JPH04164243A - Gas sensor - Google Patents
Gas sensorInfo
- Publication number
- JPH04164243A JPH04164243A JP29133690A JP29133690A JPH04164243A JP H04164243 A JPH04164243 A JP H04164243A JP 29133690 A JP29133690 A JP 29133690A JP 29133690 A JP29133690 A JP 29133690A JP H04164243 A JPH04164243 A JP H04164243A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- overhang
- gas sensor
- metal
- oxide semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 20
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000012777 electrically insulating material Substances 0.000 claims abstract description 3
- 239000007789 gas Substances 0.000 claims description 73
- 238000001514 detection method Methods 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 11
- 239000001301 oxygen Substances 0.000 claims description 11
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- 239000011135 tin Substances 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract description 8
- 229910001887 tin oxide Inorganic materials 0.000 abstract description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 2
- 239000011787 zinc oxide Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 37
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 17
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 14
- 235000019441 ethanol Nutrition 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 239000012528 membrane Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は雰囲気中にガスが存在することを検知するガス
センサに関し、詳しくは、LPガスや都市ガスのガス漏
れ警報器として使用するに適したガスセンサに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a gas sensor that detects the presence of gas in an atmosphere, and more particularly to a gas sensor suitable for use as a gas leak alarm for LP gas or city gas.
ガスセンサは、その性質上様々なガス(イソブタン、プ
ロパン、エタン、メタン、エタノール、プロピレン、ト
ルエン、キシレン、メタノール、水素、−酸化炭素等)
に感度を有する。Due to their nature, gas sensors can handle various gases (isobutane, propane, ethane, methane, ethanol, propylene, toluene, xylene, methanol, hydrogen, carbon oxide, etc.)
Sensitive to.
従って、ある特定のガスを検出したい場合、他のガスに
よるノイズが大きな問題になる。例えば、家庭用のガス
センサ(ガス漏れ警報器)においては、都市ガスの場合
には、メタンガスにのみ反応することが望ましいが、ガ
ス漏れ警報器の設置場所が多くは天井に近いところに有
るため水蒸気や各種蒸気、雑ガスの影響を受けやすい。Therefore, when it is desired to detect a specific gas, noise caused by other gases becomes a big problem. For example, in the case of city gas, it is desirable for household gas sensors (gas leak alarms) to react only to methane gas, but since most gas leak alarms are installed near the ceiling, they react only to water vapor. It is easily affected by various types of steam and miscellaneous gases.
雑ガスとして家庭内で最も発生しやすいのはアルコール
であるが、一般のガスセンサはアルコールに対しても高
い感度を有する。そうしたことから、通常はガスセンサ
にガス選択性を持たせるために、フィルターを付加した
り、動作温度を変えるなどしているが、コス1〜及び確
実性において問題がある。本出願人は、それらの問題を
解決するために、金属と酸素の組成比が異なる金属酸化
物半導体膜を複数個用いる方法をすでに提案している(
特開平2−1.34551号公報)。しかし、それらは
1つの張出し部上に1つの金属酸化物半導体膜しか有し
ていないため、複数の張り出し部を必要とし、それら全
てのヒーターリードに電流を供給し、各張出し部上の金
属酸化物半導体膜を加熱する必要があるため、比較的消
費電力が大きかった。Although alcohol is the miscellaneous gas that is most likely to be generated in the home, general gas sensors have high sensitivity to alcohol as well. For this reason, in order to give gas selectivity to a gas sensor, a filter is usually added or the operating temperature is changed, but there are problems in terms of cost and reliability. In order to solve these problems, the applicant has already proposed a method of using multiple metal oxide semiconductor films with different composition ratios of metal and oxygen (
JP-A No. 2-1.34551). However, since they have only one metal oxide semiconductor film on one overhang, they require multiple overhangs, supplying current to all those heater leads, and metal oxide semiconductor film on each overhang. Since it is necessary to heat the semiconductor film, power consumption is relatively large.
〔目 的〕
本発明の目的は、従来のごときフィルターを付加したり
、動作温度を変える等の面倒な手段を採ることなく、特
定のガス漏れを検知しうるガスセンサを提供する点にあ
る。[Objective] An object of the present invention is to provide a gas sensor that can detect a specific gas leak without adding a conventional filter or taking troublesome measures such as changing the operating temperature.
