JPH04164511A - Steel wire coated with plating - Google Patents
Steel wire coated with platingInfo
- Publication number
- JPH04164511A JPH04164511A JP29012290A JP29012290A JPH04164511A JP H04164511 A JPH04164511 A JP H04164511A JP 29012290 A JP29012290 A JP 29012290A JP 29012290 A JP29012290 A JP 29012290A JP H04164511 A JPH04164511 A JP H04164511A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- steel wire
- wire
- copper
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 45
- 238000007747 plating Methods 0.000 title claims abstract description 45
- 239000010959 steel Substances 0.000 title claims abstract description 45
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 239000004332 silver Substances 0.000 claims abstract description 5
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000011135 tin Substances 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 3
- 239000000956 alloy Substances 0.000 claims abstract description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 229910000851 Alloy steel Inorganic materials 0.000 claims 1
- 229910000975 Carbon steel Inorganic materials 0.000 claims 1
- 239000010962 carbon steel Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 5
- 238000009713 electroplating Methods 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- SMNDYUVBFMFKNZ-UHFFFAOYSA-N 2-furoic acid Chemical compound OC(=O)C1=CC=CO1 SMNDYUVBFMFKNZ-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- RYGMFSIKBFXOCR-AHCXROLUSA-N copper-60 Chemical compound [60Cu] RYGMFSIKBFXOCR-AHCXROLUSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- YAFKGUAJYKXPDI-UHFFFAOYSA-J lead tetrafluoride Chemical compound F[Pb](F)(F)F YAFKGUAJYKXPDI-UHFFFAOYSA-J 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Wire Processing (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、メッキ被覆鋼線に係り、特にワイヤーソー用
のワイヤーとして使用されるメッキ被覆鋼線の改善に関
する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a plated coated steel wire, and particularly relates to an improvement of a plated coated steel wire used as a wire for a wire saw.
［従来の技術］
近年、新素材の開発が進み、これら新素材の切断、微細
加工用に銅などの比較的軟かい材料で被覆した鋼線がワ
イヤーソー用のワイヤー材として使用されるようになっ
た。このワイヤー材に関しては、例えば特開昭５２−１
４８７３号公報などに記載されている。第２図は、鋼線
（例えばピアノ線）に銅メッキを施したものの切断面で
ある。銅被覆鋼線は、最初は太めの鋼線に銅メッキを施
し、これを引伸ばして製造することもできる。[Conventional technology] In recent years, the development of new materials has progressed, and steel wire coated with relatively soft materials such as copper has come to be used as wire material for wire saws for cutting and fine processing of these new materials. became. Regarding this wire material, for example, JP-A-52-1
It is described in Publication No. 4873, etc. FIG. 2 is a cross section of a copper-plated steel wire (for example, piano wire). Copper-coated steel wire can also be manufactured by first applying copper plating to a thick steel wire and then stretching it.
この際、メッキ用の金属としては、軟かくて延展性があ
り、耐食性がすぐれ、電気伝導度、熱伝導度のよう銅、
銀、錫、インジウム等が用いられている。At this time, the metal for plating is copper, which is soft and ductile, has excellent corrosion resistance, and has good electrical conductivity and thermal conductivity.
Silver, tin, indium, etc. are used.
［発明が解決しようとする課題］
第２図の銅被覆鋼線の断面図かられかるように、鋼線に
、直接鋼メッキを施した場合には、銅下地と銅メッキの
境界線は、円滑ではなく、ぎざぎざの凹凸状態となる。[Problems to be Solved by the Invention] As can be seen from the cross-sectional view of the copper-coated steel wire in Figure 2, when the steel wire is directly plated with steel, the boundary line between the copper base and the copper plating is It will not be smooth, but will be jagged and uneven.
ワイヤーソー作業用にこの銅被覆鋼線を使用すると、被
切断物への押圧力が大きいために、表面の銅メッキ層は
剥離し易いのみならず、切り桟幅が過大となる傾向があ
る（これをチッピングという）。When this copper-coated steel wire is used for wire saw work, the copper plating layer on the surface not only tends to peel off easily, but also the width of the cut piece tends to be excessive due to the large pressing force against the object to be cut. This is called chipping).
