JPH04147743A - Manufacture of mold or core - Google Patents
Manufacture of mold or coreInfo
- Publication number
- JPH04147743A JPH04147743A JP27095890A JP27095890A JPH04147743A JP H04147743 A JPH04147743 A JP H04147743A JP 27095890 A JP27095890 A JP 27095890A JP 27095890 A JP27095890 A JP 27095890A JP H04147743 A JPH04147743 A JP H04147743A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- binder
- carbon dioxide
- weight
- dioxide gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011230 binding agent Substances 0.000 claims abstract description 30
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 19
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 19
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 13
- -1 alkali metal borate Chemical class 0.000 claims abstract description 13
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 11
- 239000004576 sand Substances 0.000 claims description 21
- 229920001568 phenolic resin Polymers 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- 239000007864 aqueous solution Substances 0.000 claims description 6
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004327 boric acid Substances 0.000 claims description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 20
- 239000007789 gas Substances 0.000 abstract description 19
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical group OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003513 alkali Substances 0.000 abstract description 6
- 238000005266 casting Methods 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000003110 molding sand Substances 0.000 abstract description 3
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 3
- 239000002341 toxic gas Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 231100000053 low toxicity Toxicity 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 26
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 150000001340 alkali metals Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- 238000005273 aeration Methods 0.000 description 2
- 229910021538 borax Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 235000010339 sodium tetraborate Nutrition 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000001743 benzylic group Chemical group 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052609 olivine Inorganic materials 0.000 description 1
- 239000010450 olivine Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- WUUHFRRPHJEEKV-UHFFFAOYSA-N tripotassium borate Chemical compound [K+].[K+].[K+].[O-]B([O-])[O-] WUUHFRRPHJEEKV-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Mold Materials And Core Materials (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は鋳型または中子の製造法に関する。[Detailed description of the invention] Industrial applications The present invention relates to a method for manufacturing a mold or core.
詳しくは、鋳物砂と特定の有機系粘結剤とを混合して成
型し、次いで炭酸ガスを通気して硬化させることにより
、鋳型強度および表面安定性に優れ、かつ吸湿劣化の少
ない鋳型または中子を製造する方法に関する。Specifically, by mixing foundry sand and a specific organic binder, molding the mixture, and then curing it by aerating carbon dioxide gas, it is possible to create molds or medium-sized molds with excellent mold strength and surface stability, and with little moisture deterioration. Concerning a method of producing children.
従来の技術
ガス硬化型粘結剤を使用する鋳型または中子の製造方法
としては、水ガラス等の無機系粘結剤と鋳物砂とを混合
、成型したものを炭酸ガスで硬化する方法(炭酸ガス硬
化法)、ベンジリックエーテル型フェノール樹脂とポリ
イソシアネートとの混合物を鋳物砂に混合、成型したも
のをアミンガスで硬化する方法(インキコア法)、フラ
ン樹脂と過酸化物との混合物を鋳物砂に混合、成型した
ものを亜硫酸ガスで硬化する方法(バードックス法)等
が知られている。しかしながら、無機系粘結剤を使用す
る炭酸ガス硬化法は、鋳込後の鋳型の崩壊性が悪く、仕
上げ工数が嵩み、また砂の回収性や廃砂によって生ずる
環境破壊等の問題がある。Conventional technology The method for producing molds or cores using gas-curing binders is to mix an inorganic binder such as water glass with foundry sand, mold the mixture, and then harden it with carbon dioxide gas (carbon dioxide). (gas curing method), a method in which a mixture of a benzylic ether type phenol resin and a polyisocyanate is mixed into molding sand, the molded product is then hardened with amine gas (ink core method), a mixture of furan resin and peroxide is mixed into molding sand A method of curing the mixed and molded material with sulfur dioxide gas (Burdox method) is known. However, the carbon dioxide curing method that uses an inorganic binder has problems such as poor mold disintegration after casting, increased finishing time, poor sand recovery, and environmental damage caused by waste sand. .
