fusing resistor 3, detonator 4, and terminal 5 on the substrate 1.
-1 or 5-2 is mounted and then soldered using a reflow device.

（発明が解決しようとする問題点）しかしながら、第３図〜第５図に示すHISP形
状である場合、アルミナ基板１と端子５との寸法
精度を保持するため、治具６が必要不可欠とな
る。この治具６を使用する為、リフロー条件が安
定しないものになる。まず、治具の温度管理を充
分しなければならない。アルミナ基板１上の厚膜
材料にはAgペーストを用いており、リフロー温
度を高くし過ぎたり、時間を長く伸ばすことによ
り銀拡散が進行し膜強度が劣化し、使用できない
ものになることは周知のことである。又、治具６
の熱容量、熱伝導性の問題があり、リフロー時間
を治具無しに比べ長くせざる得ない。(Problem to be Solved by the Invention) However, in the case of the HISP shape shown in FIGS. 3 to 5, the jig 6 is indispensable in order to maintain the dimensional accuracy between the alumina substrate 1 and the terminal 5. . Since this jig 6 is used, the reflow conditions become unstable. First, the temperature of the jig must be adequately controlled. Ag paste is used as the thick film material on the alumina substrate 1, and it is well known that if the reflow temperature is set too high or the reflow time is extended too long, silver diffusion will progress and the film strength will deteriorate, making it unusable. It is about. Also, jig 6
There are problems with heat capacity and thermal conductivity, and the reflow time has to be longer than without a jig.

さらに、半田接続後、治具６からHISPを取り
外す際、簡単に取り外すことができない。理由は
半田リフロー時のフラツクスが治具６に回り込み
治具６と基板１及び治具６と端子５が接着してし
まうからである。また、簡単に取り外す為にフラ
ツクスの洗浄を行なうと治具の温度が下がつてし
まい、再度リフローする際に工数がかかる等の問
題が残る。 Furthermore, when removing the HISP from the jig 6 after soldering, it is not possible to remove it easily. This is because the flux during solder reflow wraps around the jig 6 and causes the jig 6 and the board 1 and the jig 6 and the terminal 5 to be bonded together. Further, if the flux is cleaned for easy removal, the temperature of the jig will drop, and there will be problems such as the need for additional man-hours when reflowing the jig.

以上、従来HISPの製造方法の欠点について下
記に要約する。 The drawbacks of the conventional HISP manufacturing method are summarized below.

(1) 治具の使用によりリフロー条件が不安定とな
り、厚膜部分の信頼性が得られない。(1) The use of jigs makes the reflow conditions unstable, making it difficult to achieve reliability in thick film parts.

(2) 製品のセツト及び取り外しに工数が多くかか
り量産に不向きである。(2) It takes a lot of man-hours to set up and remove the product, making it unsuitable for mass production.

(3) 治具の製作及び管理が必要となる。(3) Manufacturing and management of jigs is required.

（問題点を解決するための手段）本発明は基板及び入出力用端子に位置決め用の
穴又はダボと切込み部を有するダミー部を設け、
治具を用いず直接リフロー装置に載せて半田接続
し、ダミー部はその後カツトするようにしたもの
である。(Means for Solving the Problems) The present invention provides a dummy portion having a positioning hole or dowel and a notch on the board and the input/output terminal,
The dummy part is directly placed on a reflow machine and soldered without using a jig, and the dummy part is then cut out.

（実施例）第１図は本発明製造方法の一実施例を示す
HISPの平面図、第２図は同じくその正面図であ
る。なお、第３図〜第５図と同一の部品には同一
の参照符号を付した。図において１１−１は端子
位置決め用の穴ａを有し、リフロー半田付け後、
切込部ｃでカツトされるダミーのアルミナ基板、
１１はこのアルミナ基板１１−１を合わせて持つ
と同時に厚膜電気回路を形成したアルミナ基板、
１２−１はアルミナ基板１１の位置決め用ダボｂ
を有し、リフロー半田付け後、切込みｄでカツト
される端子ダミー部、１２はこの端子ダミー部１
２−１を合わせ持つ入出力及び接地用端子であ
る。なお第１図は１枚の基板１１−１から製品で
あるHISPの３個採りを可能にした例である。(Example) Figure 1 shows an example of the manufacturing method of the present invention.
The plan view of HISP, Figure 2, is also its front view. Note that the same parts as in FIGS. 3 to 5 are given the same reference numerals. In the figure, 11-1 has a hole a for positioning the terminal, and after reflow soldering,
A dummy alumina substrate cut at the notch c,
11 is an alumina substrate which also holds this alumina substrate 11-1 and at the same time forms a thick film electric circuit;
12-1 is a dowel b for positioning the alumina substrate 11
12 is the terminal dummy part 1 which is cut at the notch d after reflow soldering.
This is an input/output and grounding terminal that also has 2-1. Note that FIG. 1 is an example in which it is possible to extract three HISP products from one board 11-1.

