JPH04145602A - Laser trimming device - Google Patents

Laser trimming device

Info

Publication number
JPH04145602A
JPH04145602A JP2269839A JP26983990A JPH04145602A JP H04145602 A JPH04145602 A JP H04145602A JP 2269839 A JP2269839 A JP 2269839A JP 26983990 A JP26983990 A JP 26983990A JP H04145602 A JPH04145602 A JP H04145602A
Authority
JP
Japan
Prior art keywords
trimming
slider
beam scanner
optical system
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2269839A
Other languages
Japanese (ja)
Inventor
Keiko Ozawa
恵子 小澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2269839A priority Critical patent/JPH04145602A/en
Publication of JPH04145602A publication Critical patent/JPH04145602A/en
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To enable precision trimming by attaching a slider to a sliding resistor of a trimming substrate for sliding and by carrying out trimming while detecting a position. CONSTITUTION:A control part 101 designates a rotation angle of a slider 109 to a position detection part 108 and rotates the slider 109 to an electrode position 301. Then, a beam scanner control part 103 is commanded to position a beam scanner optical system 104 to a trimming starting position. The control part commands a laser oscillator 102 and trims a resistor 311 until an aimed value is detected by a resistance measurement part 105 while driving the optical system 104. When a plurality of cuttings are formed to rotation of a slider, an aimed value to a present rotation angle and an aimed value to a rotation angle immediately before are divided proportionally by the cutting number, and the value is used as an aimed value and trimming is carried out by positioning at the proportionally divided trimming starting place.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、レーザビームにて、抵抗値を調節するレーザ
トリミング装置に関し、特に摺動抵抗を調節するレーザ
トリミング装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a laser trimming device that adjusts resistance value using a laser beam, and particularly relates to a laser trimming device that adjusts sliding resistance.

〔従来の技術〕[Conventional technology]

従来のレーザトリミング装置は、第2図に示すように、
レーザ発振器102と、レーザ発振器102からのレー
ザ光を偏向するビームスキャナ光学系104と、ビーム
スキャナ光学系104を駆動するビームスキャナ制御部
103と、被トリミング基板上の摺動抵抗部10の任意
の位置に接触する多数のプローブ110と、多数のプロ
ーブ110から目的のプローブを選択して抵抗測定部1
05に接続する測定端子切換部201と、測定端子切換
部201で選択されたプローブ間の抵抗を測定する抵抗
測定部105と、レーザ発振器102、ビームスキャナ
制御部103、測定端子切換部201、抵抗測定部10
5を駆動・制御する制御部101とから構成されている
。このようなレーザトリミング装置においては、被トリ
ミング基板上の摺動抵抗部(第3図B)の目標値となる
位置の電極310上にプローブを立て、その位置で目標
値となるように、被トリミング基板106に形成した摺
動抵抗部の抵抗体311をトリミングすることにより、
摺動抵抗の調整を行っていた。
The conventional laser trimming device, as shown in Fig. 2,
A laser oscillator 102, a beam scanner optical system 104 that deflects the laser beam from the laser oscillator 102, a beam scanner control unit 103 that drives the beam scanner optical system 104, and an arbitrary part of the sliding resistor 10 on the substrate to be trimmed. A large number of probes 110 that touch the position and a target probe are selected from the large number of probes 110 and the resistance measuring unit 1
05, a resistance measuring section 105 that measures the resistance between the probes selected by the measuring terminal switching section 201, a laser oscillator 102, a beam scanner control section 103, a measuring terminal switching section 201, and a resistance measuring section 105 that measures the resistance between the probes selected by the measuring terminal switching section 201. Measuring section 10
5 and a control section 101 that drives and controls the control section 5. In such a laser trimming device, a probe is placed on the electrode 310 at a position where the target value of the sliding resistance portion (FIG. 3B) on the substrate to be trimmed is set, and the target value is reached at that position. By trimming the resistor 311 of the sliding resistance part formed on the trimming board 106,
The sliding resistance was being adjusted.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記従来の摺動抵抗を調整するレーザトリミング装置で
は、摺動抵抗部の角度に対して目標値を決めてトリミン
グを行っている。しかし、被トリミング基板を摺動子と
組み合わせて組立てた際、回転軸の角度と摺動子の角度
との差による誤差により、第3図Aに示すように、摺動
された時に得られる抵抗値(b)、(c)が、摺動抵抗
部の角度に対して設定した目標値(a)とはならない。
In the conventional laser trimming device for adjusting the sliding resistance described above, a target value is determined for the angle of the sliding resistance portion and trimming is performed. However, when the substrate to be trimmed is assembled with the slider, due to the error caused by the difference between the angle of the rotation axis and the angle of the slider, the resistance obtained when the substrate is slid as shown in Figure 3A. The values (b) and (c) are not the target value (a) set for the angle of the sliding resistance portion.

