JPH04163917A - Semiconductor producing equipment - Google Patents

Abstract

PURPOSE:To make it possible to replace a reaction pipe faster and safer by providing a replacing equipment for replacing by opening a heating member and separating the reaction pipe from a sealing member and also attaching a jig to the reaction pipe thereby realizing the replacement in one united body. CONSTITUTION:End portions of a reaction pipe 1 and seal adopter 2 have the sections capable of being connected each other and are bonded under a pressure through an O-ring 5. When the pipe 1 is replaced, a cylinder 6 absorbs a flange 7 at the moving side by the command from a controller, and the flange 7 is separated from the adopter 2 through a bellow 9. When the fixation between movable flange 10 and pipe 1 is released, the flange 10 is separated from the pipe 1 and then a heater 11 is opened in the longitudinal direction of the pipe 1. By doing this, the pipe 1 can be now automatically replaced by a machine through an arm 14, the inside of the pipe 1 can be kept clean, positioning accuracy can be enhanced, and the pipe 1 can be replaced quickly and safely.

Description

[Detailed Description of the Invention] [Summary] This invention relates to semiconductor manufacturing equipment, particularly semiconductor manufacturing equipment that grows a thin film on a wafer by chemical vapor deposition in a reaction tube or performs a thermal diffusion process, to quickly replace a reaction tube. In addition, for the purpose of performing the reaction safely, a reaction tube, a pair of sealing members provided at both ends of the reaction tube to seal the reaction tube, and a sealing member around the reaction tube between the pair of sealing members. In a semiconductor manufacturing apparatus comprising a heating member arranged and openable and closable along the longitudinal direction, the heating member is opened and the reaction tube and the sealing member are separated,
The structure includes an exchange device for exchanging the reaction tube. Furthermore, a jig was attached to the reaction tube so that it could be replaced as a whole.

[Industrial application field]

The present invention relates to a semiconductor manufacturing apparatus, and particularly to a semiconductor manufacturing apparatus that grows a thin film on a wafer by chemical vapor deposition in a reaction tube or performs thermal diffusion treatment.

CVD (Chemical Vapor Deposit)
tion system) and diffusion devices, the reaction tubes are replaced at cleaning intervals. Also,
In recent years, as wafers have become larger in diameter, cleaner, and more automated, equipment has become noticeably larger. Therefore,
It is necessary to improve safety, shorten repair time, and simplify incidental work.

[Conventional technology]

Conventionally, in semiconductor manufacturing equipment consisting of a reaction tube, a manifold provided at both ends of the reaction tube to seal the reaction tube, and a heater placed around the reaction tube, a heater that can be opened and closed in the longitudinal direction of the reaction tube was developed by the present applicant. Japanese Patent Publication No. 59-182294
has been disclosed. In fact, the reaction tubes are replaced at regular cleaning intervals. However, in that case, open the heater,
The work of separating the manifold from the reaction tube and replacing the reaction tube was done manually.

[Problem to be solved by the invention]

However, there is a problem in that manual processing is complicated. Furthermore, when replacing the reaction tube manually, there is a problem that the accuracy of positioning the replaced reaction tube at a predetermined position is low, so that it is necessary to repeat the positioning operation many times to prevent leakage, which takes time.

In addition, vapor phase growth tends to be performed in a multi-stage process, and if the process is performed manually, there is a problem in that dust and the like can enter the reaction tube and interfere with the subsequent process.

In addition, when separating the manifolds at both ends of the reaction tube, if the manifolds have deteriorated, it is difficult and dangerous to replace them, which poses a safety problem.

Therefore, the following means were provided for the purpose of exchanging reaction tubes quickly and safely.

[Means to solve the problem]

In view of the above-mentioned problems, the present invention includes a reaction tube, a pair of sealing members provided at both ends of the reaction tube for sealing the reaction tube, and a sealing member provided around the reaction tube between the pair of sealing members. In a semiconductor manufacturing apparatus comprising a heating member that is arranged and can be opened and closed along the longitudinal direction, the heating member is opened, the reaction tube and the sealing member are separated, and the reaction tube is replaced. The configuration includes a device. Furthermore, a jig was attached to the reaction tube so that it could be replaced as a whole.

[Effect]

The exchange device opens the heating member and separates the sealing member from the reaction tube, and the exchange device exchanges the reaction tube with a new reaction tube. Moreover, the exchange device exchanges the reaction tube and the jig together.

〔Example〕

An embodiment of a semiconductor manufacturing apparatus according to the present invention will be described with reference to FIGS. 1 to 3. In this example, the present invention is
Applies to D device.