方、有機系粘結剤を使用するイソキュア法およびバード
ックス法は、無機系粘結剤を使用する炭酸ガス硬化法に
比べて鋳型の崩壊性および砂の回収性は良好であるが、
有毒なガスを使用するために作業環境衛生上好ましくな
いだけでなく、粘結剤成分に窒素針を含有するために鋳
物にガス欠陥、スス欠陥およびヘーニング欠陥等が生じ
やすいという問題かあった。On the other hand, the isocure method and bardox method, which use organic binders, have better mold disintegration and sand recovery than the carbon dioxide curing method, which uses inorganic binders.
Not only is this method undesirable in terms of working environment hygiene due to the use of toxic gas, but also there is the problem that gas defects, soot defects, and Hoening defects are likely to occur in castings because the binder component contains nitrogen needles.
そのため、近年、有機系粘結剤を用いて低毒性の炭酸ガ
スで硬化させる試みがなされている。例えば、鋳物砂と
アルカリ性フェノールホルムアルデヒド樹脂水溶液との
混合物に炭酸ガスを通気する方法や、上記アルカリ性フ
ェノールホルムアルデヒド樹脂水溶液に、さらにホウ酸
のアルカリ金属塩を配合した粘結剤と鋳物砂との混合物
に炭酸ガスを通気する方法が提案されているが、いずれ
も、鋳物の強度が低く、表面安定性に劣り、さらに高湿
度下では吸湿劣化するという問題があった。Therefore, in recent years, attempts have been made to use organic binders and harden them with low-toxic carbon dioxide gas. For example, there is a method in which carbon dioxide gas is bubbled through a mixture of foundry sand and an alkaline phenol-formaldehyde resin aqueous solution, and a method in which a binder containing an alkali metal salt of boric acid is added to the above-mentioned alkaline phenol-formaldehyde resin aqueous solution and foundry sand. Methods of venting carbon dioxide gas have been proposed, but all of them have problems in that the strength of the casting is low, the surface stability is poor, and furthermore, it deteriorates due to moisture absorption under high humidity.
発明が解決しようとする課題
本発明は、有機系粘結剤および炭酸ガスを用いて、鋳型
強度および表面安定性に優れ、かつ吸湿劣化の少ない鋳
型または中子を製造することができる方法を提供するこ
とを目的とする。Problems to be Solved by the Invention The present invention provides a method for manufacturing a mold or core with excellent mold strength and surface stability, and with little moisture deterioration, using an organic binder and carbon dioxide gas. The purpose is to
課題を解決するための手段
本発明は、鋳物砂と、下記(a)〜(c)成分(a)ア
ルカリ性フエ/−ルホルムアルデヒド樹脂水溶液60〜
96重置%
(b)ホウ酸のアルカリ金属塩3〜20重量%(C)グ
リコールエーテル類および/またはフルフリルアルコー
ル1〜20tffi%
を含有する粘結剤とを混合して成型し、次いで炭酸ガス
を通気して硬化させることを特徴とする鋳型または中子
の製造法に関する。Means for Solving the Problems The present invention provides foundry sand and the following components (a) to (c) (a) alkaline formaldehyde resin aqueous solution 60 to
(b) 3 to 20% by weight of an alkali metal salt of boric acid (C) A binder containing 1 to 20% by weight of glycol ethers and/or furfuryl alcohol are mixed and molded, and then carbonated The present invention relates to a method for manufacturing a mold or core, which is characterized by curing by passing gas through it.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
本発明に用いるアルカリ性フェノールホルムアルデヒド
樹脂水溶液のアルカリ金属としては、リチウム、ナトリ
ウム、カリウム等が挙げられる。Examples of the alkali metal in the alkaline phenol formaldehyde resin aqueous solution used in the present invention include lithium, sodium, potassium, and the like.
