JPH0416419B2 - - Google Patents

Info

Publication number
JPH0416419B2
JPH0416419B2 JP19913384A JP19913384A JPH0416419B2 JP H0416419 B2 JPH0416419 B2 JP H0416419B2 JP 19913384 A JP19913384 A JP 19913384A JP 19913384 A JP19913384 A JP 19913384A JP H0416419 B2 JPH0416419 B2 JP H0416419B2
Authority
JP
Japan
Prior art keywords
glaze layer
glaze
ceramic substrate
present
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19913384A
Other languages
Japanese (ja)
Other versions
JPS6177637A (en
Inventor
Juji Fujinaka
Masami Terasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP19913384A priority Critical patent/JPS6177637A/en
Priority to US06/775,859 priority patent/US4632846A/en
Publication of JPS6177637A publication Critical patent/JPS6177637A/en
Priority to US06/926,854 priority patent/US4767672A/en
Priority to US07/114,227 priority patent/US4806334A/en
Publication of JPH0416419B2 publication Critical patent/JPH0416419B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C03C3/087Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

(産業上の利用分野) 本発明はセラミツク基板のグレーズに適したガ
ラス組成物に関し、より詳細にはメタライズ金属
部を有するセラミツク基板のグレーズに適したガ
ラス組成物に関する。 (従来の技術) セラミツク基板の表面にガラスから成るグレー
ズ層を熔着させたグレーズドセラミツク基板は基
板表面の平滑性が優れていることから薄膜電気配
線を形成する基板として多用されている。 この従来のグレーズドセラミツク基板は通常、
アルミナ、ベリリア等から成るセラミツク基板の
表面に、例えばSiO240wt%、Al2O38wt%、
CaO8wt%、B2O36wt%、PbO25wt%、BaO8wt
%、Bi2O35wt%から成るガラス粉末に適当な粘
結剤及び溶剤を添加してペースト状となしたもの
をスクリーン印刷法により塗布するとともに大気
中、約1200℃の温度で焼成し、ガラス粉末を熔融
させ、セラミツク基板表面に熔着させることによ
つて作製されている。 (発明が解決しようとする問題点) しかし乍ら、この従来のグレーズドセラミツク
基板は、セラミツク基板がタングステン(W)、
モリブテン(MO)等から成るメタライズ金属部
を有している場合、セラミツク基板表面にグレー
ズ層を熔着させる際、セラミツク基板を大気中で
焼成するとセラミツク基板のメタライズ金属部が
酸化されて完全に消滅してしまうという欠点を有
していた。 またメタライズ金属部の酸化消滅を防止するた
めにグレーズ用ペーストが塗布されたセラミツク
基板を還元雰囲気中で焼成するとガラス粉末中の
主にPbOが還元されて熔着されるグレーズ層を黒
色化させたり、導電性となしてしまい、その結
果、グレーズ層上に形成される微細電気配線の各
配線間が短絡し、微細電気配線基板としての機能
に支障を来たすという重大な欠点を誘発する。 (発明の目的) 本発明の上記欠点に鑑み案出されたもので、そ
の目的はメタライズ金属部を有するセラミツク基
板表面にグレーズ層を熔着させる際、還元雰囲気
中で焼成したとしてもグレーズ層が黒色化した
り、微細電気配線基板としての機能に支障を来た
すような電気絶縁性の劣化が皆無であるグレーズ
用ガラス組成物を提供することにある。 (問題点を解決するための手段) 本発明のグレーズ用ガラス組成物は重量百分率
でSiO255〜75%、BaO6〜20%、Al2O36〜12%、
CaO8〜20%およびMgO、SrOの少なくとも一種
0.05〜3%から成ることを特徴とするものであ
る。 本発明のグレーズ用ガラス組成物において使用
されるSiO2はグレーズ層を構成するガラスの主
成分であり、その添加量が55wt%未満であれば、
グレーズ層の耐薬品性が劣化し、薄膜電気配線を
形成する際等において薬品が付着すると侵蝕を受
け良好な電気配線の形成ができなくなる。また
75wt%以上であればグレーズ層の熱膨張係数が
セラミツク基板のものよりも小となつてグレーズ
層にクラツクや剥離を発生してしまう。よつて
SiO2はその添加量が55〜75wt%の範囲に特定さ
れる。 またBaOはグレーズ層の結晶化を抑制すると
ともに熱膨張係数を制御する成分であり、その添
加量が6wt%未満であれば前記性質は付与され
ず、また20wt%以上であればグレーズ層の熱膨
張係数がセラミツク基板のものよりも大となつて
グレーズ層にクラツクや剥離を発生してしまうこ
とから6〜20wt%の範囲に特定される。 またAl2O3はグレーズ層の結晶化を抑制すると
ともに耐薬品性を改善する成分であり、その添加
量が6wt%未満であれば前記性質は付与されず、
また12wt%以上であればグレーズ層表面の表面
粗さが大となつて良好な電気配線ができなくなる
ことから6〜12wt%の範囲に特定される。 またCaOはグレーズ層の電気特性を安定化させ
る成分であり、その添加量が8wt%未満であれば
前記性質は付与されず、また20wt%以上であれ
ばグレーズ層の軟化点が大きく低下するため8〜
20wt%の範囲に特定される。またMgO、SrOは
グレーズ層の熱膨張係数を制御する成分であり、
その添加量が0.05wt%未満であれば前記性質は付
与されず、また3wt%以上であればグレーズ層の
熱膨張係数がセラミツク基板のものよりも大とな
つてグレーズ層にクラツクや剥離を発生してしま
うことから0.05〜3wt%の範囲に特定される。 (実施例) 次に本発明を実施例に基づいて説明する。 出発原料としてSiO2、BaO、Al2O3、CaO、
MgOおよびSrOを下表に示した化学組成になる
ように秤量し、これを空気中、約1400℃の温度で
加熱溶融し、ガラスを作成する。 次に、前記ガラスにメタノールを加えてボール
ミルにより湿式粉砕し、乾燥して後、200メツシ
ユパスさせ整粒する。 最後に、前記ガラス粉末にイソブチルメタクリ
レート及びα−テルピネオールを添加するととも
に擂潰機で1時間混練し、これによつてグレーズ
用ペースト試料を得た。 尚、試料番号25は本発明品と比較するための比
較試料であり、SiO240wt%、Al2O38wt%、
CaO8wt%、B2O36wt%、PbO25wt%、BaO8wt
%、Bi2O35wt%から成る従来一般に使用されて
いるグレーズ用ペーストである。 かくして得られたグレーズ用ペーストを使用し
てアルミナから成る100mm角の基板上に長さ5mm、
