JPH04157739A - Method for positioning inspection of ic package and positioning inspection stand - Google Patents

Abstract

PURPOSE:To enable inspection positioning to be made accurately by guiding an inner surface of a taper part of a pin to an outer surface of the taper at a guide protruding part of an inspection stand in a flat-package type IC with a gull-wing type lead pin. CONSTITUTION:Guide protruding parts 212-215 of an inspection stand are equipped with a taper outer surface (skew outer surface) F. The taper outer surface F plays a role of a guide pin for placing an IC package 10 onto an inspection stand and then positioning it. When the package 10 is placed on the inspection stand, an inner surface cs of a taper part c of a lead pin P is guided to the outer surface F and finally a pin edge part d is mounted to a specified position on a measurement base surface 211a of a base part of the inspection stand. When the pin edge part d is mounted on the surface 211a, the inner surface of pin cs may, still be in contact with the outer surface F of the projecting parts 212-215 but the direction of alignment of lead pin at each side of IC is in parallel with or in nearly parallel with an edge lines L1, L2, L3, or L4 under the pin array when viewed from the top. Also, an end face ds of the edge part of each lead pin d is approximately aligned to a position of side surface S1, S2, S3, or S4 of the base part of the inspection stand 211.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for inspecting and positioning an IC package and an inspection table used for the inspection positioning.

[Conventional technology]

IC packages include flat package types, dual in-line package types, etc., but the lead pins extending from the main body of these IC packages are
In order to accurately connect the package to the board, the proper position, direction, and spacing must be maintained, and any deviations from these must be rejected as defective products.

Taking flat package type C gullwing lead pins as an example, there is a bend between the base and tip, the tip is floating, the tip is twisted, the pitch is abnormal, the length is uneven or broken, and several pins are diagonal in the same direction. An abnormality such as crab legs that are elongated is considered.

The same applies to other types of IC packages.

Detecting abnormalities in these REIT pins has been done through visual inspection using a tool microscope or inspection using jigs, but recently, as the number of pins has been increasing, measurement and inspection using image processing have begun to be carried out. There is.

An IC lead pin inspection device for this purpose generally includes an inspection table on which an IC package to be inspected is placed, an image input device including a camera device for photographing the lead pins of the IC package placed on the inspection table, and The apparatus is equipped with an image processing device that performs predetermined image processing in response to image input and outputs inspection results.

The inspection table usually has a support protrusion on its upper end plane, on which the lower surface of the main body of the IC package to be inspected is placed.

In addition, prior to this, positioning is performed to place the IC to be tested at the correct testing position on the testing table.

This positioning can be done by using a positioning means to determine the front, rear, left and right positions with reference to the side surface m2 of the main body of the IC package (see Figure 5), or by using a jig having a rectangular recess whose inner circumferential side surface is sloped like a forest. The IC package is dropped into the recess and positioned in the front, back, left and right directions, and then the IC package is held by a canter such as a vacuum suction type that moves along a predetermined route, and the IC package is moved to the examination table support protrusion. Place it on. Vertical positioning is performed using the support protrusion based on the lower surface ml of the package body a (FIG. 5).

(Problem to be Solved by the Invention) However, the IC package body is generally covered with a synthetic resin molded body, and the lower surface ml and the side surface m2
has errors with respect to predetermined conditions and dimensions, and therefore positioning based on these results in lower accuracy.

In addition, with the method of dropping the IC package into the recess of the jig, the condition of the lead pin tip may be uneven.
This also reduces positioning accuracy.

Note that unevenness appears at the tips of the lead pins in the IC package manufacturing process, where the IC chip is connected to the lead frame, wrapped in a synthetic resin molding, dam cut and lead pin bending processes are performed, and then the lead pins are removed. This is because when cutting the tip, the parts other than the lead pin end are firmly held by a precision mold, but the pin end is left free.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for more accurately inspecting and positioning a flat package IC having a gull-wing type lead pin than before, and a positioning inspection table for use in carrying out the method.

[Means for Solving the Problems] The present invention provides a portion of a gull wing lead pin of a flat package type IC that protrudes laterally from the package body, and a tapered portion that extends diagonally from the protruding portion to intersect with the portion. The present invention was completed by noting that the protruding portion and the tapered portion of the pin end portion extending in the lateral direction from the tapered portion can be formed with relatively high accuracy.

