JPH04162722A - Cleaning device - Google Patents

Cleaning device

Info

Publication number
JPH04162722A
JPH04162722A JP28901890A JP28901890A JPH04162722A JP H04162722 A JPH04162722 A JP H04162722A JP 28901890 A JP28901890 A JP 28901890A JP 28901890 A JP28901890 A JP 28901890A JP H04162722 A JPH04162722 A JP H04162722A
Authority
JP
Japan
Prior art keywords
tank
particles
cleanser
pump
filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28901890A
Other languages
Japanese (ja)
Inventor
Yuichi Takeshita
雄一 竹下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP28901890A priority Critical patent/JPH04162722A/en
Publication of JPH04162722A publication Critical patent/JPH04162722A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate adverse influence on a semiconductor device due to adsorption of metal charged particles to the surface of a semiconductor substrate by providing a trap for collecting the particles on a cleanser circulation passage. CONSTITUTION:A washing tank 10 is formed of an inner tank 1 and an outer tank 2, and cleanser in the tank 2 is fed to the bottom of the tank 1 through a metal charged particle trap 4 and a filter 5 by a pump 3. The cleanser overflowed from the tank 1 filled with the cleanser is circulated from the tank 2 by the pump 3, only the particles in the cleanser is selectively removed by the tap 4, dusts, foreign matters are further removed by the filter 5, and circulated to the bottom of the tank 1. Accordingly, the particles can be reduced. Thus, adverse influence of the adherence of the particles on the surface of the board to electric characteristics of a semiconductor device can be eliminated.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は洗浄装置に関し、特に半導体装置の製造工程に
於いて用いられる洗浄装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cleaning device, and particularly to a cleaning device used in the manufacturing process of semiconductor devices.

〔従来の技術〕[Conventional technology]

従来の半導体基板の洗浄に用いられる洗浄装!は、第2
図に示すように、フィルタ5を介してポンプ3により水
洗槽10を構成する外槽2内の洗浄液を循環させ、内槽
1内で発泡、振動させて内槽1内に浸漬させた半導体基
板表面に付着したごみや異物を除去するように構成され
ていた。
Cleaning equipment used for conventional cleaning of semiconductor substrates! is the second
As shown in the figure, the cleaning liquid in the outer tank 2 constituting the washing tank 10 is circulated by the pump 3 through the filter 5, and the semiconductor substrate is immersed in the inner tank 1 by foaming and vibrating in the inner tank 1. It was designed to remove dirt and foreign matter attached to the surface.

〔発明が解決しようとす乞課題〕[Problems that inventions seek to solve]

しかしながら、この従来の洗浄装置では、洗浄液内に存
在する金属荷電粒子が半導体基板表面に吸着、侵入して
残り、半導体基板に形成される素子特性に悪影響を与え
るという問題点があった。
However, this conventional cleaning apparatus has a problem in that charged metal particles present in the cleaning liquid are adsorbed onto the surface of the semiconductor substrate, remain there, and adversely affect the characteristics of elements formed on the semiconductor substrate.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の洗浄装置は、外槽と内槽からなる水洗槽と、前
記外槽の洗浄液をフィルタを介して前記内槽に循環させ
るポンプとを有する洗浄装置において、前記洗浄液の循
環経路に金属荷電粒子を捕獲するためのトラップを設け
たものである。
The cleaning device of the present invention includes a cleaning tank including an outer tank and an inner tank, and a pump that circulates the cleaning liquid in the outer tank to the inner tank through a filter. It is equipped with a trap to capture particles.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.

第1図において水洗層10は、内槽1と外槽2とから構
成され、外槽2内の洗浄液はポンプ3により金属荷電粒
子トラップ4とフィルタ5を介して内槽1の底部に送ら
れるように構成されているJ このように構成された実施例によれば、洗浄液の入った
内槽1よりオーバーフローした洗浄液は、外槽2よりポ
ンプ3により循環し、キレート樹脂を内部にもつ金属荷
電粒子トラップ4にて、洗浄液内の金属荷電粒子のみが
選択的に除去され、更にフィルタ5にてごみや異物か除
去されて内槽の底部へ還流される。従って従来の洗浄装
置の場合に比べ、金属荷電粒子を極めて少くすることが
できる。
In FIG. 1, the washing layer 10 is composed of an inner tank 1 and an outer tank 2, and the cleaning liquid in the outer tank 2 is sent to the bottom of the inner tank 1 by a pump 3 via a metal charged particle trap 4 and a filter 5. J According to the embodiment configured as described above, the cleaning liquid overflowing from the inner tank 1 containing the cleaning liquid is circulated by the pump 3 from the outer tank 2, and the cleaning liquid is circulated through the pump 3 to remove the charged metal having the chelate resin inside. A particle trap 4 selectively removes only the metal charged particles in the cleaning liquid, and a filter 5 removes dust and foreign matter, which are then returned to the bottom of the inner tank. Therefore, the amount of charged metal particles can be significantly reduced compared to conventional cleaning devices.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、洗浄液の循環経路の中途
に、キレート樹脂系の金属荷電粒子トラップを取り付け
ることにより、金属荷電粒子のみを選択的に除去できる
ので、半導体基板表面に金属荷電粒子が付着し半導体装
置の電気的特性に悪影響が及ぶのを防ぐことができると
いう効果がある。
As explained above, the present invention can selectively remove only metal charged particles by installing a chelate resin-based metal charged particle trap in the middle of the cleaning liquid circulation path, so that metal charged particles can be removed from the surface of the semiconductor substrate. This has the effect of preventing adhesion and adverse effects on the electrical characteristics of the semiconductor device.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の断面図、第2図は従来例の
断面図である。 1・・・内槽、2・・・外槽、3・・・ポンプ、4・・
・金属荷電粒子トラップ、5・・・フィルタ、10・・
・水洗槽。
FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1...Inner tank, 2...Outer tank, 3...Pump, 4...
・Metal charged particle trap, 5...filter, 10...
・Washing tank.

Claims (1)

【特許請求の範囲】[Claims]  外槽と内槽からなる水洗槽と、前記外槽の洗浄液をフ
ィルタを介して前記内槽に循環させるポンプとを有する
洗浄装置において、前記洗浄液の循環経路に金属荷電粒
子を捕獲するためのトラップを設けたことを特徴とする
洗浄装置。
A trap for capturing metal charged particles in a circulation path of the cleaning liquid in a cleaning device having a washing tank consisting of an outer tank and an inner tank, and a pump that circulates the cleaning liquid in the outer tank to the inner tank via a filter. A cleaning device characterized by being provided with.
JP28901890A 1990-10-26 1990-10-26 Cleaning device Pending JPH04162722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28901890A JPH04162722A (en) 1990-10-26 1990-10-26 Cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28901890A JPH04162722A (en) 1990-10-26 1990-10-26 Cleaning device

Publications (1)

Publication Number Publication Date
JPH04162722A true JPH04162722A (en) 1992-06-08

Family

ID=17737766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28901890A Pending JPH04162722A (en) 1990-10-26 1990-10-26 Cleaning device

Country Status (1)

Country Link
JP (1) JPH04162722A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06254255A (en) * 1993-03-08 1994-09-13 Zetsutaa Kogyo Kk Flush-type cigarette butt collecting device
JP2008199669A (en) * 1997-03-21 2008-08-28 Canal Plus Transmission and reception of television programs and other data

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06254255A (en) * 1993-03-08 1994-09-13 Zetsutaa Kogyo Kk Flush-type cigarette butt collecting device
JP2008199669A (en) * 1997-03-21 2008-08-28 Canal Plus Transmission and reception of television programs and other data

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