JPH0415825U - - Google Patents
Info
- Publication number
- JPH0415825U JPH0415825U JP5695590U JP5695590U JPH0415825U JP H0415825 U JPH0415825 U JP H0415825U JP 5695590 U JP5695590 U JP 5695590U JP 5695590 U JP5695590 U JP 5695590U JP H0415825 U JPH0415825 U JP H0415825U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- utility
- shaped elements
- sealing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990056955U JP2538631Y2 (ja) | 1990-05-30 | 1990-05-30 | チップ状素子ネットワークデバイス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990056955U JP2538631Y2 (ja) | 1990-05-30 | 1990-05-30 | チップ状素子ネットワークデバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415825U true JPH0415825U (US06265458-20010724-C00056.png) | 1992-02-07 |
| JP2538631Y2 JP2538631Y2 (ja) | 1997-06-18 |
Family
ID=31581241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990056955U Expired - Fee Related JP2538631Y2 (ja) | 1990-05-30 | 1990-05-30 | チップ状素子ネットワークデバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2538631Y2 (US06265458-20010724-C00056.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000306765A (ja) * | 1999-04-20 | 2000-11-02 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
| WO2013111497A1 (ja) * | 2012-01-27 | 2013-08-01 | ローム株式会社 | チップ部品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61199009U (US06265458-20010724-C00056.png) * | 1985-06-04 | 1986-12-12 | ||
| JPS6280318U (US06265458-20010724-C00056.png) * | 1985-11-09 | 1987-05-22 |
-
1990
- 1990-05-30 JP JP1990056955U patent/JP2538631Y2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61199009U (US06265458-20010724-C00056.png) * | 1985-06-04 | 1986-12-12 | ||
| JPS6280318U (US06265458-20010724-C00056.png) * | 1985-11-09 | 1987-05-22 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000306765A (ja) * | 1999-04-20 | 2000-11-02 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
| WO2013111497A1 (ja) * | 2012-01-27 | 2013-08-01 | ローム株式会社 | チップ部品 |
| JP2013232620A (ja) * | 2012-01-27 | 2013-11-14 | Rohm Co Ltd | チップ部品 |
| US9646747B2 (en) | 2012-01-27 | 2017-05-09 | Rohm Co., Ltd. | Chip component |
| US10210971B2 (en) | 2012-01-27 | 2019-02-19 | Rohm Co., Ltd. | Chip component |
| US10763016B2 (en) | 2012-01-27 | 2020-09-01 | Rohm Co., Ltd. | Method of manufacturing a chip component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2538631Y2 (ja) | 1997-06-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |