JPH0414930Y2 - - Google Patents

Info

Publication number

JPH0414930Y2

JPH0414930Y2 JP5763886U JP5763886U JPH0414930Y2 JP H0414930 Y2 JPH0414930 Y2 JP H0414930Y2 JP 5763886 U JP5763886 U JP 5763886U JP 5763886 U JP5763886 U JP 5763886U JP H0414930 Y2 JPH0414930 Y2 JP H0414930Y2

Authority

JP

Japan

Prior art keywords

semiconductor

etch

package

semiconductor package

plate

Prior art date

1986-04-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 32
• 238000005530 etching Methods 0.000 claims description 16
• 239000007921 spray Substances 0.000 claims description 5
• QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 22
• 238000002347 injection Methods 0.000 description 5
• 239000007924 injection Substances 0.000 description 5
• 239000007788 liquid Substances 0.000 description 5
• 239000000243 solution Substances 0.000 description 5
• 239000002699 waste material Substances 0.000 description 5
• 238000001816 cooling Methods 0.000 description 3
• 239000000463 material Substances 0.000 description 3
• 239000002253 acid Substances 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 230000007547 defect Effects 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229920003002 synthetic resin Polymers 0.000 description 1
• 239000000057 synthetic resin Substances 0.000 description 1