JPH04162730A - Pressing force control mechanism for die bonding apparatus - Google Patents

Pressing force control mechanism for die bonding apparatus

Info

Publication number
JPH04162730A
JPH04162730A JP28901690A JP28901690A JPH04162730A JP H04162730 A JPH04162730 A JP H04162730A JP 28901690 A JP28901690 A JP 28901690A JP 28901690 A JP28901690 A JP 28901690A JP H04162730 A JPH04162730 A JP H04162730A
Authority
JP
Japan
Prior art keywords
pressing force
pellet
collet
die bonding
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28901690A
Other languages
Japanese (ja)
Inventor
Tsumoru Takado
高堂　積
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP28901690A priority Critical patent/JPH04162730A/en
Publication of JPH04162730A publication Critical patent/JPH04162730A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To set a precise pressing force and to always monitor the force by providing means for quantitatively measuring and displaying the force for pressing a die. CONSTITUTION:When a bonding head is moved down so that a collet 1 is brought into contact with a pellet 4, it is evacuated by an evacuation tube 7 to suck the pellet 4 by a suction hole 6. Then, the head is moved on an island of a lead frame to be moved down, the pellet 4 is pressed on the island to compress a spring 8 and to lift a load transmitter 9. The lifted transmitter 9 lifts a piezoelectric element 10 to send a current generated at the element 10 to a die bonding apparatus body through a signal line to display the current in terms of pressing force. Thus, a precise pressing force is set, and the force can be always monitored.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体ペレット（以下単にペレットと呼ぶ）
をケースあるいはリードフレームに搭載するダイボンデ
インク装置に関し、特にダイを押す力を制御する押圧力
制御機構に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to semiconductor pellets (hereinafter simply referred to as pellets).
The present invention relates to a die bonding device that is mounted on a case or a lead frame, and particularly to a pressing force control mechanism that controls the force that presses the die.

〔従来の技術〕[Conventional technology]

通常、ダイボンディング装置は、半導体ペレ・ｙトであ
るダイをコレットで吸着し、リードフレームあるいはパ
ッケージのケースにペレットを接着剤で接着固定する装
置である。従来、この種のダイボンディング装置の押圧
力制御機構は、図面には示さないか、ペレットを吸着し
て、リードフレームあるいはケースにペレットを押し付
けるコレットを保持するホルダーの他端にスプリングが
取付けられており、このスプリングの圧縮に対する反発
力でペレットを押し付ける構造であった。Generally, a die bonding device is a device that adsorbs a die, which is a semiconductor pellet, with a collet and fixes the pellet to a lead frame or a package case using an adhesive. Conventionally, the pressing force control mechanism of this type of die bonding equipment is either not shown in the drawings or has a spring attached to the other end of the holder that holds the collet that attracts the pellet and presses the pellet against the lead frame or case. The structure was such that the repulsive force against the compression of this spring pressed against the pellets.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、上述した従来のダイボンディング装置の
押圧力制御機構では、単にスプリングの反発力により押
圧力設定しているので、細かな押圧力のダイボンディン
グのときの押圧力設定が出来ないし、正確に測定するこ
とが出来ないという欠点がある。However, with the pressing force control mechanism of the conventional die bonding equipment described above, the pressing force is set simply by the repulsive force of the spring, so it is not possible to set the pressing force during die bonding with a fine pressing force, and it is not possible to accurately measure the pressing force. The disadvantage is that it cannot be done.

本発明の目的は、かかる欠点を解消し、精密な押圧力を
設定出来るとともに常に押圧力を監視出来るダイボンデ
ィング装置の押圧力制御機構を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a pressing force control mechanism for a die bonding apparatus that can eliminate such drawbacks, set a precise pressing force, and constantly monitor the pressing force.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のダイボンディング装置の押圧力制御機構は、中
央に吸気穴をもつとともに半導体ベレットを吸着するコ
レットと、このコレットをその一端に取付けるホルダと
、このホルダの他端にスプリングを介して取付けられる
荷重伝達部と、この荷重伝達部により前記コレットの押
圧力を検出する検出器とを備えることを特徴としている
。The pressing force control mechanism of the die bonding apparatus of the present invention includes a collet that has an air intake hole in the center and that attracts a semiconductor pellet, a holder that attaches the collet to one end of the collet, and a holder that attaches the collet to the other end of the holder via a spring. The present invention is characterized by comprising a load transmitting section and a detector that detects the pressing force of the collet using the load transmitting section.