本発明は、基板、その基板上に空中に張出して設けられ
た電気!縁付材料からなる張出し部、前記張出し部上に
設けた検出領域にあって互いに所定距離隔離して設けら
れた少なくとも一対の検出用リード、前記張出し部上に
あって前記検出用リードにほぼ並置して設けられた少な
くとも1個のヒーターリード、及び前記検出領域にあっ
て前記少なくとも一対の検出用リードの各々に接触して
設けられたガス感応物質層を有しており、前記ガス感応
物質層がガスと接触反応することによる抵抗値の変化を
測定してガス検出を行うガスセンサにおいて、同一の張
出し部上にガス感応物質層が複数個存在し、それらのう
ち少くとも1つは他のものと金属と酸素との組成比を異
にした金属酸化物半導体膜よりなることを特徴とするガ
ス選択性を有するガスセンサに関する。The present invention relates to a circuit board, and an electric cable provided on the board extending into the air! an overhang made of edged material; at least a pair of detection leads located in a detection area provided on the overhang and separated from each other by a predetermined distance; and located on the overhang and substantially parallel to the detection leads; and a gas sensitive material layer provided in the detection region and in contact with each of the at least one pair of detection leads, the gas sensitive material layer In a gas sensor that detects gas by measuring the change in resistance value caused by contact reaction with gas, there are multiple gas-sensitive material layers on the same overhang, and at least one of them is made of other gas-sensitive material layers. The present invention relates to a gas sensor having gas selectivity characterized by being made of metal oxide semiconductor films having different composition ratios of metal and oxygen.
ちなみに、本発明者等はガスセンサを複数のガス感応膜
で形成すると共に、それら複数のガス感応膜(金属酸化
物半導体膜)における金属と酸素との組成比を変えるこ
とにより、ガス感応に選択性がもたらされることを確か
めた。本発明はこれに基づいてなされたものである。Incidentally, the present inventors formed a gas sensor with a plurality of gas-sensitive films, and by changing the composition ratio of metal and oxygen in the plurality of gas-sensitive films (metal oxide semiconductor films), the inventors achieved selectivity in gas sensitivity. I made sure that it was delivered. The present invention has been made based on this.
以下に本発明を添付の図面に従いながら更に詳細に説明
するが、端的に云えば、本発明のガスセンサは、互いに
金属と酸素との組成比を異にした金属酸化物半導体膜を
少なくとも二つのガス感応物質層として採用し、それぞ
れのガス感応物質層によって感知されるガスを検知する
ようにしている。しかも同一の張出し部上に複数のガス
感応物質層を有する構造のため、1つの張り出し部のみ
加熱すればよく、特開平2−134551号公報の技術
に比較し、消費電力の低下が可能となった。The present invention will be explained in more detail below with reference to the accompanying drawings, but to put it simply, the gas sensor of the present invention comprises metal oxide semiconductor films having different composition ratios of metal and oxygen to at least two gases. The gases are used as sensitive material layers, and the gases sensed by the respective gas sensitive material layers are detected. Moreover, since the structure has multiple gas-sensitive material layers on the same overhang, it is only necessary to heat one overhang, which makes it possible to reduce power consumption compared to the technology disclosed in JP-A-2-134551. Ta.
第1図は本発明に係わるガスセンサのうち、架橋構造が
採用されたものの例である。ここでは、はぼ正方形の形
状をした基板1上に電気絶縁性材料から成る張出し部2
が空中に浮いた格好の架橋構造として設けられている。FIG. 1 shows an example of a gas sensor according to the present invention in which a crosslinked structure is adopted. Here, an overhanging portion 2 made of an electrically insulating material is placed on a substrate 1 having a substantially square shape.
It is set up as a bridge structure that looks like it is floating in the air.
基板1にはアンダーカットエツチングが容易で高温でも
変形しない材料、例えばSi、Al。The substrate 1 is made of a material that is easy to undercut and does not deform even at high temperatures, such as Si or Al.
