JPH04160712A - Push button switch - Google Patents

Abstract

PURPOSE:To eliminate loss of the performance and the function of a push button switch at the time of generating burr in a parts by footing recessed parts, on which projecting pins for separating a wafer from a forming mold can abut, in the bottom surface of the wafer. CONSTITUTION:A wafer 2 having three fixed contact points 3a-3c in the bottom surface thereof, a movable contact point made of a dome-type plate spring 4, a metal frame 5, a knob 7a, and a stem 7 having a pushing part 7b are comprised. Recessed parts 18, on which projecting pins for separating the wafer 2 form a movable mold 12 at the time of molding the wafer 2 can abut, are formed in the bottom surface 2b of the wafer 2. Even if burr 17 is generated in parts such as the wafer 2, the stem 7 or the like by abrasion of the projecting pins 16, loss of the performance and the function of a switch by this burr 17 is eliminated to prolong a maintenance cycle of a forming mold.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to push-button switch components, particularly to a push-button switch that is effective for paring wafers and stems.

[Prior Art] Figs. 11 to 20 are explanatory diagrams of conventional examples, in which Fig. 11 is a sectional view of a push button switch, Fig. 12 is a sectional view showing an example of a wafer mold, and Fig. 13 is a sectional view of a wafer mold. Perspective view of wafer after molding,
Fig. 14 is a plan view showing the arrangement of contacts and leaf springs;
The figure is a sectional view taken along the line ■-■ in Fig. 14, Fig. 16 is a sectional view showing another example of a wafer mold, Fig. 17 is a perspective view of the wafer after molding, and Fig. 18 is a sectional view of the wafer. FIG. 19 is a cross-sectional view of the stem molding die, and FIG. 20 is a perspective view of the stem after molding.

In Fig. 11, 1 is a conventional push button switch, and side wall 2
Three fixed contacts 3a, 3 are arranged in a row on the bottom surface 2b surrounded by
Wafer 2 with the same values of b and 3c, and the bottom surface 2 of this wafer 2
a movable contact made of a dome-shaped leaf spring 4 placed on the wafer 2 and whose outer peripheral edge is always in contact with the contacts 3a and 3c at both ends; and a metal frame 5 attached to the upper surface of the side wall 2a of the wafer 2. , has a stem 7 which is disposed above the leaf spring 4 and is movable up and down within the wafer 2 with a knob 7a projecting upward from the hole 6 of the metal frame 5.

Then, when the stem 7 is pressed downward against the elasticity of the leaf spring 4, the pressing part 7b of the stem 7 presses the top of the leaf spring 4, and the leaf spring 4 is deformed downward and reversed to become a leaf spring. The top of 4 contacts the center contact 3b, and eventually three fixed contacts -3
a, 3b, and 3c are electrically connected by the leaf spring 4, and the contact point of the switch is ONL, and except for the pressing force of the stem 7, the leaf spring 4
is reversed, the stem 7 returns to its original state by the restoring force of the leaf spring 4, and the contact of the switch 1 returns to its OFF state.

When molding the above wafer 2, the 12th
As shown in the figure, molten resin is injected from a runner 14 through a gate 15 into a cavity 13 that is created when a molding die consisting of a fixed mold 11 and a movable mold 12 is closed, and after cooling, the movable mold 12 Parting line P・
(2) After moving the wafer 2 molded in the cavity 13 downward together with the movable mold 12, the bottom surface 2b of the wafer 2 is pressed upward with the ejecting pin 16 to move the wafer 2 into the movable mold 12. I was separated from it.

Further, as another means for molding the wafer 2, a molding die shown in FIG. 16 is used. The molding means of this molding die is the same as the molding means described above, but when separating the molded wafer 2 from the movable mold 12, the end surface of the side wall 2a of the wafer 2 is pushed upward with the tip of the protruding pin 16. was.

In addition, when molding the stem 7, as shown in FIG. 19, molten resin is injected into the cavity 13 from the runner 14 through the gate 15, which is created when the fixed mold 11 and the movable mold 12 are closed. After cooling, the movable mold 12 is moved downward from the parting line P.
After moving the stem 7 downward together with the movable mold 12, the lower surface of the flat part 7c of the peripheral edge of the knob 7a of the stem 7 was pressed upward by the ejecting pin 16 to separate the stem 7 from the movable mold 12.

