JPH0416497Y2 - - Google Patents
Info
- Publication number
- JPH0416497Y2 JPH0416497Y2 JP18112584U JP18112584U JPH0416497Y2 JP H0416497 Y2 JPH0416497 Y2 JP H0416497Y2 JP 18112584 U JP18112584 U JP 18112584U JP 18112584 U JP18112584 U JP 18112584U JP H0416497 Y2 JPH0416497 Y2 JP H0416497Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- lead
- cap
- leads
- package body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 claims description 25
- 238000002844 melting Methods 0.000 claims description 22
- 125000006850 spacer group Chemical group 0.000 claims 1
- 230000008018 melting Effects 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 238000007789 sealing Methods 0.000 description 9
- 239000013078 crystal Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18112584U JPH0416497Y2 (uk) | 1984-11-28 | 1984-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18112584U JPH0416497Y2 (uk) | 1984-11-28 | 1984-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6196553U JPS6196553U (uk) | 1986-06-21 |
| JPH0416497Y2 true JPH0416497Y2 (uk) | 1992-04-14 |
Family
ID=30738680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18112584U Expired JPH0416497Y2 (uk) | 1984-11-28 | 1984-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416497Y2 (uk) |
-
1984
- 1984-11-28 JP JP18112584U patent/JPH0416497Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6196553U (uk) | 1986-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0516730Y2 (uk) | ||
| JPH0416497Y2 (uk) | ||
| JPH0349398Y2 (uk) | ||
| JPH036028Y2 (uk) | ||
| JPH0249727Y2 (uk) | ||
| JPH0217482Y2 (uk) | ||
| JPH039334Y2 (uk) | ||
| JPH0217484Y2 (uk) | ||
| JPH0445291Y2 (uk) | ||
| JPS61168247A (ja) | セラミツクパツケ−ジ | |
| JPH0142354Y2 (uk) | ||
| JPH0249726Y2 (uk) | ||
| JP2818506B2 (ja) | 電子部品収納用パッケージの製造方法 | |
| JPS5892241A (ja) | 半導体装置用容器 | |
| JPS61108159A (ja) | フラツトパツケ−ジ | |
| JP2870501B2 (ja) | 半導体装置 | |
| JPS6155945A (ja) | フラツトパツケ−ジのキヤツプシ−ル方法 | |
| JPS623984B2 (uk) | ||
| JP2005116797A (ja) | 電子部品用パッケージ及びこのパッケージを用いた圧電振動デバイス | |
| JP2759300B2 (ja) | ガラス封止型半導体素子収納用パッケージ | |
| JPH06132766A (ja) | 圧電発振子 | |
| JPS634350B2 (uk) | ||
| JP3556111B2 (ja) | 電子部品用パツケージ、それを用いた電子部品組立構体および電子部品組立構体の製造方法 | |
| JPS61129915A (ja) | 水晶振動子の製造方法 | |
| JP2004319831A (ja) | 電子部品用パッケージおよびこれを用いた電子部品装置 |