被切断物が高研な物になると、さらに高精度の切断、す
なわちチッピングを小さくすることが要求される。When the object to be cut becomes highly polished, it is required to cut with even higher precision, that is, to reduce chipping.
ちなみに、ワイヤーソーのワイヤーが鋼線の場合はチッ
ピングは１０μｍ以上であるが、第２図のように、銅被
覆鋼線では、５〜１０μｍに減少させることができる。Incidentally, if the wire of the wire saw is a steel wire, the chipping is 10 μm or more, but as shown in FIG. 2, if the wire is a copper-coated steel wire, the chipping can be reduced to 5 to 10 μm.
本発明では、・チッピングをさらに大幅に減少させよう
とするものである。The present invention aims to further significantly reduce chipping.
本発明の目的は、前記従来技術の欠点を改善するために
、ワイヤーソーによる切断の精度を大幅に向上できるよ
うなメッキ被覆鋼線を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a plated coated steel wire that can significantly improve cutting accuracy with a wire saw in order to improve the drawbacks of the prior art.
［課題を解決するための手段］
上記課題を解決するための本発明に係るメッキ被覆鋼線
の構成は、鋼線の表面に、金属メッキ被覆を施してなる
メッキ被覆鋼線において、前記鋼線上にあらかじめニッ
ケルでストライクメッキを施した後、この表面に金属メ
ッキ被覆を行なうようにしたことである。[Means for Solving the Problems] In order to solve the above problems, the structure of the plated coated steel wire according to the present invention is such that the plated coated steel wire is formed by applying a metal plating coating to the surface of the steel wire. After strike plating with nickel is applied to the surface, a metal plating coating is applied to the surface.
［作用］
本発明のねらいは、ワイヤーソー用のワイヤーによる切
断後のチッピングの大きさをできるだけ減少させるため
に、鋼線表面上に、まずニッケルでストライクメッキ（
Ｓｔｒｉｋｅ Ｐｌａｔｉｎｇ）を施し、その表面に、
銅、銀、錫、インジウムまたはそれらの合金メッキ被覆
を施すことである。[Function] The aim of the present invention is to first apply nickel strike plating (
Strike Plating) is applied to the surface,
Coating with copper, silver, tin, indium, or an alloy thereof.
（注）ストライクメッキは、電気メッキを行なう際に、
最初に形成されるきわめて薄い皮膜（０゜５〜１．０μ
ｍ程度）のことである。(Note) In strike plating, when performing electroplating,
An extremely thin film (0°5~1.0μ) is formed first.
m).
ストライクメッキを施すことにより、下地鋼線とニッケ
ルメッキ層との境界層は平坦に、円滑になり、中間層と
して、鋼から生じる異物等の影響を緩和して、次の銅メ
ッキ工程を容易にし、メッキ層の電着性をよくし、品質
の向上に有効に作用する。By applying strike plating, the boundary layer between the base steel wire and the nickel plating layer becomes flat and smooth, and as an intermediate layer, it alleviates the influence of foreign substances generated from the steel and facilitates the next copper plating process. , improves the electrodepositivity of the plating layer and effectively works to improve the quality.
本発明における一例として、ピアノ線上にニッケルスト
ライク後に銅メッキする工程を説明する。As an example of the present invention, a process of plating copper on piano wire after nickel strike will be described.
まず、ピアノ線は、脱脂、酸洗い、水洗後に、ニッケル
ストライクメッキを行なう。メッキ条件は、ストライク
液の組成は、硫酸ニッケル１００ｇ／ｌ、塩酸１０Ｅｒ
／Ｉ！、液温８０℃、電流密度５Ａ／ｄａ２である。つ
ぎに水洗し、銅メッキを行なう。銅メッキ条件は、銅メ
ッキ液の組成は、硫酸銅２２０ｇ／ｉ、硫酸６０ｇ／に
！、液温２５℃、電流密度５Ａ／ｄ■２である。（メッ
キ液に、光沢剤、界面活性剤等を添加してもよい。）最
後に水洗し、乾燥して、銅メッキ被覆鋼線を得ることが
できる。First, the piano wire is degreased, pickled, washed with water, and then nickel strike plated. The plating conditions are as follows: The composition of the strike liquid is 100g/l of nickel sulfate and 10Er of hydrochloric acid.