That is, the present invention provides a curve comprising a portion projecting laterally from the IC package body, a tapered portion extending obliquely from the projecting portion in a direction intersecting the portion, and a pin end portion projecting from the tapered portion in the horizontal direction again. An IC package inspection positioning method for inspecting a flat package type IC having wing-shaped lead pins, the method comprising:
A method characterized by guiding and positioning an inner surface of a tapered portion of a Riet pin, a portion protruding laterally from an IC package body, a tapered portion extending obliquely from the protruding portion in a direction intersecting the portion, and the tapered portion. An IC package positioning/inspection stand for inspecting lead pins of a flat package IC having gull-wing lead pins comprising pin ends protruding laterally from the IC package, the IC package positioning/inspection table having a flat upper surface, and having a flat upper surface; The present invention provides an inspection table characterized in that the flat upper surface is provided with a guide protrusion having a tapered outer surface that guides the inner surface of the tapered portion of the lead pin.

[Function] According to the method and inspection table of the present invention, a flat package IC having a gullwing lead pin is positioned by the inner surface of the tapered portion of the pin being guided by the tapered outer surface of the guide protrusion of the inspection table.

In the positioned state, depending on the height and arrangement of the guide protrusion, the condition of the lead pin, etc., the lead pin may be floating in the air, or the lead pin may be on a flat surface after being guided. It will be done.

(Example) Hereinafter, an example of the method of the present invention will be described with reference to the drawings together with an example of an image input device having an examination table used to implement the method.

FIG. 1 shows an IC handler 1 in a c tester, which is already known in itself and which inputs signals to an IC to test whether the IC is good or bad, an image input device 2 detachably attached to the IC handler 1, and the device. an image processing/measuring device 6 connected to 2;
A display device (CRT in this example) 7 connected to the device 6;
FIG. 2 is a side view of a recording device (in this example, a printer) 8 that records test results.

FIG. 2 is a plan view of the image input device 2 shown in FIG. 1.

The IC handler 1 places a test object I on a test table 21, which will be described later.
ICs can be placed thereon, or inspected ICs can be received from the stand.

As a specific example, a tray 11 on which a plurality of flat package type ICs having gull-wing type lead pins are placed side by side, an elevating table 12.12 that supports a good IC receiving tray 11a and a defective IC receiving tray llb.
a, 12b, Bgy- A frame 13 that can reciprocate horizontally in one direction X above the bull, a catcher support member 14 that can reciprocate above the frame in a horizontal direction Y perpendicular to the direction X, and a vacuum suction holding member provided on the member 14. Formula IC catcher-15,
A rotatable IC support arm 16 arranged outside the table 12b, a pair of vacuum suction holding type ICs facing the arm 16
It is equipped with catchers 17a, 17b. A pair of catchers 17a and 17b are provided at both ends of an arm 171 that is rotatable in a horizontal plane by a driving means (not shown).

The jC catchers 15, 17a, and 17b can be moved up and down by a drive means (not shown), and are connected to a vacuum suction means (not shown). The IC support arm 16 is rotatably driven in a horizontal plane by a drive means (not shown), and has IC support surfaces 161 and 162 at both ends.

The IC support arm 16 is arranged below the arm 171, and the circular motion locus of the IC support surface of the arm 16 overlaps the zero circular motion locus of the catcher on the arm 171 at one point.

The support arm 16 is in a position where one support surface 161 or 162 can receive and pass the IC to the catcher 15, and at the same time, the other support surface 162 or 161 is in a position where it can receive and pass the IC to the catcher 15.
7a or 17b and the IC receiver can be rotated to a position where they can be transferred. Further, the arm 171 is placed in a position where one catcher 17a or 17b can receive and pass the IC to the support surface 161 or 162 of the arm 16, and at the same time, the other catcher 17b or 17a is used for inspection of the image input device 2, which will be described later. The stand 21 and the IC receiver can be rotated so that they are placed in a position where they can be transferred.

This handler 1 operates as follows.