FIG. 1 shows a reaction tube used in the present invention. The reaction tube 1 has seal adapters 2 at both ends thereof. Seal adapter 2
is a metal jig that protects the reaction tube 1 and is disposed at a joint between the reaction tube 1 and a movable flange 10, which will be described later, and is made of stainless steel, for example. The reaction tube 1 is repeatedly brought into contact with and separated from the movable flange 10, as will be described later. Therefore, the reaction tube 1 is directly connected to the movable flange l using a jig.
This prevents the reaction tube 1 from being damaged.

The seal adapter 2 consists of a clamp 2a and a ring 2b, as shown in FIG. 4(A). Ring 2b is sealing surface 3
It has a cross section concentric with the reaction tube 1 and is cut with a predetermined width,
It has an opening 4 with a concentric cross section of a predetermined radius. A reaction gas for CVD is introduced into the reaction tube 1 through the opening 4. The ring 2b is fixed to the reaction tube 1 by four clamps 2a arranged approximately symmetrically on the circumference of the ring 2b.

However, the number of clamps 2a is not limited to four. Also,
The seal adapter 2 has a notch not shown in the figure, and engages with the holding part 12 to attach the replaced reaction tube 1 as described below.
It also plays the role of positioning the device to a predetermined position. This is because the reaction tube 1 is used under vacuum and must be properly positioned on the movable flange 10.

In the present invention, exchange of the reaction tube 1 is controlled by a control device (not shown). The reaction tube l has a movable flange IO spaced apart,
The heater 11 is opened and replaced by the arm 14.

It is positioned in place by the reverse order. Below, the 6th
The exchange mechanism of the reaction tube 1 by the control device will be explained with reference to the drawings and FIG. 7.

FIG. 6 is a flowchart showing the operation sequence of the control device when taking out the reaction tube 1.

When the reaction tube 1 is ordered to be taken out, a curtain (not shown) is opened in step 601. Here, the curtain refers to the curtain in which the reaction tube 1 is housed in semiconductor manufacturing equipment.
A member that isolates the VD equipment from other reaction equipment in terms of temperature and other factors.

When the curtain is opened in step 601, step 602
At this point, the rigidity between the clamp 2a and the movable flange IO is released. Specifically, the seal adapter 2 is attached to the movable side flange 7 of the movable flange lO as part of the seal part detachment mechanism.
more spaced apart. The seal portion attachment/detachment mechanism will be described below with reference to FIGS. 2(A) and 2(B).

As shown in FIG. 2(A) and FIG. 2(B), the reaction tube l
and the ends of the seal adapter 2 each have a cross-section as shown for engagement. However, as long as the two are engaged, their shapes are not limited; for example, each cross section may be formed in a concave and convex shape that engage with each other. The seal adapter 2 is press-fitted to the reaction tube 1 via an O-ring 5. Note that the position of the O-ring 3 does not matter as long as the reaction tube 1 can be sealed.

The movable flange 10 includes a cylinder 6, a movable flange 7,
It consists of a fixed side flange 8 and a bellows 9.

A cylinder 6 and a bellows 9 are provided between the movable flange 7 and the fixed flange 8. Movable side flange 7
is crimped through a seal adapter 2 and an O-ring 5, and has a cross section concentric with the reaction tube 1. Furthermore, like the seal adapter 2, the movable flange 7 has an opening 4 that is removed at a predetermined radius.

The fixed side flange 8 is fixed to the manifold 15 as shown in FIG. 3(A). A reaction gas for CVD is introduced into the reaction tube 1 through the manifold 15 via the movable flange IO. The fixed side flange 8 also has an opening corresponding to the movable side flange 7, and both openings are connected by a bellows 9.

The bellows 9 also plays the role of introducing the reaction gas into the reaction tube 1, bringing the movable flange 7 close to the fixed flange 8, and separating the movable flange 7 from the seal adapter 2.

On the other hand, the cylinder 6 is arranged between the movable flange 7 and the fixed flange 8. The cylinder 6 is, for example, a general-purpose air cylinder, and is configured to expand and contract a piston using air pressure (pneumatic pressure).

The air pressure is controlled by the control device. In this embodiment, the air cylinder is driven at 5 to 6 kg/am'', and the driving gas N is supplied via a regulator (not shown).Thereby, the cylinder 6 is connected to the seal adapter 2 of the movable flange 7. The seal attachment/detachment mechanism will be explained below.

FIG. 2(A) shows a state in which the movable flange 7 is press-fitted to the seal adapter 2. When the movable flange 7 is crimped onto the seal adapter 2, the cylinder 6 presses the movable flange 7 in response to a command from a control device (not shown). As a result, the bellows 9 or the movable flange 7 can be connected to the fixed flange 8.
from there to the seal adapter 2, and press the movable flange 7 to the seal adapter 2 via the O-ring 5. The pressing force of the cylinder 6 is controlled by the control device. When the movable flange 7 is pressed against the seal adapter 2, the wafer is introduced into the reaction tube l through the opening of the fixed flange 8. After the wafer is introduced, the other end of the manifold 15 is sealed with a cap (not shown) and reacts with a reaction gas to perform CVD. Note that in the diffusion device as well, the wafer is introduced into the reaction tube and exposed to a hot atmosphere under normal pressure, thereby causing thermal diffusion.