/I! , the liquid temperature was 80°C, and the current density was 5A/da2. Next, it is washed with water and copper plated. The copper plating conditions are as follows: The composition of the copper plating solution is 220 g/i of copper sulfate and 60 g/i of sulfuric acid! , the liquid temperature was 25° C., and the current density was 5 A/d2. (A brightening agent, a surfactant, etc. may be added to the plating solution.) Finally, by washing with water and drying, a copper-plated coated steel wire can be obtained.
なお、最外層をなすメッキ層は、銅、銀、錫、はんだの
ように比較的軟かい物質の方がワイヤーソー用ワイヤー
としては良好である。Note that a relatively soft material such as copper, silver, tin, or solder for the outermost plating layer is better for use as a wire for a wire saw.
［実施例］ 以下本発明の詳細な説明する。[Example] The present invention will be explained in detail below.
本発明の第１実施例について説明する。A first embodiment of the present invention will be described.
メッキ被覆鋼線の工程にしたがって記載する。It is described according to the process of plated coated steel wire.
脱脂液としてｌｏｇ／Ｉ！ ＮａＯＨ，酸洗い液とし
て２０ｇ／、ｉの硫酸を用いて、直径０，１９１のピア
ノ線の下地処理を行なった。つぎに、ニッケルストライ
ク処理は、硫酸ニッケル８０ｇ／ｌ、塩酸１０ ｇ／ｌ
の液中に上記ピアノ線を渡し、電流密度５Ａ／ｄＩ２、
液温６０℃で行なった。水洗後の銅メッキ処理は、硫酸
銅２００ｇ／ｆ、硫酸５０ ｇ／Ｉ！液中で、電流密度
６Ａ／ｄａ”、液温３０℃とし、光沢剤を少量添加した
。さらに、水洗処理後、２５０℃の乾燥炉中で乾燥して
銅被覆ピアノ線が得られた。log/I as a degreasing liquid! A piano wire having a diameter of 0.191 cm was prepared using NaOH and 20 g/i of sulfuric acid as a pickling solution. Next, nickel strike treatment was performed using 80 g/l of nickel sulfate and 10 g/l of hydrochloric acid.
The piano wire was passed through a liquid with a current density of 5A/dI2,
The test was carried out at a liquid temperature of 60°C. Copper plating treatment after washing with water is copper sulfate 200g/f and sulfuric acid 50g/I! In the liquid, the current density was set to 6 A/da'' and the liquid temperature was set to 30°C, and a small amount of brightener was added.Furthermore, after washing with water, the wire was dried in a drying oven at 250°C to obtain a copper-coated piano wire.
第１図は、銅被覆ピアノ線の断面図である。第１図にお
いて、ｌはピアノ鋼線、２はニッケルストライク層、３
は銅メッキ層である。FIG. 1 is a cross-sectional view of a copper-coated piano wire. In Fig. 1, 1 is a piano steel wire, 2 is a nickel strike layer, and 3 is a piano steel wire.
is a copper plating layer.
この時、ニッケルストライク層の厚さは０．５μｍ５銅
メッキ層の厚さは６μｍであり、観察の結果、境界層は
滑らかであり、突起や欠陥は全くみられなかった。At this time, the thickness of the nickel strike layer was 0.5 μm, and the thickness of the copper plating layer was 6 μm. As a result of observation, the boundary layer was smooth and no protrusions or defects were observed.
この銅被覆ピアノ線を、ワイヤーソー装置にセットして
、アルミナ系の硬質素材を切断した。その結果、チッピ
ングは１〜３μｍとなり、従来のチッピング５〜１０μ
ｍに比べて大幅に減少した。This copper-coated piano wire was set in a wire saw device to cut the alumina-based hard material. As a result, the chipping is 1 to 3 μm, compared to the conventional chipping of 5 to 10 μm.
This was significantly reduced compared to m.
つぎに、本発明の第２実施例につき説明する。Next, a second embodiment of the present invention will be described.