フェノールとアルカリ金属とのモル比はフェノール:ア
ルカリ金属=i、O:Q、4〜1.0:2.5、好まし
くは1.0:1.0〜1.0:2.0である。該モル比
が1.0:0.4未満では樹脂の水溶性か悪くなり、ま
た、1.0:2.5より大きい場合は不充分な強度しか
得られない。アルカリ金属は反応系に1種またはそれ以
上歯まれていても良く、また反応終了後に追加しても良
い。フェノールとホルムアルデヒド1とのモル比は、1
.0:1.0〜103、O1好ましくは1.0:1.2
〜1.0:2.5である。該モル比が1.0:1.0未
満では、得られる強度が不充分であり、また、該モル比
が1゜0.30より大きい場合は樹脂の粘度か高くなる
ばかりでなく、ホルムアルデヒドの刺激臭により作業環
境か悪化する。The molar ratio of phenol and alkali metal is phenol:alkali metal=i, O:Q, 4 to 1.0:2.5, preferably 1.0:1.0 to 1.0:2.0. If the molar ratio is less than 1.0:0.4, the water solubility of the resin will be poor, and if it is greater than 1.0:2.5, insufficient strength will be obtained. One or more alkali metals may be present in the reaction system, or may be added after the reaction is complete. The molar ratio of phenol to formaldehyde 1 is 1
.. 0:1.0-103, O1 preferably 1.0:1.2
~1.0:2.5. If the molar ratio is less than 1.0:1.0, the strength obtained will be insufficient, and if the molar ratio is more than 1°0.30, not only will the viscosity of the resin increase, but the formaldehyde The working environment deteriorates due to the irritating odor.
アルカリ性フェノールホルムアルデヒド樹脂は、30〜
70重量%の水溶液に調製する。30重量%未満の樹脂
含有量では、水分量が多すぎ鋳型または中子の強度発現
が充分ではなく、また、70重量%より高い樹脂含有量
では樹脂の粘性が高くなり、取扱い上問題かある。Alkaline phenol formaldehyde resin is 30~
Prepare a 70% by weight aqueous solution. If the resin content is less than 30% by weight, the water content is too high and the strength of the mold or core is insufficient, and if the resin content is more than 70% by weight, the viscosity of the resin becomes high, causing problems in handling. .
アルカリ性フエ/−ルホルムアルデヒド樹脂水溶液の粘
結剤全量に対する配合量は、60〜96重量%、好まし
くは75〜90重量%である。該配合量が60重量%未
満では炭酸ガス通気直後の強度か不十分であり、また、
96重量%より多いと鋳型強度の改良効果が少ない。The amount of the aqueous alkaline formaldehyde resin solution based on the total amount of the binder is 60 to 96% by weight, preferably 75 to 90% by weight. If the blending amount is less than 60% by weight, the strength immediately after aeration of carbon dioxide gas will be insufficient, and
If it exceeds 96% by weight, the effect of improving mold strength will be small.
本発明に用いるホウ酸のアルカリ金属塩とじては、ホウ
酸ナトリウム、ホウ酸カリウム等か挙げられる。Examples of the alkali metal salt of boric acid used in the present invention include sodium borate and potassium borate.
ホウ酸のアルカリ金属塩はアルカリ性フェノールホルム
アルデヒド樹脂水溶液に添加、溶解して使用する。The alkali metal salt of boric acid is used by being added and dissolved in an aqueous alkaline phenol formaldehyde resin solution.
ホウ酸のアルカリ金属塩の粘結剤全量に対する配合量は
、3〜20重量%、好ましくは5〜15重量%である。The amount of the alkali metal salt of boric acid added to the total amount of the binder is 3 to 20% by weight, preferably 5 to 15% by weight.
該配合量が3重量%未満では、炭酸ガス通気直後の強度
が不充分で実用的でなく、また、20重量%より多いと
樹脂の粘度が高くなるばかりでなく、得られる強度も低
下する。If the amount is less than 3% by weight, the strength immediately after carbon dioxide gas ventilation is insufficient and is not practical, and if it is more than 20% by weight, not only the viscosity of the resin increases but also the strength obtained decreases.
本発明に用いるグリコールエーテル類の代表的な例とし
ては、ジエチレングリコール、トリエチレングリコール
、ジプロピレングリコール、トリプロピレングリコール
、エチレングリコール・モノメチルエーテル、エチレン
グリコール、・モノエチルエーテル、エチレングリコー
ル・モノプロピルエーテル、エチレングリコール−モツ
プチルエーテル、ジエチレングリコール・モノメチルエ
ーテル、ジエチレングリコール・モノエチル二一テル、
/エチレングリコール・モノプロピルエーテル、ジエチ
レングリコール・モノブチルエーテル、ブロヒツングリ
コール・モノメチルエーテル及びジプロピレングリコー
ル・モノメチルエーテル等が挙げられる。Typical examples of glycol ethers used in the present invention include diethylene glycol, triethylene glycol, dipropylene glycol, tripropylene glycol, ethylene glycol monomethyl ether, ethylene glycol, monoethyl ether, ethylene glycol monopropyl ether, Ethylene glycol-motsbutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether,
/Ethylene glycol monopropyl ether, diethylene glycol monobutyl ether, Brochtung glycol monomethyl ether, and dipropylene glycol monomethyl ether.