Movement of frame 13 in X direction, catcher support member 14
By the combination of the movements in the Y direction, the catcher 15 on the member 14 moves above the target flat package IC to be inspected in the tray 11 on the table 12.

Subsequently, the catcher 15 descends to suck and hold the IC, and then rises. Subsequently, the catcher is moved by the combined movement of the frame 13 and the support member 14 in the X and Y directions.
15 is one IC support surface 161 on the IC support arm 16
Place the IC on. After that, Catcher-15 rose,
Prepare for the next IC transfer.

On the other hand, the arm 16 rotates and places the supported IC under the two catchers 17a. Thus catcher 1
7a slopes downward, attracts and holds the IC, and rises. Thereafter, the catcher support arm 171 rotates and the IC is placed above the inspection table 21. At this point, the catcher 17a descends and places the IC on the inspection table. After that, the catcher 17a rises.

During this time, the other support surface 162 of the IC support arm 16
The next IC from the catcher 15 is placed on top, and by rotation of the arm 16, it is placed under another catcher 17b and held by the catcher.

When the inspection of the IC on the inspection table 21 is completed, the catcher
17a holds this, and arm 171 rotates. The IC thus held by the catcher 17b faces the inspection table 21, on which the next IC is placed.

The inspected IC held by the catcher 17a is placed on the support arm 16, and from there, it is held by the catcher 15 and placed on the good product tray Ila or the defective product tray Ilb.

Thereafter, the catcher I5 places the next IC to be tested on the free support surface on the support arm 16, and places the IC on the catcher.
17a is held and prepared for the next inspection.

By repeating the above operations, the ICs to be tested are sequentially placed on the test table 2.
The inspected ICs are placed on the tray 11a or ll.
It is stored in b.

The handler 1 is a commercially available IC tester, and the image input device 2 is attached after a part of the tester (not shown) is removed from the IC tester, and has approximately the same outer diameter as that part of the tester. , compatible.

This apparatus 2 includes an inspection stage 2o, on which an inspection table 21 is removably disposed.

The inspection table 21 is a catcher 17a of the handler 1.
Alternatively, the IC held by 17b can be placed on the inspection table 21 by lowering the catcher, or the rc on the inspection table can be picked up by the catcher 7.

As shown in FIG. 3, the inspection table 21 includes a base 211 and an IC guide protrusion 212.21 erected at a predetermined position on the base 211.
3.214.215.

The base 211 is rectangular in plan view, and the upper end surface is a flat measurement base surface 211a, and the four edge lines L1 to L
It has 4.

The protrusions 212 to 215 are parallel to the edges L1 to L4, respectively, and are all formed at the same height. The surface color is entirely black.

By the way, as shown in FIGS. 4 and 5, the IC package 10 to be inspected has, for example, a protruding portion b that protrudes laterally from a rectangular IC package main body a, and a protruding portion b that intersects with this portion from the rectangular IC package body a. A plurality of gullwing-shaped lead pins P are provided on each side of the main body a, each consisting of a tapered portion C extending obliquely to the main body a and a pin end portion d extending from the portion C in the lateral direction.

Each of the guide protrusions 212 to 215 of the inspection table has a tapered outer surface (slanted outer surface) F.

The tapered outer surface F is, as shown by the two-dot chain line in FIG.
It serves as a guide when positioning the C package 10 on the inspection table.

That is, when placing the package 10 on the inspection table,
The inner surface cs of the tapered portion C of the lead pin P is guided by the outer surface F, and finally the pin end d rests on a predetermined position on the measurement base surface 211a of the inspection table base.

Fig. 5 shows a state in which the outer surface F is still in contact with the inner surface CS of the lead pin even when the lead pin is mounted in this manner.
In reality, when the pin end d rests on the surface 211a as described above, the pin inner surface cs is separated from each of the one or more outer surfaces F of the guide protrusion.

However, when the pin end d rests on the surface 211a, the pin inner surface cs may still be in contact with the outer surface F of the projections 212 to 215, but in any case, the pin P is
Try to get on 11a.

Further, the positions of the projections 212 to 215 on the surface 211a are determined in advance so that the pin end portion d rests on the surface 211a in this manner.

