JPH041506U - Optical link - Google Patents
Optical linkInfo
- Publication number
- JPH041506U JPH041506U JP1990041504U JP4150490U JPH041506U JP H041506 U JPH041506 U JP H041506U JP 1990041504 U JP1990041504 U JP 1990041504U JP 4150490 U JP4150490 U JP 4150490U JP H041506 U JPH041506 U JP H041506U
- Authority
- JP
- Japan
- Prior art keywords
- light
- optical link
- inner molded
- molded parts
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims description 8
- 230000037431 insertion Effects 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 2
- 239000013307 optical fiber Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Optical Couplings Of Light Guides (AREA)
Description
第1図は本考案による光リンクの一実施例を示
す斜視図、第2図、第3図および第4図は光リン
クにおけるインナー成形部およびケーブル差込部
の部分を示す側断面図、正面図および斜視図、第
5図は光リンクにおけるインナー成形部、ケーブ
ル差込部の部分の他の構成例を示す平面図である
。 1……インナー成形部、2……ケーブル差込部
、3……アウター成形部、4……発光素子、5…
…受光素子、6……リードフレーム、7……光フ
アイバケーブル、8……挿入孔、13,13′…
…しや光部。
す斜視図、第2図、第3図および第4図は光リン
クにおけるインナー成形部およびケーブル差込部
の部分を示す側断面図、正面図および斜視図、第
5図は光リンクにおけるインナー成形部、ケーブ
ル差込部の部分の他の構成例を示す平面図である
。 1……インナー成形部、2……ケーブル差込部
、3……アウター成形部、4……発光素子、5…
…受光素子、6……リードフレーム、7……光フ
アイバケーブル、8……挿入孔、13,13′…
…しや光部。
Claims (1)
- 電気信号を光信号に変換する発光素子または光
信号を電気信号に変換する受光素子の部分を、そ
のリードフレームを外部に引き出しながら光透過
性の樹脂によつてモールド成形したインナー成形
部と、複数のインナー成形部を並設して、その外
側に重ねて光透過性の樹脂によつてモールド成形
し、それぞれ光フアイバケーブルの端面が発光素
子または受光素子と対向するように、複数の光フ
アイバケーブルの挿入孔が設けられたケーブル差
込部と、そのケーブル差込部の外側に重ねてしや
光性の樹脂によつてモールド成形したアウター成
形部とによつて構成され、ケーブル差込部の内部
に複数並設されたインナー成形部の各間に、それ
ぞれしや光部を形成したことを特徴とする光リン
ク。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990041504U JPH041506U (en) | 1990-04-18 | 1990-04-18 | Optical link |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990041504U JPH041506U (en) | 1990-04-18 | 1990-04-18 | Optical link |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH041506U true JPH041506U (en) | 1992-01-08 |
Family
ID=31552231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990041504U Pending JPH041506U (en) | 1990-04-18 | 1990-04-18 | Optical link |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH041506U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011048171A (ja) * | 2009-08-27 | 2011-03-10 | Yazaki Corp | 光通信部品及びその製造方法 |
WO2015043599A3 (de) * | 2013-09-30 | 2015-07-23 | Silicon Line Gmbh | Vorrichtung zum einkoppeln und/oder auskoppeln optischer signale |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0243774A (ja) * | 1988-08-04 | 1990-02-14 | Fuji Electric Co Ltd | 透明樹脂モールドの光電変換素子 |
-
1990
- 1990-04-18 JP JP1990041504U patent/JPH041506U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0243774A (ja) * | 1988-08-04 | 1990-02-14 | Fuji Electric Co Ltd | 透明樹脂モールドの光電変換素子 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011048171A (ja) * | 2009-08-27 | 2011-03-10 | Yazaki Corp | 光通信部品及びその製造方法 |
WO2015043599A3 (de) * | 2013-09-30 | 2015-07-23 | Silicon Line Gmbh | Vorrichtung zum einkoppeln und/oder auskoppeln optischer signale |