JPH04147765A - Reflow device - Google Patents
Reflow deviceInfo
- Publication number
- JPH04147765A JPH04147765A JP2271090A JP27109090A JPH04147765A JP H04147765 A JPH04147765 A JP H04147765A JP 2271090 A JP2271090 A JP 2271090A JP 27109090 A JP27109090 A JP 27109090A JP H04147765 A JPH04147765 A JP H04147765A
- Authority
- JP
- Japan
- Prior art keywords
- conveyor
- attachment
- chain conveyor
- substrate
- attachments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000011295 pitch Substances 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 15
- 210000000078 claw Anatomy 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はリフロー装置に係り、詳しくは、小形基板を加
熱室のチェンコンベヤに確実に受け渡すための手段に関
する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a reflow apparatus, and more particularly to a means for reliably delivering a small substrate to a chain conveyor in a heating chamber.
（従来の技術）
ＩＣ，ＬＳＩ、抵抗チップ、コンデンサチップ等の電子
部品か搭載された基板は、リフロー装置へ送られ、半田
の加熱処理か行われる。(Prior Art) A board on which electronic components such as an IC, an LSI, a resistor chip, a capacitor chip, etc. are mounted is sent to a reflow machine, where a heat treatment for solder is performed.
リフロー装置は、加熱室にヒータや基板搬送用チェンコ
ンベヤ等を配設して構成されており、搬入用コンベヤに
より、基板をチェンコンベヤのアタッチメント上へ受け
渡し、このチェンコンベヤにより基板を搬送しながら、
半田の加熱大形の基板の場合は、上記搬入用コンベヤか
らチェンコンベヤへのアタッメント上へ確実に受け渡す
ことかできる。ところが小形の基板の場合は、搬入用コ
ンベヤからアタッチメントへ受け渡される際に、基板は
アタッチメントとアタッチメントの間に入り込みやすく
、アタッチメント上へ確実に受け渡しにくい問題があっ
た。The reflow apparatus is constructed by disposing a heater, a chain conveyor for conveying the substrate, etc. in a heating chamber, and the conveyor for carrying in transfers the substrate onto the attachment of the chain conveyor.While conveying the substrate by the chain conveyor,
Heating of solder In the case of a large board, it can be reliably transferred from the carrying conveyor onto the attachment to the chain conveyor. However, in the case of small substrates, when the substrate is transferred from the carry-in conveyor to the attachment, the substrate tends to get stuck between the attachments, making it difficult to transfer the substrate onto the attachment reliably.
そこで本発明は、このような従来手段の問題点を解消で
きる手段を提供することを目的とする。Therefore, an object of the present invention is to provide a means that can solve the problems of such conventional means.
（課題を解決するための手段）
本発明は、ヒータか配設された加熱室と、この加熱室内
に配設された基板搬送用チェンコンベヤと、このチェン
コンベヤに基板を受け渡す搬入用コンベヤとを備え、上
記チェンコンベヤに、上記基板を支持するアタッチメン
トをピッチをおいて突設したリフロー装置において、上
記チェンコンベヤを駆動するスプロケットと同軸的に回
転車を設け、上記アタッチメントを、この回転車の円周
上にピッチをおいて形成された爪部の間に嵌入させて回
動させるようにしたものである。(Means for Solving the Problems) The present invention includes a heating chamber in which a heater is provided, a chain conveyor for conveying substrates provided in the heating chamber, and a loading conveyor for delivering substrates to the chain conveyor. In the reflow apparatus, a rotary wheel is provided coaxially with a sprocket that drives the chain conveyor, and the attachment is connected to the sprocket that drives the chain conveyor. It is designed to be rotated by being fitted between claws formed at pitches on the circumference.
（作用）
上記構成によれば、搬入用コンベヤからチェンコンベヤ
のアタッチメント上へ基板が受け渡される際に、アタッ
チメントとアタッチメントの間には回転車の爪部か存在
するので、基板はアタッチメントとアタッチメントの間
に入り込む虞れはなく、この爪部に支持されなから、ア
タッチメント上へ確実に受け渡される。(Function) According to the above configuration, when the board is transferred from the carry-in conveyor to the attachment of the chain conveyor, the claw of the rotary wheel exists between the attachments, so the board is transferred between the attachments. There is no risk of it getting into the gap, and since it is not supported by the claw, it is securely transferred onto the attachment.
（実施例） 次に、図面を参照しながら本発明の詳細な説明する。(Example) Next, the present invention will be described in detail with reference to the drawings.