FIG. 2(B) shows a state in which the movable flange 7 is spaced apart from the seal adapter 2. When replacing the reaction tube 1, the cylinder 6 sucks the movable flange 7 according to a command from a control device (not shown). Then, the pressure on the O-ring 5 is released, and the bellows 9 moves the movable flange 7 from the seal adapter 2 to the fixed flange 8 in the longitudinal direction of the reaction tube 1. As a result, the movable flange 7 separates from the seal adapter 2. The suction force of the cylinder 6 is also controlled by the control device. Note that movable flanges lO are provided at both ends of the reaction tube 1.

When the movable flange 10 and the reaction tube l are released,
In step 603, the movable flange 10 is separated from the reaction tube l. Subsequently, in step 604, the heater 11 is opened in the longitudinal direction of the reaction tube 1. As shown in FIG. 3(B), the heater 11 can be divided into upper and lower halves. As shown in FIG. 5(a) and FIG. 5(b), the upper part of the heater is connected to the wire 2.
0, connected to a motor 22 via a pulley 21.

As a result, the upper part of the heater 11 opens in response to the action of the motor 22 winding up the wire 20. pulley 21
The motor 22 is fixed to the frame of the device. Note that the number of wires 20, pulleys 21, and motors 22 is not limited. FIG. 3(B) shows a cross section when the heater 11 is divided in the longitudinal direction of the reaction tube l. Heater 11
For example, a divided heater as shown in Japanese Patent Application Laid-Open No. 59-182294 is used.

In this embodiment, the heater 11 is normally divided by about 60 degrees.

Processing in step 605 is executed in parallel with steps 601 to 604, and the elevator is moved. The elevator is a member that moves the reaction tube a certain height above the floor. Note that this will be described later.

After steps 601 to 604 and step 605 are completed, step 60
6 is carried out, and the arm 14 holding the reaction tube 1 comes into contact with the reaction tube 1. As shown in FIG. 3(C), the arm 14
engage the ends of the reaction tube l from both sides of the reaction tube l. Third
As shown in Figure (A), the reaction tube 1 is longer than the heater 11. In this embodiment, the length of the heater 11 is approximately 1400 m.
m and the length of the reaction tube l is about 1500 mm. Therefore, the arm 14 engages with the reaction tube 1 at an arm holding position 13 located between the end of the heater 11 and the end of the reaction tube 1. The arm 14 is moved by a moving means (not shown) below the arm holding position 13, and then moved upward in step 607 to engage with the reaction tube 1. The engagement part with the reaction tube 1 provided on the arm 14 is made of Teflon resin and has a concave shape, and is formed in a shape into which the reaction tube 1 can be fitted. However, any shape is acceptable as long as it can hold the reaction tube 1 without damaging it.

Further, as long as the arm 14 can hold the reaction tube 1, the moving means does not need to be moved while extending and contracting the arm 14 as in this embodiment. Finally, as shown in FIG. 3(D), in step 607, the arm 1 holding the reaction tube 1
4 or rises to a position where it can be detached from the heater 11. Then, in step 608, the reaction tube 1 is removed. After detachment, the arm 14 is moved by the moving means to the reaction tube exchange position. The reaction tube 1 taken out from the heater 11 is moved by an elevator to a height of about 1300 mm above the floor in step 612, and there, the operator transports it to a cleaning room. Note that in step 609, which is executed in parallel with step 612, the heater 11 is closed, in step 610 the clamp 2b is fixed, and in step 611 the curtain is closed. Thereby, the reaction tube 1 is taken out from inside the apparatus.

On the other hand, when installing the replaced reaction tube 1 into the apparatus, the seventh
Control is performed based on a flowchart as shown in the figure.

Note that since the same process basically means the same content, repeated explanation will be omitted.

When a command is given to start installing the replaced reaction tube 1, in step 613, the reaction tube 1, which has been previously cleaned and reset, is moved in an elevator.

In parallel to this, the curtain is opened in step 601, the clamp is fixed in step 602, the movable flange is removed in step 603, and the heater 11 is opened in step 604. Subsequently, step 614
The arm 14 holding the reaction tube 1 or the heater 11
The arm 14 is moved to the opening of the arm 14 in step 615.
is lowered and the reaction tube 1 is placed on the heater 11, and in step 616 the arm 14 is retracted. Thereafter, in step 612, the elevator returns to a predetermined position, and in parallel thereto, in step 609, the heater 11 is closed, and in step 610, the clamp 2b is fixed. Step 61
In step 7, the movable side flange 7 of the movable flange IO is joined to the seal adapter 2 based on the above-described seal part attachment/detachment mechanism, and finally in step 611, the curtain is closed and the process is completed. In this example, the operator replaces the reaction tube, but it may also be done automatically by a machine. From this, the reaction tube 1 is automatically exchanged by the machine and placed in a predetermined position.