In this supported state, each side of the IC has a -F
The direction in which the pins are arranged is the edge line Ll below the pin row when viewed from above.
It becomes parallel or substantially parallel to L2, L3 or L4. Further, the end surface ds of each doped pin end portion d in each pin row is approximately aligned with the position of the side surface S1, S2, S3, or S4 of the inspection table base 211.

This IC supporting method is based on the conventional IC supporting method that uses the lower surface m1 and side surface m2 of the synthetic resin molded body M of the IC package body a as a reference.
Inspection positioning method, T
Compared to the method of positioning by dropping the IC, more accurate IC inspection positioning can be performed.

This is because the lower surface m1 and side surface m2 of the molded object M may be deformed or uneven due to molding defects, and the method of dropping the IC lead pin into the jig recess may have variations in positioning due to uneven lengths of IC lead pins, etc. Get out. On the other hand, the protruding portion of the lead pin P and the tapered portion C following it have relatively little variation and are manufactured with high precision.

Although the guide protrusions 212 to 215 are separately erected, they may be formed integrally.

Although not adopted in this example, on the upper surface of the examination table base 211, two guide protrusions having a tapered outer surface F as described above are provided in parallel, and a second guide protrusion is provided at right angles to these.
The IC is positioned in the front-back or left-right direction by guiding the inner surface cs of the tapered portion of the IC lead pin to the protrusion and placing the pin on the upper surface of the base, and then the above-mentioned Final positioning can also be performed by moving the IC to a stopper.

It is also conceivable to provide a stand having a guide protrusion as described above on the flat top surface separately from the inspection table and use this stand as a stand exclusively for positioning. In this case, the tapered inner surface CS of the lead pin may be supported by the tapered outer surface F of the protrusion so that the lead pin is suspended in the air.
It may be supported as follows.

Now, an inspection mark is attached to the side surface of the base 211 of the inspection table 21.

In other words, marks n1, n are formed at predetermined intervals in the direction of the edge line at the upper end of each of the side surface S1 including the edge line L1 and the side surface S3 including the edge line L3 opposing thereto.
2 and n3 are attached, and a mark n4 is attached at the center of the upper end of the side surface S2 including the edge line L2 and the opposite side surface S4 including the edge line L4. Each mark is white or metallic so that it shines better under lighting.

The role of these marks will be explained later.

Returning again to FIGS. 1 and 2.

A total of four camera devices 31 to 34 are arranged to face each edge line of the inspection table 21 at right angles.

Each camera device is equipped with an optical system including a lens and a camera, and the contact part (in this example, pin end d) of the IC lead pin on the inspection table 21 is mounted on the outside of the doped pin and the edge of the inspection table. can be photographed.

Each camera device can reciprocate along a guide rail 35 laid on the top surface of the stage 20 in the direction of the opposing inspection table edge line. This rail 35 and various parts such as a motor which will be described next constitute an interlocking mechanism 30 of the camera device.

A motor 36 is provided on the lower surface of the stage 20, and a threaded rod 361 that is rotated forward and backward by the motor 36 is connected to one camera device 3.
1. It is screwed into and penetrates a female threaded portion 362 on the lower surface. This female screw portion passes through the elongated hole 201 of the stage. Therefore,
Due to the operation of the motor 36, the camera device 31 moves to the rail 35.
is driven back and forth along the

A rod 311 extends from the female threaded portion 362 toward below the center of the stage.

A slider 321.331.341 is provided on the lower surface of the camera device 32.33.34 and extends downward through the stage elongated hole 202.203.204. .332.342
is extending. Each slider slides along a guide rod 300.

Two rotatable disks 37 are installed on the bottom surface of the stage, and pins 381, 382, 383, 384 are mounted on the top surface of the disks.
is erected. A rod 31 extending from the camera device
1,322,332,342 are in contact with these pins, and tension springs 391,392,393,394 are stretched between the disc 37 and each rod, respectively. The spring pulls on the disc 37 to keep the pin in constant contact with the loft.

Therefore, when the camera device 31 is moved in the direction of the arrow T1 in FIG.
pulls the rod 322, 332, 342 to move the camera device 32, 33, 34 by the same amount as the camera device 31 T2,
Move in the T3 and T4 directions.