第１図はリフロー装置の側面図である。ｌは加熱室であ
り、その内部にはヒータ２、ファン３、基板搬送用チェ
ンコンベヤ４か配設されている。また加熱室１の前方と
後方には、基板搬入用コンベヤ５と、基板搬出用コンベ
ヤ６か配設されている。このコンベヤ５，６は、ベルト
コンベヤである。７は電子部品８か搭載された基板であ
る。この基板７は、搬入用コンベヤ５からチェンコンベ
ヤ４へ受け渡され、加熱室ｌ内を搬送される間に、電子
部品８を基板７に接着する半田の加熱処理が行われ、更
に搬出用コンベヤ６へ受け渡される。FIG. 1 is a side view of the reflow apparatus. 1 is a heating chamber in which a heater 2, a fan 3, and a chain conveyor 4 for conveying substrates are arranged. Furthermore, a conveyor 5 for carrying in substrates and a conveyor 6 for carrying out substrates are disposed at the front and rear of the heating chamber 1. The conveyors 5 and 6 are belt conveyors. 7 is a board on which electronic components 8 are mounted. This board 7 is transferred from the carry-in conveyor 5 to the chain conveyor 4, and while being transported through the heating chamber 1, the solder heat treatment for bonding the electronic components 8 to the board 7 is performed, and then the board 7 is transferred to the carry-out conveyor 5. Passed to 6.
第２図及び第３図は、受け渡し部分の側面図と平面図で
ある。ＩＯはチェンコンヘヤ４か調帯されたスプロケッ
トであり、チェンコンベヤ４はこのスプロケット１０に
沿って回動する。2 and 3 are a side view and a plan view of the delivery section. IO is a sprocket tuned to the chain conveyor 4, and the chain conveyor 4 rotates along this sprocket 10.
またこのスプロケット１０と同軸的に、このスプロケッ
ト１０と同形もしくは略同形のスプロケットから成る回
転車ＩＩか設けられている。Further, a rotary wheel II consisting of a sprocket having the same or substantially the same shape as this sprocket 10 is provided coaxially with this sprocket 10.
チェンコンベヤ４には、ピッチをおいて、基板７支持用
のピン状のアタッチメント９か突設されている。このア
タッチメント９は、回転車１１の円周上に形成された爪
部１１ａと爪部１１ａの間に嵌入して回動する。またコ
ンベヤ５とチェンコンベヤ４の接合部には、基板７を支
持するためのローラ１２が設けられている。１４はコン
ベヤ５と平行に設けられた基板７のガイド部である。Pin-shaped attachments 9 for supporting the substrates 7 are protruded from the chain conveyor 4 at intervals. The attachment 9 is fitted between claws 11a formed on the circumference of the rotary wheel 11 and rotates. Further, rollers 12 for supporting the substrate 7 are provided at the joint between the conveyor 5 and the chain conveyor 4. 14 is a guide portion of the substrate 7 provided parallel to the conveyor 5.
このリフロー装置は上記のような構成より成り、次に動
作の説明を行う。This reflow apparatus has the above-mentioned configuration, and its operation will be explained next.
搬入用コンベヤ５により搬送されてきた基板７は、チェ
ンコンベヤ４のアタッチメント９上へ受け渡される。こ
の場合、一般にチェンコンベヤ４の速度Ｖ２はコンベヤ
５の速度Ｖｌよりもかなり遅いこともあって、殊に小形
の基板７は、コンベヤ５からアタッチメント９上へ移乗
しにくく、アタッチメント９とアタッチメント９の間に
入り込みやすいものである（第２図鎖線参照）。ところ
か本手段は、アタッチメント９とアタッチメント９の間
には、回転車１１の爪部１１ａか存在することから、基
板７はアタッチメント９とアタッチメント９の間に入り
込むことはなく、アタッチメント９と同速度で回動する
爪部１１ａに支持されながら、アタッチメント９上へ難
なく移乗できる。なお、搬出用コンベヤ６の速度ｖ３は
、チェンコンベヤ４の速度Ｖ２よりもかなり速いので、
上記回転車ｌｌはなくとも、基板７はチエシコンベヤ６
ヘスムーズに受け渡される。The substrate 7 transported by the carry-in conveyor 5 is transferred onto the attachment 9 of the chain conveyor 4. In this case, since the speed V2 of the chain conveyor 4 is generally much slower than the speed Vl of the conveyor 5, it is difficult to transfer the small substrate 7 from the conveyor 5 to the attachment 9, and (See the chain line in Figure 2). On the other hand, in this means, since the claw portion 11a of the rotary wheel 11 is present between the attachments 9, the board 7 does not enter between the attachments 9 and can move at the same speed as the attachments 9. The user can easily transfer onto the attachment 9 while being supported by the rotating claw portion 11a. Note that the speed v3 of the unloading conveyor 6 is considerably faster than the speed V2 of the chain conveyor 4, so
Even if there is no rotary wheel ll, the board 7 is connected to the conveyor 6.