幅5mm、厚み100μmのパターン100個を印刷し、
次にこれを還元雰囲気(窒素−水素雰囲気)中、
約1200℃の温度で焼成し、セラミツク基板表面に
グレーズ層を熔着させた。 そして次に前記グレーズ層を熔着させたセラミ
ツク基板をアルカリ液中に浸漬し、しかる后、グ
レーズ層表面を顕微鏡により観察し、グレーズ層
の表面状態を調べるとともに黒色化しているもの
の数を調べ、その変色率を算出した。また同時に
表面粗さ計でグレーズ層表面の表面粗さを測定
し、その平均値を算出した。 その結果を表−に示す。
(Industrial Application Field) The present invention relates to a glass composition suitable for glazing ceramic substrates, and more particularly to a glass composition suitable for glazing ceramic substrates having metallized metal parts. (Prior Art) Glazed ceramic substrates, in which a glaze layer made of glass is welded to the surface of a ceramic substrate, are often used as substrates for forming thin film electrical wiring because of their excellent surface smoothness. This traditional glazed ceramic substrate is typically
For example, SiO 2 40wt%, Al 2 O 3 8wt%,
CaO8wt%, B2O3 6wt %, PbO25wt%, BaO8wt
%, Bi 2 O 3 5wt%, a suitable binder and solvent were added to make a paste, which was applied by screen printing and fired at a temperature of about 1200°C in the atmosphere. It is manufactured by melting glass powder and welding it to the surface of a ceramic substrate. (Problems to be Solved by the Invention) However, in this conventional glazed ceramic substrate, the ceramic substrate is made of tungsten (W),
If the ceramic substrate has a metallized metal part made of molybdenum (MO), etc., when the glaze layer is welded to the surface of the ceramic substrate, if the ceramic substrate is fired in the atmosphere, the metallized metal part of the ceramic substrate will be oxidized and completely disappear. It had the disadvantage of causing In addition, in order to prevent metallized metal parts from oxidizing and disappearing, when a ceramic substrate coated with a glaze paste is fired in a reducing atmosphere, mainly PbO in the glass powder is reduced and the glaze layer to be welded becomes black. As a result, the fine electrical wiring formed on the glaze layer becomes short-circuited, which causes a serious drawback in that the function as a fine electrical wiring board is impaired. (Object of the Invention) This invention was devised in view of the above-mentioned drawbacks of the present invention, and its purpose is to prevent the glaze layer from melting even if fired in a reducing atmosphere when a glaze layer is welded to the surface of a ceramic substrate having a metallized metal part. It is an object of the present invention to provide a glass composition for glaze that does not cause blackening or deterioration of electrical insulation properties that would impede its function as a fine electrical wiring board. (Means for Solving the Problems) The glass composition for glaze of the present invention contains SiO 2 55-75%, BaO 6-20%, Al 2 O 3 6-12%, in weight percentages.
CaO8~20% and at least one of MgO and SrO
It is characterized by consisting of 0.05 to 3%. SiO 2 used in the glass composition for glaze of the present invention is the main component of the glass constituting the glaze layer, and if the amount added is less than 55 wt%,
The chemical resistance of the glaze layer deteriorates, and if chemicals adhere to it during the formation of thin-film electrical wiring, it will be eroded, making it impossible to form good electrical wiring. Also
If it exceeds 75 wt%, the thermal expansion coefficient of the glaze layer will be smaller than that of the ceramic substrate, resulting in cracks and peeling of the glaze layer. Sideways
The amount of SiO 2 added is specified in the range of 55 to 75 wt%. In addition, BaO is a component that suppresses crystallization of the glaze layer and controls the coefficient of thermal expansion. Since the coefficient of expansion is larger than that of the ceramic substrate, causing cracks and peeling in the glaze layer, it is specified to be in the range of 6 to 20 wt%. In addition, Al 2 O 3 is a component that suppresses crystallization of the glaze layer and improves chemical resistance, and if the amount added is less than 6 wt%, the above properties will not be imparted.
Moreover, if it is 12 wt% or more, the surface roughness of the glaze layer surface becomes large and good electrical wiring cannot be formed, so the content is specified in the range of 6 to 12 wt%. In addition, CaO is a component that stabilizes the electrical properties of the glaze layer, and if the amount added is less than 8wt%, the above properties will not be imparted, and if it is more than 20wt%, the softening point of the glaze layer will be significantly lowered. 8~
Specified in the range of 20wt%. Additionally, MgO and SrO are components that control the thermal expansion coefficient of the glaze layer.
If the amount added is less than 0.05wt%, the above properties will not be imparted, and if it is more than 3wt%, the thermal expansion coefficient of the glaze layer will be larger than that of the ceramic substrate, causing cracks and peeling in the glaze layer. Therefore, it is specified in the range of 0.05 to 3wt%. (Example) Next, the present invention will be described based on an example. Starting materials include SiO 2 , BaO, Al 2 O 3 , CaO,
MgO and SrO are weighed to have the chemical composition shown in the table below, and heated and melted in air at a temperature of approximately 1400°C to create glass. Next, methanol is added to the glass, which is wet-pulverized using a ball mill, dried, and sized through 200 mesh passes. Finally, isobutyl methacrylate and α-terpineol were added to the glass powder and kneaded for 1 hour using a crusher, thereby obtaining a paste sample for glaze. Incidentally, sample number 25 is a comparative sample for comparison with the product of the present invention, and contains 40wt% SiO 2 , 8wt% Al 2 O 3 ,
CaO8wt%, B2O3 6wt %, PbO25wt%, BaO8wt
%, Bi 2 O 3 5wt%, which is a conventionally commonly used glaze paste. Using the thus obtained glaze paste, a glaze with a length of 5 mm was placed on a 100 mm square substrate made of alumina.
Print 100 patterns with a width of 5 mm and a thickness of 100 μm,
Next, in a reducing atmosphere (nitrogen-hydrogen atmosphere),
It was fired at a temperature of approximately 1200°C to weld a glaze layer to the surface of the ceramic substrate. Next, the ceramic substrate to which the glaze layer is welded is immersed in an alkaline solution, and then the surface of the glaze layer is observed under a microscope to examine the surface condition of the glaze layer and the number of blackened particles. The rate of discoloration was calculated. At the same time, the surface roughness of the glaze layer surface was measured using a surface roughness meter, and the average value was calculated. The results are shown in Table.