When the camera device 31 is returned in the direction opposite to T1, circles vi, 3
7 is pulled back by the spring 391, causing the pins 382 to 384 to push the rods 322 to 342, causing the other camera devices to move in the opposite direction by the same amount.

Note that the lots 311 to 342 may have a bifurcated shape sandwiching the pins on the circular plate 37. Moreover, the camera device 31~
34 can be supported by the guide rails 35, the sliders 321 to 341 on the bottom surface of the camera device, the lower part 300 that guides them, and the stage slots 202 to 204 through which the sliders pass may be omitted. 36, Z joint 361, female screw part 362 are stage 20
It may be placed on top.

The interlocking mechanism 30 is as described above.

A light source section 41, 42, 43, 44 including a halogen lamp is provided at one corner of the stage 20, and the tips of optical fibers 51, 52, 53, 54 extending from these light source sections are attached to corresponding camera devices. has been done.

According to the image input device 2 described above, each camera device is initially placed at an initial position by the interlocking mechanism 30. Then, all the lamps of the light source sections 41 to 44 are turned on. In this example, these lamps are all turned on during the inspection period in order to avoid premature deterioration of the lamps and fluctuations in light intensity due to repeated on-off operations.

Among the sides of the IC 10 to be tested positioned on the inspection table 21, the lead pins P on the side facing the first camera 31
is first photographed by the camera device. During this photographing, the lead pin is illuminated by the optical fiber 51.

Among the group of lead pins P, several to several dozen lead pins including the endmost pin PI are photographed at once by the camera device 31. At this time, the edge line L1 of the inspection table base and the inspection marks nl and n2 on the side surface S1 are also photographed at the same time.

The image obtained in this way is input to the image processing/measuring device 6 connected to the image input device 2, and is also displayed on the CRT 7 connected to the device 6. At this time, the screen of the CRT 7 is approximately As shown in Figure 6.

As can be seen from this figure, one or more pins P3 after mark n2 are not inspected at this point.
etc. were also photographed at the same time.

After the necessary processing in the image processing/measuring device 6 based on the input image is completed, each camera device remains stationary, and then the 10-sided Leet pin P facing the second camera device 32 is moved by the device 32. Being photographed.

At this time, the edge line L2 of the examination table base and the mark n4 on the side surface S2 are photographed together with all the glue pins including the pin P5 located on one side of the mark n4. For this photographing, the Liet pin is illuminated with an optical fiber 52.

The image thus obtained is input to the image processing/measuring device 6 and also displayed on the CRT 7.

At this time, the screen of the CRT 7 is approximately as shown in FIG. As can be seen from this figure, one or more pins P6 on the opposite side of mark n4, which are not inspected at this point,
etc. will also be photographed at the same time.

After the necessary processing in the device 6 based on the input image is completed, each camera device remains stationary, and then the third camera device 33 lights up the camera under the illumination of the optical fiber 53. A part of the glue-doped pin on the 10 sides facing the apparatus is photographed together with the examination table base edge line L3 and the mark nLn2 on the side surface S3, similarly to the photograph taken by the first camera device 41, and is input into the image processing/measuring device 6. , displayed on the CRT7.

Furthermore, after that, while each camera device remains stationary, a portion of the glued pin on the IC side facing the camera device is exposed to the second
In the same way as photographing with a camera device, the inspection table base edge line L
4 and mark n4 on side S4, device 6
and displayed on the CRT 7.

In addition, when photographing the lead pin with each camera device,
The guide protrusions other than the guide protrusion of the examination table on which the lead pin to be photographed is placed block a portion of the light incident from behind the lead pin, making the photographing easier and more accurate.

Now, when the series of photographing and image input is completed in this way, the camera devices 31 to 34 are operated under the operation of the interlocking mechanism 30.
is moved by a certain amount in the directions of arrows T1 to T4 in FIG.

After that, first, with the first camera device 31, the remaining portions P3 to P4 of the glue-doped pins on the IC side opposite to this are connected to the edge line L.
1, marks n2 and n3 are photographed, and the image is input to the image processing/measuring device 6 and displayed on the CRT 7. At this time, the CRT display screen is approximately as shown in FIG.

