JPH04157744A - Method for measuring floating of lead pin of flat-package type ic - Google Patents

Method for measuring floating of lead pin of flat-package type ic

Info

Publication number
JPH04157744A
JPH04157744A JP28232390A JP28232390A JPH04157744A JP H04157744 A JPH04157744 A JP H04157744A JP 28232390 A JP28232390 A JP 28232390A JP 28232390 A JP28232390 A JP 28232390A JP H04157744 A JPH04157744 A JP H04157744A
Authority
JP
Japan
Prior art keywords
lead pin
shot
flat
package
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28232390A
Other languages
Japanese (ja)
Inventor
Kiyomune Ooba
Kimiharu Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMU AI TEKUNOROJII KK
M I TECHNOL KK
MI TECH KK
Original Assignee
EMU AI TEKUNOROJII KK
M I TECHNOL KK
MI TECH KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EMU AI TEKUNOROJII KK, M I TECHNOL KK, MI TECH KK filed Critical EMU AI TEKUNOROJII KK
Priority to JP28232390A priority Critical patent/JPH04157744A/en
Publication of JPH04157744A publication Critical patent/JPH04157744A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To enable accuracy to be improved by measuring floating of each lead pin of an IC package for a measurement base edge line while the IC package is placed on a substrate surface or in a state similar to it.
CONSTITUTION: A lead pin P at a side toward a first camera 31 out of each side of an IC to be inspected 10 which is placed and positioned on an inspection stand 21 is first shot by a camera device. A lead pin is illuminated by an optical fiber 51 for shooting First, several or several tens of pins including an edge pin P1 are shot at the same time. In this case, an edge line L1 of a base part of the inspection stand and marks n1 and n2 for inspection of a side surface S1 are shot simultaneously. The obtained image is fed to an image processing and measuring device 6 which is connected to an image input device 2 and is displayed on a CRT 7 which is connected to the device 6. Then, the lead pin P at the IC side opposing the second camera device 32 is shot by a device 3. The lead pin is illuminated by an optical fiber 52 for this shooting.
COPYRIGHT: (C)1992,JPO&Japio
JP28232390A 1990-10-20 1990-10-20 Method for measuring floating of lead pin of flat-package type ic Pending JPH04157744A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28232390A JPH04157744A (en) 1990-10-20 1990-10-20 Method for measuring floating of lead pin of flat-package type ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28232390A JPH04157744A (en) 1990-10-20 1990-10-20 Method for measuring floating of lead pin of flat-package type ic

Publications (1)

Publication Number Publication Date
JPH04157744A true JPH04157744A (en) 1992-05-29

Family

ID=17650920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28232390A Pending JPH04157744A (en) 1990-10-20 1990-10-20 Method for measuring floating of lead pin of flat-package type ic

Country Status (1)

Country Link
JP (1) JPH04157744A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62274205A (en) * 1986-05-23 1987-11-28 Hitachi Tokyo Electron Co Ltd Method and device for inspecting lead flatness

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62274205A (en) * 1986-05-23 1987-11-28 Hitachi Tokyo Electron Co Ltd Method and device for inspecting lead flatness

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