[Problems to be Solved by the Invention] By the way, when the wafer 2 is
When the wafer 2 is molded, the tip of the ejector pin 16 comes into contact with the bottom surface 2b of the wafer 2 when the wafer 2 is separated from the movable mold 12. eventually wears out and a gap is created between the tip of the ejector pin 16 and the bottom surface 2b, and the resin wraps around this gap to prevent the wafer facing the ejector pin 16 from forming, as shown in FIGS. 13 to 15. A burr 17 is produced on the bottom surface 2b of 2. When this burr 17 is generated, the outer peripheral edge of the leaf spring 4 rides on the burr 17, or the burr 17 is scraped by the edge of the leaf spring 4, as shown in FIG. There is a problem that the contact between the contacts 3a and 3c becomes unstable and the switch causes a contact failure.Furthermore, when the wafer 2 is molded with the mold shown in FIG. In this case, the ejector pin 16 comes into contact with the end surface of the side wall 2a of the wafer 2, so if the wafer 2 is repeatedly molded using the same mold, the tip of the ejector pin 16 will wear out, causing the tip of the ejector pin 16 and the end surface of the side wall 2a to become damaged. A gap is created between the two, and the resin flows into this gap to form a burr 17 on the end surface of the side wall 2a. When the burr 17 is generated in this way, the metal frame 5 is tilted and placed on the end surface of the side wall 2a of the wafer 2, as shown in FIG. Not only may contact occur, which may impede the smooth elevation of the stem 7, but also the end face of the side wall 2a and the metal frame 5.
The burr 17, dust, etc. can be seen on the bottom surface 2b of the wafer 2 through the gap.
the fixed contact 3a.

3b and 3c, causing poor contact with the switch. Furthermore, if the stem 7 is molded using a molding die as shown in FIG. Flat part 7c of the periphery of the knob 7a of 7
Since the tip of the ejector pin 16 comes into contact with the lower surface, when molding the stem 7 repeatedly five times, the tip of the ejector pin 16 wears out, creating a gap between the tip of the ejector pin 16 and the lower surface of the flat part 7c. Resin flows into the gap and causes burrs 17. When the stem 7 is fed to an automatic assembly machine using a parts feeder, this burr 17 breaks and sticks to the stem 7 in an unstable state.
If the switch is incorporated as a part of the switch, there is a problem that the burr 17 comes off and adheres to the fixed contacts 3a, 3b, and 3c, causing poor contact in the switch.

In addition, in the three molding molds described above, the wear of the tip of the ejector pin 16 must be strictly controlled to prevent the occurrence of burrs 17, so there is a problem that the maintenance cycle of the molding molds is short. there were.

The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to prevent undesired cracks from occurring during molding of push button switch parts such as wafers and stems.
To provide a push button switch that does not impair the performance of the push button switch and at the same time extends the maintenance cycle of a molding die.

[a! Means for Solving the Problem] In order to achieve the above object, a first invention provides a wafer which is surrounded by side walls to form a bottom surface and has three fixed contacts disposed on the bottom surface; a movable contact consisting of a dome-shaped leaf spring placed on the bottom surface of the wafer and whose outer peripheral edge is always in contact with the fixed contacts at both ends; a metal frame placed on the end surface of the side wall of the wafer; The push-button switch has a stem positioned above the wafer that can be raised and lowered, and has a configuration in which a recess is formed in the bottom surface of the wafer so that a protruding pin for separating the wafer from the mold can come into contact with the push-button switch.

The second invention provides a wafer that is surrounded by side surfaces to form a bottom surface and has three fixed contacts arranged on the bottom surface, and a movable contact that is placed on the bottom surface of the wafer and is in constant contact with the fixed contacts at both ends. and a push button switch having a metal frame placed on an end surface of a side wall of the wafer, and a stem located on the movable contact and capable of being raised and lowered; It has a configuration in which an accessible recess is formed on the end surface of the side wall of the wafer.

A third invention provides a wafer having a bottom surrounded by side walls and having three fixed contacts disposed on the bottom, and a movable contact placed on the bottom of the wafer and always in contact with the fixed contacts at both ends. and a push button switch having a metal frame placed on an end surface of the side wall of the wafer, and a stem located on the movable contact and capable of being raised and lowered, and an ejecting pin for separating the stem from the molding die. The stem has a structure in which an accessible recess is formed in the flat part of the stem.

[Function] According to the present invention, when molding parts of a push button switch such as a wafer and a stem, the ejecting pin is brought into contact with a recess formed in the part when separating the molded part from the molding die. Therefore, even if a burr occurs on the part, the burr will be contained within the recess and will not protrude from the surface of the part.

Therefore, the performance 9 function of the push button switch is not impaired by the above-mentioned release.

In addition, since the break is generated within the recess provided in the part, there is no need to strictly control the wear of the ejector pin.
Therefore, the maintenance cycle of the molding die can be extended compared to the conventional method.