第２実施例に係る被覆鋼線の製造工程は、第１実施例と
ほぼ同一である。ただし、メッキ工程は銅メッキではな
くはんだメッキとした。はんだメッキ液の組成は、硼弗
化錫２００ｇ／ｉ、硼弗化鉛５０ｇ／Ｉ！、硼弗化水素
（４３％）１００ｇ／ｌ、光沢剤５ｇ／ｌで、電流密度
５Ａ／ｄ−２、液温３０℃であった。The manufacturing process of the coated steel wire according to the second example is almost the same as that of the first example. However, the plating process was solder plating instead of copper plating. The composition of the solder plating solution is 200 g/I of tin borofluoride and 50 g/I of lead fluoride! , borohydrogen (43%) 100 g/l, brightener 5 g/l, current density 5 A/d-2, and liquid temperature 30°C.
この時、ニッケルストライク層の厚さは０．５μｍ、は
んだ層の厚さは８μｍであった。このはんだ被覆ピアノ
線を用いて、ワイヤーソー装置で、アルミナ系素材を切
断したところ、チッピングは、１〜２μｍとなり、第１
実施例よりもさらに低減された。はんだ層は、銅層より
もさらに軟かいことによるものと考えられる。At this time, the thickness of the nickel strike layer was 0.5 μm, and the thickness of the solder layer was 8 μm. When this solder-coated piano wire was used to cut an alumina-based material with a wire saw machine, the chipping was 1 to 2 μm, and the first
It was further reduced than in the example. This is believed to be due to the fact that the solder layer is softer than the copper layer.
以上の実施例に示すように、ワイヤーソー用のワイヤー
として、むくのピアノ線では、チッピングは、約１０μ
ｍ以上であったが、メッキ被覆鋼の場合には、約１μｍ
まで低減することができた効果はきわめて大きい。As shown in the above examples, when using bare piano wire as a wire for a wire saw, chipping is approximately 10 μm.
m or more, but in the case of plated coated steel, it is approximately 1 μm
The effect of being able to reduce this to
また、本実施例では、ピアノ線上にニッケルストライク
を行ない、その上に銅またははんだメッキを施こした場
合を記載したが、ピアノ線のほか、ステンレス鋼線また
は他の鉄合金線でもよい。Further, in this embodiment, a case has been described in which nickel strike is performed on piano wire and copper or solder plating is applied thereon, but in addition to piano wire, stainless steel wire or other iron alloy wire may be used.
鋼線の直径は、０．１９■■とは限らず、０，５龍、２
１１５龍など太径の線でもよい。The diameter of the steel wire is not necessarily 0.19■■, but also 0.5, 2
A wire with a thick diameter such as 115 Dragon may also be used.
なお、被覆工程については、あらかじめ大径の鋼線に、
ニッケルストライク−メッキ被覆を施し、その後引抜き
作業工程を経て、所期の線径まで細線化することもでき
る。In addition, regarding the coating process, the large diameter steel wire is coated in advance.
It is also possible to apply a nickel strike plating coating and then perform a drawing process to thin the wire to the desired wire diameter.
さらに、製品の品質を最適化するために、製造工程にお
けるメッキ液の組成、温度、電流密度などを適宜選択す
ることができる。Furthermore, in order to optimize the quality of the product, the composition, temperature, current density, etc. of the plating solution in the manufacturing process can be appropriately selected.
［発明の効果］
本発明のように鋼線にニッケルストライクを施こし、そ
の上にメッキ被覆を行なったワイヤーをワイヤーソー用
に使用することにより、最近開発中の新素材の切断作業
等が高精度、高能率で行なえるようになった効果は著し
い。[Effects of the Invention] By using a wire in which a steel wire is nickel struck and coated with plating as in the present invention, the cutting work of new materials that are currently being developed can be improved. The effect of being able to perform the process with high precision and efficiency is remarkable.
本発明により、微細加工が可能になったので、エレクト
ロニクス、半導体用部品の加工技術の向上が期待できる
。Since the present invention has made microfabrication possible, improvements in processing technology for electronics and semiconductor parts can be expected.