〔実施例〕〔Example〕

次に、本発明について図面を参照し′て説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明のダイボンディング装置の押圧力制御機
構の一実施例を示すボンディングヘッド部の正面図であ
る。このダイボンディング装置の押圧力制御機構は、同
図に示すように、ペレット４を吸着する吸気穴６をもつ
コレット１と、このコレット１を取付けるホルダ２と、
このホルダ２の他端にスプリング８を介して取付けられ
た荷重伝達部９と、この荷重伝達部９の一面に押され、
押圧力を測定する圧電素子１０とで構成されている。ま
た、ホルダ２及び荷重伝達部９は、押圧力がペレットの
面に垂直の荷重を伝えるように、ベアリング３により支
えられている。FIG. 1 is a front view of a bonding head section showing an embodiment of the pressing force control mechanism of the die bonding apparatus of the present invention. As shown in the figure, the pressing force control mechanism of this die bonding device includes a collet 1 having an intake hole 6 for adsorbing pellets 4, a holder 2 to which this collet 1 is attached,
A load transmitting portion 9 is attached to the other end of the holder 2 via a spring 8, and the load transmitting portion 9 is pushed by one surface of the load transmitting portion 9.
It is composed of a piezoelectric element 10 that measures the pressing force. Further, the holder 2 and the load transmitting section 9 are supported by a bearing 3 so that the pressing force transmits a load perpendicular to the surface of the pellet.

次に、このダイボンディング装置の押圧力制御機構の動
作を説明する。まず、ボンディングへ・ンド部が下降し
、コレット１はペレット４に接触する。これと同時に真
空排気管７を介して真空排気する。このことにより、ペ
レット４は吸気穴６により、ペレット４とコレット１の
空間は真空状態にし、ペレット４はコレット１を吸着す
る。次に、ボンディングヘッド部が、リードフレームの
アイランド上に移動し、再び、ボンデングヘ・ンド部が
下降し、ペレット４はアイランドに押し付けられる。こ
のことにより、スプリング８が圧縮するとともに荷重伝
達部９を押し上げる。この押し上げられた荷重伝達部９
は圧電素子１０を押し上げる。このことにより圧電素子
１０に発生した電流は信号線を伝達しダイボンディング
装置本体へと送られる。次に、この電流を押圧力に換算
し、ディジタルメータに押圧力として表示する。Next, the operation of the pressing force control mechanism of this die bonding apparatus will be explained. First, the bonding section descends, and the collet 1 comes into contact with the pellet 4. At the same time, the air is evacuated via the evacuation pipe 7. As a result, the pellet 4 makes the space between the pellet 4 and the collet 1 a vacuum state through the suction hole 6, and the pellet 4 adsorbs the collet 1. Next, the bonding head section is moved onto the island of the lead frame, and the bonding head section is lowered again, pressing the pellet 4 against the island. As a result, the spring 8 is compressed and the load transmission section 9 is pushed up. This pushed up load transmission part 9
pushes up the piezoelectric element 10. The current generated in the piezoelectric element 10 is transmitted through the signal line and sent to the main body of the die bonding apparatus. Next, this current is converted into a pressing force and displayed as the pressing force on a digital meter.