Cu、Ni、Cr等が使用され、好ましくはSユ(10
0)面が用いられる。(100)面を使用する理由は、
アンダーカットエツチングする際に公知の異方性エツチ
ング液を使用できるためである。Cu, Ni, Cr, etc. are used, preferably S(10
0) plane is used. The reason for using the (100) plane is
This is because a known anisotropic etching solution can be used when performing undercut etching.
基板1の外形寸法は1〜4mm角程度で、その厚さは0
.1〜1+nm位が適当である。The external dimensions of the substrate 1 are approximately 1 to 4 mm square, and its thickness is 0.
.. Approximately 1 to 1+ nm is appropriate.
この基板1のアンダーカットエツチングにより形成され
た張出し部2上には、ヒーターリード3とガス感応物質
層である金属酸化物半導体膜4,5とその検出用リード
6.7とが形成されている。ヒーターリード3及び検出
用リード6.7の材料としてはPttAu等が好ましい
。On the overhang 2 formed by undercut etching of the substrate 1, there are formed heater leads 3, metal oxide semiconductor films 4, 5 which are gas sensitive material layers, and their detection leads 6.7. . The material of the heater lead 3 and the detection lead 6.7 is preferably PttAu or the like.
先に触れたとおり、金属酸化物半導体膜4゜5は同じ金
属酸化物であるが、その金属と機素との組成比を異にし
ている。ここでの金属としでは、スズ、亜鉛、鉄、チタ
ン、インジウム。As mentioned earlier, the metal oxide semiconductor films 4.5 are made of the same metal oxide, but have different composition ratios of metal and elements. The metals used here are tin, zinc, iron, titanium, and indium.
ニッケル、タングステン、カドミウム、バナジウム等が
挙げられ、中でもスズの使用が最も望ましい。Examples include nickel, tungsten, cadmium, vanadium, etc. Among them, it is most desirable to use tin.
第2図は張出し部2が片持ち梁構造となっていること以
外は第1図の物と同様な構成が採られている。The structure shown in FIG. 2 is similar to that shown in FIG. 1 except that the overhang 2 has a cantilever structure.
金属酸化物半導体膜4,5の成膜方法としては、スパッ
タリング法、真空蒸着法などいろいろ考えられるが、本
発明者の一人である太田が先に提案した「薄膜蒸着装置
J(特公平1−53351号)を用いて行うのが有利で
ある。そこで今、この薄膜蒸着装置を用いてガス感応膜
としての酸化スズ膜の形成方法について述べれば、次の
とおりである。Various methods can be considered for forming the metal oxide semiconductor films 4 and 5, such as sputtering and vacuum evaporation. 53351).The method for forming a tin oxide film as a gas-sensitive film using this thin film deposition apparatus will now be described as follows.
]
酸化スズ膜を形成する場合には蒸発物質としてSn、S
n○、SnO2のいずれかが蒸発物質とされる。例えば
Snを蒸発物質として選び、これを蒸発源に保持し、真
空槽内の真空度を予め10−’ P aのオーダーにし
、酸素ガスを真空槽内に導入し、その圧力を例えば0.
IPa程度に保つ。] When forming a tin oxide film, Sn and S are used as evaporation substances.
Either n○ or SnO2 is used as the evaporative substance. For example, Sn is selected as the evaporation substance, held as an evaporation source, the degree of vacuum in the vacuum chamber is set in advance to the order of 10-' Pa, oxygen gas is introduced into the vacuum chamber, and the pressure is set to, for example, 0.
Maintain around IPa.
この状態において、例えば対電極をゼロ電位にし、グリ
ッドに100vの電位を与え、フィラメントに400W
の電力を与える。希望する成膜速度に応じ、蒸発源に電
力を印加すると蒸発したSnの一部がイオン化され、酸
素と強く化合し、酸化スズ膜が基板上に形成される。In this state, for example, set the counter electrode to zero potential, apply a potential of 100 V to the grid, and apply 400 W to the filament.
Gives power. When power is applied to the evaporation source according to a desired film formation rate, a portion of the evaporated Sn is ionized and strongly combines with oxygen, forming a tin oxide film on the substrate.