【表】【table】

【表】 *印を付したものは本発明の範囲外のものである。
次にグレーズ層の電気絶縁抵抗を抵抗測定機で
測定し、その平均値を算出して電気絶縁抵抗の劣
化を調べた。尚、グレーズ層の電気絶縁抵抗の劣
化はグレーズ用ペースト中のガラス粉末が有する
電気絶縁抵抗値と比較した。 上記の結果を表−に示す。
[Table] Items marked with * are outside the scope of the present invention.
Next, the electrical insulation resistance of the glaze layer was measured using a resistance measuring device, and the average value was calculated to examine the deterioration of the electrical insulation resistance. Note that the deterioration of the electrical insulation resistance of the glaze layer was compared with the electrical insulation resistance value of the glass powder in the glaze paste. The above results are shown in Table.

【表】【table】

【表】 *印を付したものは本発明の範囲外のもの
である。
(発明の効果) 上記実験結果からも判るように、従来のグレー
ズ用ガラス組成物を使用したグレーズ層は全数が
黒色化し、かつ電気絶縁抵抗も6.2×1013Ωcmから
8.4×108Ωcmと大きく劣化してしまうのに対し、
本発明のグレーズ用ガラス組成物を使用したグレ
ーズ層は黒色化することが一切なく、また電気絶
縁抵抗もほとんど劣化することがない。 したがつて、本発明のグレーズ用ガラス組成物
はメタライズ金属部を有するセラミツク基板表面
に熔着されるグレーズ層の材料として極めて有用
である。
[Table] Items marked with * are outside the scope of the present invention.
(Effect of the invention) As can be seen from the above experimental results, all of the glaze layers using the conventional glazing glass composition turned black, and the electrical insulation resistance also decreased from 6.2×10 13 Ωcm.
While it deteriorates significantly at 8.4×10 8 Ωcm,
A glaze layer using the glass composition for glaze of the present invention does not turn black at all, and its electrical insulation resistance hardly deteriorates. Therefore, the glass composition for glazing of the present invention is extremely useful as a material for a glaze layer that is welded to the surface of a ceramic substrate having a metallized metal portion.

Claims (1)

【特許請求の範囲】 1 重量百分率で SiO2 55〜75% BaO 6〜20% Al2O3 6〜12% CaO 8〜20% MgOおよびSrOの少なくとも一種 0.05〜3% から成ることを特徴とするグレーズ用ガラス組成
物。
[Claims] 1. Consisting of 55-75% of SiO 2 6-20% BaO 6-12% Al 2 O 3 6-12% CaO 8-20% 0.05-3% of at least one of MgO and SrO Glass composition for glazing.
JP19913384A 1984-09-17 1984-09-21 Glass composition for glaze Granted JPS6177637A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP19913384A JPS6177637A (en) 1984-09-21 1984-09-21 Glass composition for glaze
US06/775,859 US4632846A (en) 1984-09-17 1985-09-13 Process for preparation of glazed ceramic substrate and glazing composition used therefor
US06/926,854 US4767672A (en) 1984-09-17 1986-11-03 Process for preparation of glazed ceramic substrate and glazing composition used therefor
US07/114,227 US4806334A (en) 1984-09-17 1987-10-26 Glazed ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19913384A JPS6177637A (en) 1984-09-21 1984-09-21 Glass composition for glaze

Publications (2)

Publication Number Publication Date
JPS6177637A JPS6177637A (en) 1986-04-21
JPH0416419B2 true JPH0416419B2 (en) 1992-03-24

Family

ID=16402689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19913384A Granted JPS6177637A (en) 1984-09-17 1984-09-21 Glass composition for glaze

Country Status (1)

Country Link
JP (1) JPS6177637A (en)

Cited By (3)

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KR20140089624A (en) * 2012-12-27 2014-07-16 삼성정밀화학 주식회사 metal ink composition and fabricating method thereof
EP3001439A1 (en) 2012-07-20 2016-03-30 Asahi Kasei Kabushiki Kaisha Semiconductor film and application liquid for its fabrication
EP3046136A1 (en) 2010-12-10 2016-07-20 Teijin Limited Dispersion containing semiconductor particles

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JP5733723B2 (en) * 2011-09-27 2015-06-10 岡本硝子株式会社 Lead-free white glass ceramic substrate
JP5947758B2 (en) * 2013-07-19 2016-07-06 株式会社ノリタケカンパニーリミテド High heat resistant glass bonding material
CN110981197B (en) * 2019-12-20 2022-05-24 佛山欧神诺陶瓷有限公司 Preparation method of wet-process dry-grain polished crystal brick and polished crystal brick

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3046136A1 (en) 2010-12-10 2016-07-20 Teijin Limited Dispersion containing semiconductor particles
EP3001439A1 (en) 2012-07-20 2016-03-30 Asahi Kasei Kabushiki Kaisha Semiconductor film and application liquid for its fabrication
EP3001438A1 (en) 2012-07-20 2016-03-30 Asahi Kasei Kabushiki Kaisha Solar cell and method of its fabrication
KR20140089624A (en) * 2012-12-27 2014-07-16 삼성정밀화학 주식회사 metal ink composition and fabricating method thereof

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