JPH0415261U - - Google Patents
Info
- Publication number
- JPH0415261U JPH0415261U JP5546790U JP5546790U JPH0415261U JP H0415261 U JPH0415261 U JP H0415261U JP 5546790 U JP5546790 U JP 5546790U JP 5546790 U JP5546790 U JP 5546790U JP H0415261 U JPH0415261 U JP H0415261U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- high frequency
- face
- holes
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Waveguides (AREA)
Description
第１図ａは本考案の一実施例の斜視図、同図ｂ
は同上の正面図、第２図ａは従来例の斜視図、同
図ｂは同上の正面図である。
１０，２０は高周波回路基板、１１，２１は回
路パターン面、１２，２２はグランド面、３０は
金属ジヤンパー、３１〜３４は貫通孔、４０は半
田、４１，４２は切込部、５１〜５４はランドで
ある。
Figure 1a is a perspective view of an embodiment of the present invention, Figure 1b
2A is a front view of the same as above, FIG. 2A is a perspective view of the conventional example, and FIG. 2B is a front view of the same. 10 and 20 are high frequency circuit boards, 11 and 21 are circuit pattern surfaces, 12 and 22 are ground planes, 30 are metal jumpers, 31 to 34 are through holes, 40 are solder, 41 and 42 are notches, 51 to 54 is Rand.
Claims (1)
る第１及び第２の高周波回路基板をグランド面が
相対向するように配置し、 第１の高周波回路基板は、第１の貫通孔と、第
１の貫通孔に隣接する第２の貫通孔と、第２の貫
通孔に隣接する第１の切込部とを備え、 第２の高周波回路基板は、第１の貫通孔に対向
するように配置された第２の切込部と、第２の貫
通孔に対向するように配置された第３の貫通孔と
、第１の切込部に対向するように配置された第４
の貫通孔とを備え、 第１乃至第４の貫通孔は回路パターン面側に半
田付けのためのランドを備え、 第１の貫通孔から第２の貫通孔、第３の貫通孔
を経て第４の貫通孔に至る経路に沿つて配置され
た金属ジヤンパーを、第１及び第４の貫通孔のグ
ランド面側と第１乃至第４の貫通孔のランドに半
田付けしたことを特徴とする高周波回路。[Claims for Utility Model Registration] First and second high frequency circuit boards having a circuit pattern surface on one side and a ground surface on the other side are arranged so that the ground surfaces face each other, and the first high frequency circuit board is The second high frequency circuit board includes a first through hole, a second through hole adjacent to the first through hole, and a first notch adjacent to the second through hole. a second notch disposed to face the through hole; a third through hole disposed to face the second through hole; and a third through hole so as to face the first notch. The fourth placed
The first through fourth through holes are provided with lands for soldering on the circuit pattern surface side, and the first through hole passes through the second through hole, the third through hole, and the third through hole. A high frequency device characterized in that a metal jumper arranged along the path leading to the fourth through hole is soldered to the ground surface side of the first and fourth through holes and the lands of the first to fourth through holes. circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5546790U JPH0415261U (en) | 1990-05-28 | 1990-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5546790U JPH0415261U (en) | 1990-05-28 | 1990-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415261U true JPH0415261U (en) | 1992-02-06 |
Family
ID=31578445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5546790U Pending JPH0415261U (en) | 1990-05-28 | 1990-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415261U (en) |
-
1990
- 1990-05-28 JP JP5546790U patent/JPH0415261U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6166993U (en) | ||
| JPH0415261U (en) | ||
| JPH0459931U (en) | ||
| JPS6035596U (en) | Shield cover mounting structure | |
| JPS59180470U (en) | Printed circuit board connection structure | |
| JPS59195767U (en) | Pattern shape of printed wiring board | |
| JPS62116578U (en) | ||
| JPS58122477U (en) | board equipment | |
| JPH048466U (en) | ||
| JPS609257U (en) | Printed board | |
| JPS6219776U (en) | ||
| JPS61188380U (en) | ||
| JPS59158353U (en) | printed wiring board | |
| JPS6078166U (en) | Double-sided printed wiring structure | |
| JPH028078U (en) | ||
| JPH033773U (en) | ||
| JPS5885378U (en) | printed wiring board | |
| JPS62170670U (en) | ||
| JPS59185873U (en) | printed wiring structure | |
| JPS6429867U (en) | ||
| JPS5895673U (en) | printed wiring board | |
| JPH02769U (en) | ||
| JPS62192661U (en) | ||
| JPS59101460U (en) | Grounding structure of electronic components | |
| JPS6142879U (en) | Printed board |