この方法により形成した酸化スズ膜のメタン及びエチル
アルコールに対するガス感度と成膜速度との関係を第3
図に示す。ガス濃度は空気に対しそれぞれ3000PP
m、 11000PPであり、ガス感応膜の温度は45
0℃である。図中、Raはガス感応膜の空気中抵抗値、
Rgはガス感応膜のガス中抵抗値である。The relationship between the gas sensitivity of the tin oxide film formed by this method to methane and ethyl alcohol and the film formation rate was investigated in the third section.
As shown in the figure. Gas concentration is 3000PP each compared to air
m, 11000PP, and the temperature of the gas sensitive membrane is 45
It is 0°C. In the figure, Ra is the air resistance value of the gas-sensitive membrane;
Rg is the resistance value of the gas sensitive membrane in gas.
次にメタンとエチルアルコールに対し選択性を持たせる
方法について述べる。第1図及び第2図において、ガス
感応膜4の成膜速度を10A/seeで、ガス感応膜5
の成膜速度を20A/5ee=7−
で形成する。10A/seeで形成したガス感応膜4は
メタンとエチルアルコールの両方に感度を有するが、2
0A/seeで形成したガス感応膜5はエチルアルコー
ルにしか感度を有しない。つまり、ガス感応膜4,5が
共に抵抗値変化を生じた場合にはエチルアルコールが存
在し、ガス感応膜4のみ抵抗値変化を生じた場合にはメ
タンのみが存在していることになる。Next, we will discuss how to make it selective to methane and ethyl alcohol. In FIGS. 1 and 2, the gas-sensitive film 4 is formed at a deposition rate of 10 A/see.
The film formation rate is 20A/5ee=7-. The gas sensitive film 4 formed at 10 A/see is sensitive to both methane and ethyl alcohol, but 2
The gas sensitive film 5 formed at 0 A/see is sensitive only to ethyl alcohol. That is, if both the gas sensitive membranes 4 and 5 change in resistance value, ethyl alcohol is present, and if only the gas sensitive membrane 4 causes a change in resistance value, only methane exists.
上記の例では、金属酸化物半導体膜4,5である酸化ス
ズ膜は互いにその成膜速度を異にしていることから、ス
ズと酸素との組成比は異なったものとなっている(成膜
速度の大きい方が相対的にスズの割合が多い)。金属酸
化物半導体膜4,5の成膜条件は、成膜速度の違いに限
らず、例えば金属酸化物半導体膜4の蒸発材料としてS
nO2を用い、金属酸化物半導体膜5の蒸発材料として
Snを用いるなどして、金属酸化物半導体膜4,5のそ
れぞれのスズと酸素との組成比を変えるように工夫がと
られても構わない。In the above example, the tin oxide films that are the metal oxide semiconductor films 4 and 5 have different deposition rates, so the composition ratios of tin and oxygen are different (film formation The higher the speed, the higher the proportion of tin). The conditions for forming the metal oxide semiconductor films 4 and 5 are not limited to the difference in film formation speed; for example, S as the evaporation material for the metal oxide semiconductor film 4
The composition ratio of tin to oxygen in each of the metal oxide semiconductor films 4 and 5 may be changed by using nO2 and using Sn as the evaporation material for the metal oxide semiconductor film 5. do not have.
また、第1図及び第2図では金属と酸素との組成比が異
なったガス感応膜(但し、ここで用いられる金属は、そ
の金属と酸素との組成比が異なっていて同種の金属であ
る)は二つであるが、三つ以上あっても構わないことは
いうまでもない。In addition, in Figures 1 and 2, gas-sensitive films with different composition ratios of metal and oxygen (however, the metals used here have different composition ratios of metal and oxygen and are of the same type). ) are two, but it goes without saying that there may be three or more.
なお、張出し部の数は1個でも複数でもかまわない。Note that the number of overhangs may be one or more.
本発明によれば、複数個のガス感応膜のうち少なくとも
1つの他の金属と酸素との組成比を変えるだけで簡単に
ガス選択性を有するガスセンサが得られ、しかもそれら
を同一の張り出し部上に形成することにより、消費電力
を低下することができる。According to the present invention, a gas sensor having gas selectivity can be easily obtained by simply changing the composition ratio of at least one other metal to oxygen among a plurality of gas-sensitive films, and moreover, they can be mounted on the same overhang. By forming it, power consumption can be reduced.