[Example] Embodiments of the present invention will be described below with reference to the accompanying drawings.

Figures 1 to 5 are detailed explanatory views of the first invention, in which Figure 1 is a sectional view of a push button switch, Figure 2 is a sectional view showing an example of a wafer molding die, and Figure 3 is a sectional view of a wafer molding die. Perspective view of the later wafer,
Fig. 4 is a plan view showing the arrangement of contacts and movable contacts, Fig. 5 is a sectional view taken along line 1-1 in Fig. 4, and Figs. 6 to 8 are detailed explanatory views of the second invention. , FIG. 6 is a sectional view showing another example of a wafer mold, FIG. 7 is a perspective view of the wafer after molding,
FIG. 8 is a sectional view showing the arrangement of the wafer and the metal frame;
9 and 10 are detailed explanatory views of the third invention, in which FIG. 9 is a sectional view of a mold for forming the stem, and FIG. 10 is a perspective view of the stem after molding.

In addition, in these FIGS. 1 to 10, the same parts as those of the conventional example shown in FIGS. 11 to 20 are given the same reference numerals.

The first invention shown in FIG. 1 is, as illustrated in FIG.
Similar to the prior art shown in FIG. 11 described above, a wafer 2 having three fixed contacts 3a, 3b, and 3c on the bottom surface, a movable contact consisting of a dome-shaped leaf spring 4, a metal frame 5, a knob 7a, The stem 7 has a suppressing portion 7b. Then, on the bottom surface 2b of the wafer 2, a second. As illustrated in FIG. 3, a recess 18 is formed on which a protruding pin 1G for separating the wafer 2 from the movable mold 12 can come into contact during molding of the wafer 2.

In the embodiment of the first invention configured in this manner, during molding, the ejector pins 16 are brought into contact with the recesses 18, even if the ejector pins 16 are repeatedly brought into contact with the recesses 18 of each wafer. Even if the tip of the burr 16 is worn out and a burr 17 is generated as described above, the burr 17 is contained within the recess 18 and does not protrude from the recess 18, as shown in FIGS. 3 to 5. Therefore, unlike the conventional case, the outer peripheral edge of the leaf spring 4 does not ride on the burr 17, and the burr is not scraped at the edge of the leaf spring 4, so that the outer peripheral edge of the leaf spring 4 and both ends The contact between the fixed contacts 3a and 3c is always stable, and the switch will not cause contact failure.

Further, the embodiment of the second invention has its main part configuration as shown in Section 6.7.
．． As shown in Figure 8, a movable mold 12 of a molding die is placed on the wafer 2.
recess 1 to which a protruding bottle 16 can abut for separation from the
8a is formed on the end surface of the side wall 2a of the wafer 2.

Note that the other basic configuration is the same as that shown in FIG. 1 described above, for example.

In the embodiment of the second invention configured as described above, during molding, the ejecting bottle 16 is brought into contact with the recess 18a of each wafer, and the ejecting bottle 16 is repeatedly brought into contact with the recess 18a of each wafer. Even if the tip of the metal frame is worn and a burr 17 is generated as described above, the burr 17 is contained within the recess lsa and does not protrude from the recess 18a. Therefore, as shown in FIG. 5 is placed perpendicularly to the end surface of the side wall 2a of the wafer 2 without tilting, so the knob 7a of the stem 7 does not come into contact with the periphery of the hole 6 of the metal frame 5, and the stem 7
can go up and down smoothly. Further, since there is no gap between the end surface of the side wall 2a of the wafer 2 and the metal frame 5, foreign matter such as burrs 17 and dust will not enter the bottom surface 2b of the wafer 2, and the switch will always be in contact. Well kept.

Further, in the embodiment of the third invention, as shown in FIG. 9 and FIG. 10, the ejecting pin 16 for separating the stem 7 from the movable mold 12 of the molding die can abut. A recessed portion 18b is formed in the flat portion 7c of the stem 7.

Note that the other basic configuration is the same as that shown in FIG. 1 described above, for example.

In the third embodiment of the invention configured as described above, during molding, the ejection pin 16 is brought into contact with the recess 18b, and the ejection pin 16 is repeatedly brought into contact with the recess 18 of each stem. Even if the tip of the stem 16 is worn out and a burr 17 is generated as described above, the burr 17 is contained within the recess 18b and does not protrude from the recess 18b. Therefore, the stem 7 can be automatically assembled using a parts feeder. When the burr 17 is supplied to the machine, the burr 17 will not break. Therefore, even if the stem 7 is incorporated as a part of the push button switch 1, the burr 17 will be removed and the fixed contacts 3a, 3b
, 3c and will not cause poor contact with the switch.