このように、常に、デジタルメータに押圧力を表示する
ことが出来る。また、初期的に押圧力を調整する場合は
、荷重伝達機構の長さを変えるナツトを調整することに
よって達成し得る。In this way, the pressing force can always be displayed on the digital meter. In addition, initial adjustment of the pressing force can be achieved by adjusting a nut that changes the length of the load transmission mechanism.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、ダイを押圧する押圧力を
定量的に測定・表示する手段を設けることによって、最
適な押圧力を設定出来るとともに常に押圧力を監視出来
るダイボンディング装置の押圧力制御機構が得られると
いう効果がある。As explained above, the present invention provides a means for quantitatively measuring and displaying the pressing force that presses the die, thereby making it possible to set the optimum pressing force and constantly monitor the pressing force of the die bonding device. This has the effect of providing a mechanism.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明のダイボンディング装置の押圧力制御機
構の一実施例を示すダイボンディングヘッド部の正面図
である。 １・・・コレット、２・・・ホルダー、３・・・ベアリ
ング、４・・・ペレット、５・・・シート、６・・・吸
着穴、７・・・真空排気管、８・・・スプリング、９・
・・荷重伝達部、１０・・・圧電素子。FIG. 1 is a front view of a die bonding head section showing an embodiment of the pressing force control mechanism of the die bonding apparatus of the present invention. 1... Collet, 2... Holder, 3... Bearing, 4... Pellet, 5... Sheet, 6... Suction hole, 7... Vacuum exhaust pipe, 8... Spring , 9・
...Load transmission section, 10...piezoelectric element.

Claims (1)

【特許請求の範囲】[Claims] 　中央に吸気穴をもつとともに半導体ペレットを吸着す
るコレットと、このコレットをその一端に取付けるホル
ダと、このホルダの他端にスプリングを介して取付けら
れる荷重伝達部と、この荷重伝達部により前記コレット
の押圧力を検出する検出器とを備えることを特徴とする
ダイボンデング装置の押圧力制御機構。A collet that has an intake hole in the center and that attracts semiconductor pellets, a holder that attaches this collet to one end of the collet, a load transmitting part that is attached to the other end of the holder via a spring, and a load transmitting part that allows the collet to A pressing force control mechanism for a die bonding device, comprising: a detector for detecting pressing force.
JP28901690A 1990-10-26 1990-10-26 Pressing force control mechanism for die bonding apparatus Pending JPH04162730A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28901690A JPH04162730A (en) 1990-10-26 1990-10-26 Pressing force control mechanism for die bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28901690A JPH04162730A (en) 1990-10-26 1990-10-26 Pressing force control mechanism for die bonding apparatus

Publications (1)

Publication Number Publication Date
JPH04162730A true JPH04162730A (en) 1992-06-08

Family

ID=17737742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28901690A Pending JPH04162730A (en) 1990-10-26 1990-10-26 Pressing force control mechanism for die bonding apparatus

Country Status (1)

Country Link
JP (1) JPH04162730A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08124947A (en) * 1994-10-19 1996-05-17 Rohm Co Ltd Bonding device of semiconductor chip
EP1278232A2 (en) * 2001-07-17 2003-01-22 ASM Assembly Automation Ltd. Apparatus and method for bond force control
KR100692516B1 (en) * 2004-12-16 2007-03-09 (주)스맥 Chip bonder
CN113327868A (en) * 2020-02-28 2021-08-31 上海微电子装备（集团）股份有限公司 Bonding head, bonding apparatus and bonding method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53117378A (en) * 1977-03-23 1978-10-13 Nec Corp Assembling device of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53117378A (en) * 1977-03-23 1978-10-13 Nec Corp Assembling device of semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08124947A (en) * 1994-10-19 1996-05-17 Rohm Co Ltd Bonding device of semiconductor chip
EP1278232A2 (en) * 2001-07-17 2003-01-22 ASM Assembly Automation Ltd. Apparatus and method for bond force control
EP1278232A3 (en) * 2001-07-17 2003-05-02 ASM Assembly Automation Ltd. Apparatus and method for bond force control
US6616031B2 (en) 2001-07-17 2003-09-09 Asm Assembly Automation Limited Apparatus and method for bond force control
KR100692516B1 (en) * 2004-12-16 2007-03-09 (주)스맥 Chip bonder
CN113327868A (en) * 2020-02-28 2021-08-31 上海微电子装备（集团）股份有限公司 Bonding head, bonding apparatus and bonding method
CN113327868B (en) * 2020-02-28 2023-05-30 上海微电子装备（集团）股份有限公司 Bonding head, bonding apparatus, and bonding method

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