Since the wafers can be replaced without manual intervention, the inside of the reaction tube 1 in which the wafers are subjected to CVD can be kept clean.

Finally, the positioning mechanism of the present invention will be explained. As shown in FIG. 4, the reaction tube 1 is positioned by engaging the notch of the seal adapter 2 with the holding portion 12. Because the reaction tube 1 is attached and detached in a narrow space, it cannot be set properly due to misalignment on the left and right sides and on the circumference.

For this reason, the position of the above-mentioned notch is used as a mark of the setting position of the reaction tube 1. As a result, the movable flange clamps the reaction tube 1 at a predetermined position from both sides, so that the sealing surface and the O-ring become approximately parallel, and the vacuum inside the reaction tube 1 can be maintained. As a result, the positioning accuracy of the replaced reaction tube is improved compared to the conventional method, so that it is not necessary to repeatedly perform positioning work as in the conventional method, and rapid processing can be achieved.

〔Effect of the invention〕

As described above, according to the present invention, since the reaction tubes are replaced by a machine, the uniformity, speed, and safety of the process can be improved. Furthermore, the inside of the reaction tube can be kept clean, and a clean environment for wafer reaction can be ensured.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a configuration diagram of a reaction tube according to the present invention, Fig. 2 is a diagram illustrating a seal part detachment mechanism, Fig. 3 is a diagram illustrating a reaction tube exchange mechanism, and Fig. 3 is a diagram illustrating a reaction tube exchange mechanism. Figure 4 is a diagram to explain the positioning mechanism of the reaction tube, Figure 5 is a diagram to explain the division of the heater, Figure 6 is a flowchart showing the operation sequence when taking out the reaction tube, and Figure 7 is a diagram to explain the reaction tube positioning mechanism. It is a flowchart showing the operation sequence when installing a tube. In the figure, ■ is the reaction tube, 2 is the seal adapter, 3 is the seal surface, 4 is the opening of the seal adapter, 5 is the O-ring, 6 is the cylinder, 7 is the seal part, 8 is the connection part, 9 is the bellows, 10 11 is a movable flange, 11 is a heater, 12 is a holding part, 13 is an arm holding position, 14 is an arm, 15 is a manifold, 20 is a wire, 2I is a pulley, and 22 is a motor. Fig. 1 Fig. 2 Fig. 2 Cross-over pipe shift - 1st year 1st century Slot for the 1st year Fig. 13 Fig. 6

Claims (8)

[Claims] (1) A reaction tube (1), a pair of sealing members (7) provided at both ends of the reaction tube (1), and sealing the reaction tube (1); and a pair of sealing members (7). A semiconductor manufacturing apparatus comprising a heating member (11) disposed around the reaction tube (1) between the reaction tubes (1) and capable of opening and closing along the longitudinal direction of the reaction tube (1). ), the reaction tube (1) and the sealing member (7) are separated from each other, and the reaction tube (1) is exchanged. (2) The reaction tube (1) has a jig (2) for protecting the reaction tube (1) at the joint with the sealing member (7), and the exchange device includes a jig (2) for protecting the reaction tube (1). (1) and the jig (2)
2. The semiconductor manufacturing apparatus according to claim 1, wherein the semiconductor manufacturing apparatus is replaced as one unit. (3) The exchange device includes an opening/closing means (22) for opening and closing the heating member (11), and a sealing member for joining the sealing member (7) to the reaction tube (1) or separating it from the reaction tube (1). 2. The semiconductor manufacturing apparatus according to claim 1, further comprising a sealing member moving means (6), a control means for controlling operations of the opening/closing means (22) and the sealing member moving means (6). (4) The exchanging means includes the opened heating member (11)
4. The semiconductor manufacturing apparatus according to claim 3, further comprising means (14) for separating said reaction tube (1) from said reaction tube (1). (5) The semiconductor manufacturing apparatus according to claim 4, wherein the exchanger includes a positioning means (12) for positioning the exchanged reaction tube at a predetermined position. (6) The positioning means includes a first engaging part formed on the jig (2) and a second engaging part (fixed to the substrate and engaged with the first engaging part). 12) Claim 5 consisting of
The semiconductor manufacturing apparatus described above. (7) The semiconductor manufacturing apparatus according to any one of claims 1 to 6, further comprising a reactive gas introducing device for performing thin film growth processing by chemical vapor deposition. (8) The semiconductor manufacturing apparatus according to any one of claims 1 to 6, further comprising a thermal diffusion treatment apparatus for performing thermal diffusion treatment.