Subsequently, the second camera device 32 detects the I
The rest of the lead pin on side C is on edge line 2, mark n4
The image is then input to the device 6 and displayed on the CRT 7.

At this time, the CRT screen is approximately as shown in FIG.

Furthermore, the third camera device 33 detects the remaining lead pins on the opposite IC side, the edge line L3, the mark n2,
n3 is photographed in the same manner as the first camera device, and the image is input to the device 6 and displayed on the CRT 7.

Subsequently, the fourth camera device 34 photographs the remaining lead pins, edge line L4, and mark n4 on the opposite IC side in the same manner as the second camera device, and the image is input to the device 6. Displayed on CRT7.

With the above steps, all glue-dopin image input is completed, but
After that, each camera device is returned to its initial position by the interlocking mechanism 30 in preparation for the next inspection.

During the above image input operation, the ICl0 to be inspected remains stationary on the inspection table 21, so there is no displacement of the IC position due to acceleration, vibration, etc. that occurs when the inspection table is moved, and the lead pins are accurate without variations. The accuracy of lead pin inspection can be improved by taking pictures.

Note that the lighting devices 41 to 44 of the image input device 2 are
It may be replaced with the one shown in Figure 3. The lighting device shown in FIG. 13 saves power and simplifies the device, and employs one light source section 40.

All of the four optical fibers 51 to 54 mentioned above are connected to this light source section 40. The light source section 40 is provided with a halogen lamp 401, which is turned on at all times during the inspection period, and a switching device 40A sequentially switches and conducts light to the optical fiber used for illuminating the lead pins. Switching device 40
In A, a perforated shutter 402 is connected to a transmission part 403 for optical fibers 51 to 54 gathered at equal intervals on one virtual circle.
The shutter 402 can be rotated by a motor 404 through the required angle, so that the holes 402a of the shutter 402 sequentially face the end face of the optical fiber.
conduct light.

Now, in the case of this example, the image processing/measuring device 6 uses the image input from the device 2 in a multivalued state for measurement. Of course,
The device 6 may be one that performs binarization processing on the input image.

In this example, in order to inspect the lifting of the pin end d of each lead pin P, the image processing/measuring device 6 performs an inspection on a plurality of lead pins P photographed at the same time by each camera device. Window processing is performed based on the mark, and for each pin end d in the window,
The pin end d and the inspection table base edge lines L1 and L2 below it
, L3 or L4, and if the value exceeds a predetermined dark value, it is determined to be defective, and if it is within the dark value, it is determined to be good, and the handler 1 is instructed to that effect.

The measurement results are printed out by the printer 8.

For example, the image input by the first camera device 31 is
In the case shown in the figure, the positions of marks n1 and n2 are determined based on the shape of the marks stored in advance in the device 6, and the positions of marks n1 and n2 are determined from the endmost pin Pi starting from the mark n1 side using the marks as a reference. A window W1 is placed over the pin P2 up to this side of the mark n2, and each pin end d within the window is inspected for floating.

In this case, the position of each pin end and the measurement reference point at the end (in this example, the lower front edge of the pin end) are determined based on the rectangular end surface ds shape of the pin end d stored in advance in the device 6. It will be done.

Further, when the image inputted by the first camera device 31 is shown in FIG. 8, the positions of marks n2 and n3 are determined, and based on the marks, the position is moved from the pin P3 starting from the mark n2 side to the mark n3. A window W2 is hung up to the pin P4 in front of the window W2, and each pin end within the window is inspected for floating.

Images input by the third camera device 33 are also processed in the same way.

Also, the image inputted to the second camera device 32Q is the seventh
If it is as shown in the figure, find the position of mark n4,
Using the mark as a reference, a window W3 is placed over the pin P5, etc. on one side of the mark, and each pin end within the window is inspected for floating.

When the image inputted by the second camera device 32 is the one shown in the ninth time, the position of the mark n4 is determined, and using the mark as a reference, the window W4 is placed on the pin P6, etc. on the opposite side.
and float test each pin end within the window.

The image input by the fourth camera device 34 is similarly processed.