In addition, in each of the embodiments of the first to third inventions described above, the protruding pin 16 is located in the recess 18 of the wafer 2 and the stem 7.
, 18a, 18b, the pin 17 is housed in the recesses 18, 18a, 18b, so there is no need to severely control the wear of the ejector pin 16 as in the past. Therefore, the maintenance cycle of the molding die can be extended compared to the conventional method.

[Effects of the Invention] As described above, according to the present invention, even if burrs occur in components such as the wafer and stem due to wear of the ejector pins, the performance 9 functions of the switch will not be impaired by the burrs.

Furthermore, since there is no need to strictly control the wear of the ejector pins as in the past, the maintenance cycle of the molding die can be extended compared to the past.

[Brief explanation of drawings]

Figures 1 to 5 are detailed explanatory views of the first invention, in which Figure 1 is a sectional view of a push button switch, Figure 2 is a sectional view showing an example of a wafer molding die, and Figure 3 is a sectional view of a wafer molding die. Perspective view of the later wafer,
Fig. 4 is a plan view showing the arrangement of contacts and movable contacts, Fig. 5 is a sectional view taken along line I-1 in Fig. 4, and Figs. 6 to 8 are detailed explanatory views of the second invention. , FIG. 6 is a sectional view showing another example of a wafer mold, FIG. 7 is a perspective view of the wafer after molding,
FIG. 8 is a sectional view showing the arrangement of the wafer and the metal frame;
9 and 10 are detailed explanatory views of the third invention, in which FIG. 9 is a sectional view of a mold for forming the stem, FIG. 10 is a perspective view of the stem after molding, and FIGS. The figures are explanatory diagrams of a conventional example: Fig. 11 is a cross-sectional view of a push button switch, Fig. 12 is a cross-sectional view showing an example of a wafer molding die, Fig. 13 is a perspective view of the wafer after molding, and Fig. 14 15 is a plan view showing the arrangement of contacts and movable contacts, FIG. 15 is a sectional view taken along line II-II in FIG. 14, FIG. 16 is a sectional view showing another example of a wafer mold, and FIG. 17 18 is a cross-sectional view showing the arrangement of the wafer and the metal frame, FIG. 19 is a cross-sectional view of the stem molding die, and FIG. 20 is a perspective view of the stem after molding. be. 1...Push button switch, 2...Wafer,
2a...Side wall, 2b...Bottom surface, 3a,
3b, 3c...Fixed contact, 4...Movable contact, 5...Metal frame, 7...Stem, 7c...Flat part , 11... Fixed type, 12... Movable type, 16... Protruding pin, 17... Paris, 18, 18a, 18b.
・・・・・・Concavity. Fig. 1 Fig. 3 3a 2b 3b // tB Fig. 6; Bulb 17 Fig. 2σ. Nojij Kushi Town Figure 9 7: Stem 7 o 2 to 65 City I Otoba STIEIO Figure 18b: Okogun Figure 11 Figure 12 Figure 13 Figure 14 Figure 14 3a 3b 2b Figure 17

Claims (3)

[Claims] (1) A wafer that is surrounded by side walls to form a bottom surface and has three fixed contacts arranged on the bottom surface, and a dome that is placed on the bottom surface of the wafer and whose outer periphery is in constant contact with the fixed contacts at both ends. A push button switch has a movable contact made of a shaped leaf spring, a metal frame placed on an end surface of a side wall of the wafer, and a stem positioned at the movable contact and capable of being raised and lowered, the wafer being removed from a molding die. 1. A push button switch, characterized in that a recess is formed in the bottom surface of the wafer to which a protruding pin for separation can come into contact. (2) a wafer surrounded by side surfaces to form a bottom surface and having three fixed contacts disposed on the bottom surface; a movable contact placed on the bottom surface of the wafer and constantly in contact with the fixed contacts at both ends; a metal frame placed on the end surface of the sidewall of the wafer;
The push-button switch is located on the movable contact and has a stem that can be raised and lowered, characterized in that a recess is formed in the end face of the side wall of the wafer so that an ejection pin for separating the wafer from the mold can come into contact with it. push button switch. (3) A wafer that is surrounded by side walls to form a bottom surface and has three fixed contacts arranged on the bottom surface, and a movable wafer that is placed on the bottom surface of the wafer and whose outer peripheral edge is always in contact with the fixed contacts at both ends. A push-button switch having a contact, a metal frame placed on an end surface of the side wall of the wafer, and a stem positioned on the movable contact and capable of being raised and lowered, including a protruding pin for separating the stem from the molding die. A push button switch, characterized in that a contactable recess is formed in a flat part of the stem.