被覆鋼線の品質が安定しているので、被加工製品の品質
も安定し、高信頼が期待される。Since the quality of the coated steel wire is stable, the quality of the processed product is also stable and high reliability is expected.
また、インジウム、錫メッキ被覆鋼線では、化合物半導
体等のオプトエレクトロニクスへの応用が期待される。Furthermore, indium- and tin-plated steel wires are expected to be applied to optoelectronics such as compound semiconductors.
第１図は、本発明のメッキ被覆鋼線の切断面図、第２図
は、従来の銅被覆鋼線の切断面図である。
１：ピアノ鋼線、
２：ニッケルストライク層、
３：銅メッキ層。
第 １ （２）
１ ： し°γノ ４町腺
２ ； 二・７’７７レストライ２眉FIG. 1 is a cross-sectional view of a plated coated steel wire of the present invention, and FIG. 2 is a cross-sectional view of a conventional copper-coated steel wire. 1: Piano steel wire, 2: Nickel strike layer, 3: Copper plating layer. 1st (2) 1: shi°γノ 4-cho gland 2; 2.7'77 restrai 2 eyebrows
Claims (1)
被覆鋼線において、前記鋼線上にあらかじめニッケルで
ストライクメッキを施した後、この表面に金属メッキ被
覆を行なうことを特徴とするメッキ被覆鋼線。 ２、請求項１記載のメッキ被覆鋼線において、鋼線は、
ピアノ線、ステンレス鋼線、合金鋼線および炭素鋼線の
いずれかであり、また、メッキ被覆金属は、銅、銀、錫
およびインジウムまたはそれらの合金のいずれかである
ことを特徴とするメッキ被覆鋼線。[Claims] 1. In a plated coated steel wire in which the surface of the steel wire is coated with metal plating, the steel wire is strike-plated with nickel in advance, and then the surface is coated with metal plating. A plated coated steel wire featuring: 2. In the plated coated steel wire according to claim 1, the steel wire is
A plated coating, which is any one of piano wire, stainless steel wire, alloy steel wire, and carbon steel wire, and the plated coating metal is copper, silver, tin, indium, or an alloy thereof. steel wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29012290A JPH04164511A (en) | 1990-10-26 | 1990-10-26 | Steel wire coated with plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29012290A JPH04164511A (en) | 1990-10-26 | 1990-10-26 | Steel wire coated with plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04164511A true JPH04164511A (en) | 1992-06-10 |
Family
ID=17752089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29012290A Pending JPH04164511A (en) | 1990-10-26 | 1990-10-26 | Steel wire coated with plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04164511A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0560811U (en) * | 1992-01-31 | 1993-08-10 | 金井 宏之 | Wire for wire saw |
| JP2007175791A (en) * | 2005-12-27 | 2007-07-12 | Kurenooton Kk | Super abrasive grain grinding wheel with shaft and manufacturing method for it |
| JP2014046375A (en) * | 2012-08-29 | 2014-03-17 | Allied Material Corp | Super abrasive grain wire saw and method of manufacturing the same |
| CN116900406A (en) * | 2023-09-12 | 2023-10-20 | 江苏聚成金刚石科技股份有限公司 | Superfine diameter diamond wire saw with low breakage rate and preparation method thereof |
-
1990
- 1990-10-26 JP JP29012290A patent/JPH04164511A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0560811U (en) * | 1992-01-31 | 1993-08-10 | 金井 宏之 | Wire for wire saw |
| JP2007175791A (en) * | 2005-12-27 | 2007-07-12 | Kurenooton Kk | Super abrasive grain grinding wheel with shaft and manufacturing method for it |
| JP2014046375A (en) * | 2012-08-29 | 2014-03-17 | Allied Material Corp | Super abrasive grain wire saw and method of manufacturing the same |
| CN116900406A (en) * | 2023-09-12 | 2023-10-20 | 江苏聚成金刚石科技股份有限公司 | Superfine diameter diamond wire saw with low breakage rate and preparation method thereof |
| CN116900406B (en) * | 2023-09-12 | 2023-12-05 | 江苏聚成金刚石科技股份有限公司 | Superfine diameter diamond wire saw and preparation method thereof |
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