When inspecting multiple leet pins by moving the camera device, in order to ensure that all glued pins are inspected, some of the leet pins photographed when the camera device is in the same position are taken by the camera. Overlapping imaging is also required when moving the device to the next position and performing a second imaging, but when imaging is performed in this way, it is difficult to determine which pins among the lead pins captured by the second imaging have been inspected. It is unclear whether this is the case.

However, as in this example, by attaching an inspection mark to the inspection table 21, it is possible to inspect the REET pins within a certain frame based on the mark, so the same REET pin can be inspected twice. No inspections or omissions will occur.

Further, in this example, since the LEET pin is placed directly on the flat upper surface of the inspection table 21, the edge line of the upper surface of the inspection table can be used as the measurement base edge line.

The top surface 211a of the inspection table can be considered in the same way as the surface of a substrate on which an IC is mounted.

When an IC package is actually placed on the board surface, the I
It is thought that C is supported by at least three lead pins protruding most downwardly, with the other pins floating above the substrate surface. When the IC package is placed on the top flat surface of the inspection table, a condition substantially the same as this actually occurring condition appears, and lead pin floating inspection can be performed more accurately by image processing.

By the way, when the measurement base edge line of the inspection table is used as the measurement standard, if the edge line is too rough, the inspection accuracy will decrease accordingly.

Furthermore, in order to measure the lift of the lead pin end with respect to the measurement base edge line, it is necessary to illuminate both the base edge line and the pin end at the same time, but it may be difficult to adjust the position of the light source for this purpose.

To solve this problem, two points on the base edge line may be selected and a virtual edge line connecting the image points may be used as the measurement standard.

That is, for example, C captured by the camera device 31
To explain the case where the RT screen is the same as that shown in FIG. 6 and shown in No. 101k as a typical example, first, as mentioned above, the window W1 is provided, and the pins P1 and P2 at both ends of the glued pins in the window are set. Starting from the inner pin, search for pin ends where the distance between adjacent pin ends d and d is at least a predetermined distance, and find the inspection table base edge line below q1 and q2 between such pin ends. Find points Q1 and Q2 on Ll, memorize the virtual measurement baseline l connecting these two points as a measurement standard, then shine the pin ends well, and connect each pin end d to this line! Inspect pin floating from a distance.

By processing in this way, the floating test becomes more accurate. Obtaining a virtual baseline in this manner is convenient not only when handling multivalued images but also when performing binarization processing on input images.

When performing this processing, the image processing/measuring device 6 is provided with such a processing function.

The lead pin floating test described above can also be applied to the J-type adhesive pin floating test.

The image input device 2 can also be used to inspect the bending of ICIJ-dopin. This will be explained next.

That is, as mentioned above, the protruding portion of the lead pin P and the tapered portion C that follows it are manufactured with relatively little variation and precision, so that the protruding portion and the tapered portion C that follow the lead pin P are manufactured at predetermined positions on the continuous bent portion e and the pin. Each predetermined position on the end d is taken as a measurement point, these measurement points are photographed with a camera device 31, 32, 33 or 34, and the image is input to an image processing/measuring device. Bending of the lead pin is detected by determining the distance between fixed points on both sides.

To give one example, as shown in FIG.
The center point R1 of the bent part e and the center point R2 of the upper edge of the end face ds of the pin are taken as measurement points, and the lead pins on each side of the IC are placed so that these measurement points are captured in the same manner as in the lead pin floating test. Sequentially shoot multiple images and process the images.
The input is input to a measuring device 6, and in the device 6, the distance between the two points is sequentially measured for each lead pin. If the measured value exceeds a predetermined threshold value, it is determined to be a defective IC, and if it is within the dark value, it is determined to be a good product. IC. This good/bad condition is notified to the handler 1.

In addition, images taken by the camera device are displayed on the CRT 7,
The calculation results are printed out using the printer 8.

In the case of this inspection, each camera device has a deep depth of focus so that both fixed points can be photographed simultaneously.

Also, of course, the image processing/measuring device 6 is provided with a function to perform the above processing.

In the conventional glued pin bending test, for example, the measurement point b1 and the pin end d on the protruding part of the lead pin shown in FIG.
While two camera devices were required to photograph each of the upper measurement points d1 from above, only one camera device is sufficient, so the image input device can be made smaller, simpler, and provided at a lower cost.