グリコールエーテル類および/またはフルフリルアルコ
ールの粘結剤全量に対する配合量は、1〜20重量%、
好ましくは3〜15重量%である。The amount of glycol ethers and/or furfuryl alcohol based on the total amount of the binder is 1 to 20% by weight,
Preferably it is 3 to 15% by weight.
該配合量が1重量%未満では、強度および鋳型の表面安
定性の改良効果が少なく、また、20重量%より多いと
鋳型強度および表面安定性の効果が少なくなり、また経
済的でない。When the amount is less than 1% by weight, the effect of improving the strength and surface stability of the mold is small, and when it is more than 20% by weight, the effect on mold strength and surface stability is reduced, and it is not economical.
本発明に用いる鋳物砂としては珪砂、オリビン砂、クロ
マイト砂、ジルコン砂等が挙げられる。Examples of foundry sand used in the present invention include silica sand, olivine sand, chromite sand, and zircon sand.
本発明においては、上記鋳物砂と粘結剤とを混合して所
望の形に成型し、次いで炭酸ガスを通気することにより
、鋳型または中子を製造することができる。In the present invention, a mold or a core can be manufactured by mixing the foundry sand and a binder, molding the mixture into a desired shape, and then passing carbon dioxide through the mixture.
本発明の粘結剤には、アルカリ性フェノールホルムアル
デヒド樹脂と鋳物砂との粘結性を改良するだめに、7ラ
ンカノブリング剤を配6Lでもよい。好ましいンランカ
ノブリング剤としては、γアミノプロピルトリエトキノ
ンランやγ−(2−アミノエチル)アミノフロピルトリ
メトキンンラン等が挙げられる。The binder of the present invention may contain 6 L of a 7-rankanobbling agent in order to improve the caking properties of the alkaline phenol formaldehyde resin and foundry sand. Preferred examples of antiblining agents include γ-aminopropyltriethoquinone, γ-(2-aminoethyl)aminofuropyltrimethoquinone, and the like.
上記粘結剤の鋳物砂100重量部に対する添加量は、0
.4〜10重量部、好ましくは0.8〜5重量部である
。The amount of the binder added to 100 parts by weight of foundry sand is 0.
.. The amount is 4 to 10 parts by weight, preferably 0.8 to 5 parts by weight.
以下、実施例により本発明をさらに詳細に説明するが、
本発明はこれらの実施例に限定されるものではない。Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited to these examples.
実施例1〜5および比較例1
温度計、撹拌機、冷却器を備えた1e四つロフラスコに
フェノール949を仕込み、撹拌しなからこれに50%
水酸化カリウム101g、92%バラホルムアルテヒト
65.2yを徐々に加えた。Examples 1 to 5 and Comparative Example 1 Phenol 949 was charged into a 1e four-bottle flask equipped with a thermometer, a stirrer, and a condenser, and 50% was added to it without stirring.
101 g of potassium hydroxide and 65.2 y of 92% paraformaltehyde were gradually added.
次に、この溶液を90°Cに昇温し、90’Cで3時間
反応させて、アルカリフェノールホルムアルデヒド樹脂
を得た。Next, this solution was heated to 90°C and reacted at 90'C for 3 hours to obtain an alkali phenol formaldehyde resin.
次に反応終了後40℃以下まで冷却した上記アルカリフ
ェノールホルムアルデヒド樹脂に50%水酸化カリウム
12’3.49と、ホウ砂309およびγ−アミノプロ
ピルトリエトキシシラン1.9gヲ加え、アルカリフェ
ノールホルムアルデヒド樹脂溶液を得た。Next, 12'3.49 50% potassium hydroxide, 309 borax and 1.9 g of γ-aminopropyltriethoxysilane were added to the alkali phenol formaldehyde resin which had been cooled to below 40°C after the completion of the reaction, and the alkali phenol formaldehyde resin was added. A solution was obtained.