第1図は本発明に係わるガスセンサの一例で、(a)は
その平面図、(b)は第1図(a)のx−x’線端面図
である。
第2図は本発明に係わるガスセンサの他の−例で、(a
)はその平面図、(b)は第2図(a)のX−x’線端
面図である。
第3図はガス感応膜のメタン及びエチルアルコールに対
するガス感度と成膜速度との関係を表したグラフである
。
■・・・基板 2・・・張出し部3・・・ヒ
ーターリード
6.7・・・検出リード 8・・・絶縁膜0・空洞
特許出願人 株式会社 リ コ 一
第1図(C1)
第1図(b)
X′
第2図(b)
成膜速度(A/sec)FIG. 1 shows an example of a gas sensor according to the present invention, in which (a) is a plan view thereof, and (b) is an end view taken along line xx' in FIG. 1 (a). FIG. 2 shows another example of the gas sensor according to the present invention, (a
) is a plan view thereof, and (b) is an end view taken along line X-x' in FIG. 2(a). FIG. 3 is a graph showing the relationship between the gas sensitivity of the gas-sensitive film to methane and ethyl alcohol and the film formation rate. ■... Substrate 2... Overhang 3... Heater lead 6.7... Detection lead 8... Insulating film 0/Cavity Patent applicant Rico Co., Ltd. Figure 1 (C1) 1 Figure (b) X' Figure 2 (b) Film formation rate (A/sec)
Claims (1)
絶縁性材料からなる張出し部、前記張出し部上に設けた
検出領域にあって互いに所定距離隔離して設けられた少
なくとも一対の検出用リード、前記張出し部上にあって
前記検出用リードにほぼ並置して設けられた少なくとも
1個のヒーターリード、及び前記検出領域にあって前記
少なくとも一対の検出用リードの各々に接触して設けら
れたガス感応物質層を有しており、前記ガス感応物質層
がガスと接触反応することによる抵抗値の変化を測定し
てガス検出を行うガスセンサにおいて、同一の張出し部
上にガス感応物質層が複数個存在し、それらのうち少く
とも1つは他のものと金属と酸素との組成比を異にした
金属酸化物半導体膜よりなることを特徴とするガス選択
性を有するガスセンサ。 2、前記金属酸化物半導体がスズ、亜鉛、鉄、チタン、
インジウム、ニッケル、タングステン、カドミウムおよ
びバナジウムよりなる群から選らばれた金属の酸化物で
あることを特徴とする請求項1記載のガスセンサ。[Scope of Claims] 1. A substrate, an overhang made of an electrically insulating material provided on the substrate to overhang in the air, and a detection area provided on the overhang, separated from each other by a predetermined distance. at least one pair of detection leads, at least one heater lead provided on the overhang and substantially parallel to the detection leads, and each of the at least one pair of detection leads located in the detection area. In a gas sensor that has a gas-sensitive material layer provided in contact with the gas, and detects gas by measuring a change in resistance value caused by the contact reaction of the gas-sensitive material layer with the gas, gas-selectivity characterized in that there are a plurality of gas-sensitive material layers, at least one of which is made of a metal oxide semiconductor film having a different composition ratio of metal and oxygen from the other layers. Gas sensor with. 2. The metal oxide semiconductor is tin, zinc, iron, titanium,
The gas sensor according to claim 1, wherein the gas sensor is an oxide of a metal selected from the group consisting of indium, nickel, tungsten, cadmium, and vanadium.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29133690A JPH04164243A (en) | 1990-10-29 | 1990-10-29 | Gas sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29133690A JPH04164243A (en) | 1990-10-29 | 1990-10-29 | Gas sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04164243A true JPH04164243A (en) | 1992-06-09 |
Family
ID=17767602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29133690A Pending JPH04164243A (en) | 1990-10-29 | 1990-10-29 | Gas sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04164243A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007017217A (en) * | 2005-07-06 | 2007-01-25 | Fuji Electric Fa Components & Systems Co Ltd | Thin film gas sensor |
-
1990
- 1990-10-29 JP JP29133690A patent/JPH04164243A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007017217A (en) * | 2005-07-06 | 2007-01-25 | Fuji Electric Fa Components & Systems Co Ltd | Thin film gas sensor |
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