Of course, each of the camera devices 31 to 34 of the image input device 2 may be replaced with a set of two camera devices as in the prior art in order to inspect lead pin bending.

In addition, as a method of simultaneously photographing two measurement points on the ICC lead pin for bending inspection, as shown in Fig. It is conceivable to arrange one camera device CA with a deep depth of focus on the perpendicular line and simultaneously photograph points b1 and dl with this camera device. In order to inspect lead pin bending, it is also conceivable to replace each of the camera devices 31 to 34 in the image input device 2 with such an inclined camera device CA.

[Effects of the Invention] As explained above, according to the present invention, the positioning for inspection of a flat package type IC having gull wing lead pins can be performed more accurately than before by utilizing the relatively accurate inner surface of the lead pin taper portion. A method and a positioning test stand for use in carrying out the method can be provided.

[Brief explanation of drawings]

The drawings are for explaining the present invention in detail, and FIG. 1 shows an IC handler, an image input device, an image processing/measuring device,
2 is a side view of a display device and a recording device, FIG. 2 is a plan view of an image input device, FIG. 3 is a perspective view of an example of an inspection table according to the present invention, and FIG. 4 is a plan view of a flat package IC. 5
The figure is a side view of the same IC, and Figures 6 to 9 are display devices (CRTs) taken by camera equipment to photograph the IC package.
A diagram showing an example of a screen, FIG. 10 is a diagram showing how to determine a virtual measurement baseline, FIG. 11 is an explanatory diagram of a beam-dopin bending test, FIG. 12 is an explanatory diagram of another example of a beam-dopin bending test, and FIG. 13 is a diagram showing an example of a beam-dopin bending test. The figure is a schematic perspective view of another example of the lighting device. 1...IC handler 2...Image input device 21...Inspection table 211...Inspection table base 211a...Base top surface 212-215...Guide protrusion F...Guide protrusion tapered outer surface 81-S4... Base side surface L1-L4... Measurement base edge line n1-n4... Inspection mark 20... Inspection stage 201-204... Stage long hole 31-34... Camera device 41-44...Light source parts 51-54...Optical fiber 30...Interlocking mechanism 321.331.341...Slider 322.332
．． 342...Rods 381-384...Pins 391-394...Sub link 37...Disk 35...Guide rail 36...Motor 361...Screw stud 362...Female thread part 300 ...Guide rod...Image processing/measuring device 7...CRT 8...Printer W1 to W4...Window q/1, q2...Pin end gap Ql, Q2...Measurement base Point on the edge line 7!・・・
・Virtual measurement baseline 10...IC package P...Lead pin Pi-R6...Lead pin M...Synthetic resin molded body a...tC Package body b...Protruding portion C...Tapered portion c"s...Tapered part inner surface d...Pin end ds...Pin end end surface e...Bending portions R1, R2...Lead pin bending measurement point CA...Camera device bl... Measurement point dl on the protruding part...Measurement point f on the pin end d...Line g connecting bl and dl...Midpoint h between bl and 61...Perpendicular line 40 to line f ...Lighting device 40A...Switching device 401...Light source 402...Shutter 402a...Hole 403...Transmission part 404...Motor

Claims (2)

[Claims] (1) A portion that protrudes laterally from the IC package body;
For inspecting the lead pin of a flat package type IC having a gull wing type lead pin comprising a tapered part extending diagonally from the protruding part in a direction crossing the part, and a pin end part protruding from the tapered part in the lateral direction again. A method for inspecting and positioning an IC package, the method comprising positioning by guiding the inner surface of a tapered portion of the IC lead pin. (2) A portion that protrudes laterally from the IC package body;
For inspecting the lead pin of a flat package type IC having a gull wing type lead pin comprising a tapered part extending diagonally from the protruding part in a direction crossing the part, and a pin end part protruding from the tapered part in the lateral direction again. An inspection stand for positioning an IC package, characterized in that the flat upper surface is provided with a guide protrusion having a tapered outer surface for guiding the inner surface of the tapered portion of the IC lead pin. .