く粘結剤の調製〉
上記アルカリフェノールホルムアルデヒド樹脂溶液に対
して、表−1に示す各種グリコールエーテル類またはフ
リフリルアルコールを10重量%添加混合し、粘結剤を
調製した。Preparation of Binder> To the alkali phenol formaldehyde resin solution, 10% by weight of various glycol ethers or frifuryl alcohol shown in Table 1 were added and mixed to prepare a binder.
〈性能評価〉
珪砂(商品名「三浦6考砂」、三河珪石株式会社製)1
に9に上記粘結剤359を加え1分間混練した。<Performance evaluation> Silica sand (product name "Miura 6 Kosand", manufactured by Mikawa Siliceki Co., Ltd.) 1
The above-mentioned binder 359 was added to Step 9 and kneaded for 1 minute.
この混練砂を試験用木型(50φX 50 bmm、6
ケ取り)に造型した後、炭酸ガスを流量2012/mi
nで60秒通気して硬化させた。This kneaded sand was molded into a test wooden mold (50φX 50 bmm, 6
After molding the carbon dioxide gas at a flow rate of 2012/mi
The mixture was cured by bubbling with n for 60 seconds.
得られた硬化試験片を用い通気直後と20℃60%RH
および20’C−100%RHの雰囲気で24時間放置
後の圧縮強さと表面安定度を測定した。結果を表−1に
示す。Using the obtained cured test piece, immediately after ventilation and at 20°C 60%RH
Then, the compressive strength and surface stability were measured after being left for 24 hours in an atmosphere of 20'C-100% RH. The results are shown in Table-1.
圧縮強さは、アムスラー型圧縮試験機によって測定した
。Compressive strength was measured using an Amsler compression tester.
表面安定度は、標準の50φX50hmm試験片を網目
3360μ尻のふるい上で60秒振盪し、次式によって
算出した。Surface stability was calculated by shaking a standard 50φ x 50hmm test piece for 60 seconds on a sieve with a mesh size of 3360μ and using the following formula.
実施例6〜12
く粘結剤の調製〉
実施例1〜5および比較例1て用いたのと同じアルカリ
フェノールホルムアルテヒト樹脂溶t&に対して、表−
2に示すように、ジエチレングリコール拳モノフ゛チル
エーテル
粘結剤を調製した。Examples 6 to 12 Preparation of binder> For the same alkali phenol formaldehyde resin solution as used in Examples 1 to 5 and Comparative Example 1,
A diethylene glycol monobutythyl ether binder was prepared as shown in 2.
〈性能評価〉
性能評価は、実施例1〜5の方法と同様に行った。結果
を表−2に示す。<Performance evaluation> Performance evaluation was performed in the same manner as in Examples 1 to 5. The results are shown in Table-2.
実施例13〜15
く粘結剤の調製〉
実施例1〜5および比較例1て用いたのと同じアルカリ
フェノールホルムアルデヒド樹脂溶液に対して、表−3
に示す各種グリコールエーテル類を5重量%添加混合し
、粘結剤を調製した。Examples 13 to 15 Preparation of binder Table 3
A binder was prepared by adding and mixing 5% by weight of the various glycol ethers shown below.
く性能評価〉
珪砂(商品名「三浦6考砂」、三河珪石株式会社製月に
9に上記粘結剤35gを加え1分間混練した。Performance Evaluation> 35 g of the above-mentioned binder was added to silica sand (trade name ``Miura 6 Kosan'', manufactured by Mikawa Siliceki Co., Ltd.) and kneaded for 1 minute.
この混練砂を試験用木型(50φx5Qhmm、6ケ取
り)に造型した後、炭酸ガスを圧力2 、0 kg/
ctn”、流量20ρ/minで60秒通気して硬化さ
せた。After molding this mixed sand into a test wooden mold (50φx5Qhmm, 6 pieces), carbon dioxide gas was applied at a pressure of 2,0 kg/
ctn'' and a flow rate of 20 ρ/min for 60 seconds to cure.
得られた硬化試験片を用い通気直後および20’C−6
0%RHの雰囲気で24時間放置後の圧縮強さを測定し
た。結果を表−3に示す。Immediately after aeration and at 20'C-6 using the obtained cured test piece.