次に、その製造方法は該アルミナ基板１１上に
バリスタ２、溶断抵抗器３、避雷管４を順次搭載
する。次に位置決め用ダボｂを有する端子１２を
位置決め用穴ａを有するアルミナ基板１１に搭載
する。その後、治具を用いず直接リフロー装置に
載せ半田接続する。次に洗浄を行ない、基板１１
−１及び端子１２−１のダミー部を切込みｃ，ｄ
を利用してカツトし、完成する。 Next, the manufacturing method sequentially mounts the varistor 2, the fusing resistor 3, and the detonator 4 on the alumina substrate 11. Next, the terminal 12 having the positioning dowel b is mounted on the alumina substrate 11 having the positioning hole a. Thereafter, it is directly placed on a reflow device and soldered without using a jig. Next, cleaning is performed, and the substrate 11
-1 and the dummy part of terminal 12-1 are cut c, d
Use to cut and complete.

ここで治具を用いないで良い理由は、第１図、
第２図に示される通り、端子１２をアルミナ基板
１１に搭載可能にしたこと及びリフロー時の位置
ずれをダボｂと穴ａの組み合わせにより防止した
ことにするものである。なおダボｂと穴ａはどち
らに設けてもよい。 The reason why you do not need to use a jig here is as shown in Figure 1.
As shown in FIG. 2, the terminals 12 can be mounted on the alumina substrate 11, and positional displacement during reflow can be prevented by the combination of dowels b and holes a. Note that the dowel b and the hole a may be provided in either direction.

このように位置決め用穴又はダボを有するダミ
ー部を基板に設けたため、治具の必要がなくな
り、１回だけのリフローにより安定した半田接続
が可能で、従来の欠点をことごとく除去できる。
なお、実施例ではHISPの製造方法について述べ
たがAgペースト材料を用いる厚膜基板において
も端子が基板に搭載できれば応用できることは当
然である。 Since the dummy portion having the positioning holes or dowels is provided on the board in this way, there is no need for a jig, and stable solder connection is possible with only one reflow, and all the drawbacks of the conventional method can be eliminated.
In addition, although the manufacturing method of HISP was described in the embodiment, it goes without saying that the present invention can also be applied to thick film substrates using Ag paste material as long as the terminals can be mounted on the substrate.

（発明の効果）以上詳細に説明したように、本発明によれば治
具を用いず、１回のみのリフローにより半田接続
ができるようにしたから、次のような効果があ
る。(Effects of the Invention) As described in detail above, according to the present invention, solder connection can be performed by reflowing only once without using a jig, so that the following effects can be obtained.

(1) リフロー条件が安定し厚膜部分の接合におい
て高い信頼性が得られる。(1) Reflow conditions are stable and high reliability can be achieved when bonding thick film parts.

(2) 治具を使用しない為、量産に適する。(2) Suitable for mass production as no jigs are used.

(3) 多数個採りの基板、端子にすることが可能と
なり工数削減が計れる。(3) It is possible to make boards and terminals with multiple pieces, reducing man-hours.

(4) 位置決め性が良好で、リフロー時の位置ズレ
がなく、品質の安定したものができる。(4) Good positioning performance, no positional deviation during reflow, and products with stable quality can be produced.

[Brief explanation of drawings]

第１図は本発明製造方法の一実施例を示す混成
IC搭載保安器の平面図、第２図は同じくその正
面図、第３図は従来の製造方法を示す混成IC搭
載保安器の平面図、第４図、第５図はそれぞれそ
の正面図である。２……バリスタ、３……溶断抵抗器、４……避
雷器、１１……アルミナ基板、１１−１……ダミ
ーのあるアルミナ基板、１２……端子、１２−１
……ダミーの端子、１２−１……ダミーの端子、
ａ……穴、ｂ……ダボ、ｃ，ｄ……切込み。 FIG. 1 shows a hybrid structure showing an embodiment of the manufacturing method of the present invention.
FIG. 2 is a plan view of the IC-equipped protector; FIG. 3 is a plan view of a hybrid IC-equipped protector showing the conventional manufacturing method; FIGS. 4 and 5 are front views thereof. . 2... Varistor, 3... Fusing resistor, 4... Lightning arrester, 11... Alumina board, 11-1... Alumina board with dummy, 12... Terminal, 12-1
...Dummy terminal, 12-1...Dummy terminal,
a...hole, b...dowel, c, d...notch.

Claims

[Claims] 1. A method for manufacturing a hybrid IC-mounted protector, which is manufactured by mounting electronic components on a board main body and soldering a plurality of terminals protruding from the side of the board main body using a reflow machine. In this step, a dummy part extending longer than the length of the terminal is formed in advance on the same plane continuously on the side of the board main body, and a notch part provided at the boundary between the dummy part and the board main body and the extension end are formed in advance. a board body provided with a dummy part having a positioning hole provided near the part; and a plurality of dummy terminals provided in advance with a dummy part having a notch part in the protruding end part of the terminal and extending in the longitudinal direction of the terminal. and a terminal provided with a dummy terminal having a positioning dowel that engages with a positioning hole of the board main body on an extension part having a dummy terminal connected thereto, and a dummy terminal is provided on the board main body provided with the dummy part. The terminals are mounted by engaging with the positioning holes and dowels, then placed on a reflow machine to make solder connections, then cleaned, and then the notches between the dummy parts of the board body and the dummy parts of the terminals are connected. A method for manufacturing a hybrid IC mounted safety device, characterized in that the dummy portion and the dummy terminal are manufactured by cutting out the dummy portion from the notch with the terminal.