It is handed over smoothly.
（発明の効果）
以上説明したように本発明は、ヒータか配設された加熱
室と、この加熱室内に配設された基板搬送用チェンコン
ベヤと、このチェンコンベヤに基板を受け渡す搬入用コ
ンベヤとを備え、上記チェンコンベヤに、上記基板を支
持するアタッチメントをピッチをおいて突設したリフロ
ー装置において、上記チェンコンベヤを駆動するスプロ
ケットと同軸的に回転車を設け、上記アタッチメントを
、この回転車の円周上にピッチをおいて形成された爪部
の間に嵌入させて回動させるようにしているので、小形
の基板を、搬入用コンベヤからチェンコンベヤのアタッ
チメント上に確実に受け渡すことかできる。(Effects of the Invention) As explained above, the present invention includes a heating chamber provided with a heater, a chain conveyor for conveying substrates provided in the heating chamber, and a loading conveyor for transferring substrates to the chain conveyor. In the reflow apparatus, the chain conveyor is provided with attachments that support the substrate at intervals, and a rotating wheel is provided coaxially with a sprocket that drives the chain conveyor, and the attachment is connected to the rotating wheel. Since the board is rotated by being inserted between claws formed at pitches on the circumference of the board, it is possible to reliably transfer small boards from the carry-in conveyor to the chain conveyor attachment. can.
図は本発明の実施例を示すものであって、第１図はリフ
ロー装置の側面図、第２図は要部側面図、第３図は要部
平面図である。
１・・・加熱室
２・・・ヒータ
４・・・基板搬送用チェンコンベヤ
５・・・搬入用コンベヤ
７・・・基板
９・・・アタッチメント
１０・・・スプロケット
１１・・・回転車
１１ａ・・・爪部The drawings show an embodiment of the present invention, in which FIG. 1 is a side view of a reflow apparatus, FIG. 2 is a side view of the main part, and FIG. 3 is a plan view of the main part. 1... Heating chamber 2... Heater 4... Chain conveyor 5 for board transfer... Conveyor 7 for carrying in... Board 9... Attachment 10... Sprocket 11... Rotating wheel 11a.・Claw part
Claims (1)
れた基板搬送用チェンコンベヤと、このチェンコンベヤ
に基板を受け渡す搬入用コンベヤとを備え、上記チェン
コンベヤに、上記基板を支持するアタッチメントをピッ
チをおいて突設したリフロー装置において、上記チェン
コンベヤを駆動するスプロケットと同軸的に回転車を設
け、上記アタッチメントを、この回転車の円周上にピッ
チをおいて形成された爪部の間に嵌入させて回動させる
ようにしたことを特徴とするリフロー装置。A heating chamber in which a heater is disposed, a chain conveyor for conveying a substrate disposed in the heating chamber, and a carry-in conveyor for delivering the substrate to the chain conveyor, and the substrate is supported on the chain conveyor. In a reflow apparatus in which attachments are protruded at intervals, a rotating wheel is provided coaxially with a sprocket that drives the chain conveyor, and the attachments are connected to pawls formed at pitches on the circumference of the rotating wheel. A reflow device characterized in that the reflow device is fitted in between and rotated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2271090A JP2867674B2 (en) | 1990-10-09 | 1990-10-09 | Reflow equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2271090A JP2867674B2 (en) | 1990-10-09 | 1990-10-09 | Reflow equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04147765A true JPH04147765A (en) | 1992-05-21 |
| JP2867674B2 JP2867674B2 (en) | 1999-03-08 |
Family
ID=17495225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2271090A Expired - Lifetime JP2867674B2 (en) | 1990-10-09 | 1990-10-09 | Reflow equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2867674B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000216594A (en) * | 1999-01-26 | 2000-08-04 | Matsushita Electric Ind Co Ltd | Method and device for carrying substrate |
| CN111037026A (en) * | 2019-12-26 | 2020-04-21 | 盐城海荣炉业科技有限公司 | Muffle-free continuous brazing furnace |
-
1990
- 1990-10-09 JP JP2271090A patent/JP2867674B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000216594A (en) * | 1999-01-26 | 2000-08-04 | Matsushita Electric Ind Co Ltd | Method and device for carrying substrate |
| CN111037026A (en) * | 2019-12-26 | 2020-04-21 | 盐城海荣炉业科技有限公司 | Muffle-free continuous brazing furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2867674B2 (en) | 1999-03-08 |
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