The compressive strength was measured after being left for 24 hours in an atmosphere of 0% RH. The results are shown in Table-3.
表
発明の効果
本発明方法によれば、鋳型強度および表面安定度に優れ
、かつ吸湿劣化の少ない鋳型または中子を製造すること
ができる。Effects of the Invention According to the method of the present invention, it is possible to produce a mold or core that has excellent mold strength and surface stability, and is less susceptible to deterioration due to moisture absorption.
また本発明は低毒性の炭酸ガスで鋳型を硬化させるため
、従来のイソキュア法やハード、ラス法のように有毒ガ
スを必要としないので、作業環境衛生上好ましく、さら
に、鋳物にガス欠陥等をもたらす窒素針を含有しない粘
結剤を使用するので、鋳造品の品質か向上する。In addition, since the present invention hardens the mold with low-toxic carbon dioxide gas, it does not require toxic gas unlike the conventional isocure method, hard method, and lath method, which is preferable in terms of working environment hygiene. Using a binder that does not contain nitrogen needles improves the quality of the casting.
Claims (1)
液60〜96重量% (b)ホウ酸のアルカリ金属塩3〜20重量% (c)グリコールエーテル類および/またはフルフリル
アルコール1〜20重量% を含有する粘結剤とを混合して成型し、次いで炭酸ガス
を通気して硬化させることを特徴とする鋳型または中子
の製造法。[Claims] 1. Foundry sand and the following components (a) to (c) (a) 60 to 96% by weight of an alkaline phenol formaldehyde resin aqueous solution (b) 3 to 20% by weight of an alkali metal salt of boric acid (c ) A method for producing a mold or core, which comprises mixing a binder containing 1 to 20% by weight of glycol ethers and/or furfuryl alcohol, molding the mixture, and then curing by blowing carbon dioxide gas through the mixture. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27095890A JP2747367B2 (en) | 1990-10-08 | 1990-10-08 | Mold or core manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27095890A JP2747367B2 (en) | 1990-10-08 | 1990-10-08 | Mold or core manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04147743A true JPH04147743A (en) | 1992-05-21 |
JP2747367B2 JP2747367B2 (en) | 1998-05-06 |
Family
ID=17493393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27095890A Expired - Lifetime JP2747367B2 (en) | 1990-10-08 | 1990-10-08 | Mold or core manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2747367B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0508566A2 (en) * | 1991-03-13 | 1992-10-14 | Foseco International Limited | Alkaline resol phenol-aldehyde resin binder compositions |
US5294648A (en) * | 1991-03-13 | 1994-03-15 | Foseco International Limited | Alkaline resol phenol-aldehyde resin binder composition |
KR100680375B1 (en) * | 2005-07-27 | 2007-02-08 | 현대자동차주식회사 | Method for control reaction of mold for Mg alloy |
CN105618667A (en) * | 2015-12-30 | 2016-06-01 | 青岛博泰美联化工技术有限公司 | Refractory casting sand |
-
1990
- 1990-10-08 JP JP27095890A patent/JP2747367B2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0508566A2 (en) * | 1991-03-13 | 1992-10-14 | Foseco International Limited | Alkaline resol phenol-aldehyde resin binder compositions |
US5242957A (en) * | 1991-03-13 | 1993-09-07 | Foseco International Limited | Alkaline resol phenol-aldehyde resin binder compositions containing phenyl ethylene glycol ether |
US5294648A (en) * | 1991-03-13 | 1994-03-15 | Foseco International Limited | Alkaline resol phenol-aldehyde resin binder composition |
KR100680375B1 (en) * | 2005-07-27 | 2007-02-08 | 현대자동차주식회사 | Method for control reaction of mold for Mg alloy |
CN105618667A (en) * | 2015-12-30 | 2016-06-01 | 青岛博泰美联化工技术有限公司 | Refractory casting sand |
CN105618667B (en) * | 2015-12-30 | 2018-12-14 | 韶关市晟发有色金属有限公司 | A kind of fire resisting casting sand |
Also Published As
Publication number | Publication date |
---|---|
JP2747367B2 (en) | 1998-05-06 |
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