また摺動子が摺動する場合、摺動抵抗部の電極と摺動子
との接触する面積、圧力がプローブを摺動抵抗部の電極
に当ててトリミングしたときと異なることからも、トリ
ミング時の精度を製品化したときの精度に生かせないと
いう欠点がある。
In addition, when the slider slides, the contact area and pressure between the electrode of the sliding resistance part and the slider are different from when trimming by applying the probe to the electrode of the sliding resistance part, so when trimming The drawback is that the accuracy cannot be used to improve the accuracy when commercialized.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のレーザトリミング装置は、レーザ発振器と、レ
ーザ光をトリミング開始点に位置決めし、被トリミング
基板上の抵抗体上を移動させるビームスキャナ光学系と
、前記ビームスキャナ光学系を駆動するビームスキャ、
す制御部と、被トリミング基板に取り付けられた摺動子
を指定位置回転させる回転機構部と、回転位置の検出部
と、抵抗値を測定する機能をもつ抵抗測定部と、前記構
成ユニットをプログラム制御する制御部101とを有し
ている。
A laser trimming device of the present invention includes a laser oscillator, a beam scanner optical system that positions a laser beam at a trimming start point and moves it over a resistor on a substrate to be trimmed, and a beam scanner that drives the beam scanner optical system.
A control unit that rotates a slider attached to a substrate to be trimmed to a specified position, a rotational position detection unit, a resistance measurement unit that has a function of measuring resistance value, and a program for the above-mentioned component units. It has a control section 101 for controlling.

〔実施例〕〔Example〕

本発明について図面を参照して説明する。 The present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の概略構成図である0図から
れかるように、構成は従来とほぼ同じで、従来と異る点
は、 (1)プローブ110は2本である。
FIG. 1 is a schematic configuration diagram of an embodiment of the present invention. As can be seen from FIG. 0, the configuration is almost the same as the conventional one, and the differences from the conventional one are: (1) There are two probes 110.

(2)トリミング基板106に摺動子109を取り付け
た。
(2) A slider 109 was attached to the trimming board 106.

(3)測定端子切換部がない。(3) There is no measurement terminal switching section.

(4)摺動子回転駆動部107を設けた。(4) A slider rotation drive section 107 was provided.

(5)摺動子の回転位置検出部108を設けたの5点で
ある。
(5) The slider rotational position detection section 108 is provided.

尚、この実施例では回転駆動部107は減速ギアとモー
タで構成し、回転検出部108はポテンシオメータで構
成したが、他の構成、例えばエンコーダを利用した回転
検出部等、従来からよく用いられているものが利用でき
る。
In this embodiment, the rotation drive unit 107 is composed of a reduction gear and a motor, and the rotation detection unit 108 is composed of a potentiometer, but other configurations, such as a rotation detection unit using an encoder, may be used. What is available is available.

まず、制御部101にはあらかじめ摺動子109の摺動
角度に対する目標値が記憶されている。
First, the control unit 101 stores in advance a target value for the sliding angle of the slider 109.

制御部は、回転駆動部107、回転位!検出部108に
摺動子109の回転角度を指定し、摺動子109を電極
位置301(第3図B)まで回転させる。
The control unit includes a rotation drive unit 107, rotation position! The rotation angle of the slider 109 is specified to the detection unit 108, and the slider 109 is rotated to the electrode position 301 (FIG. 3B).

次に制御部101よりビームスキャナ制御部103に指
令を出し、ビームスキャナ光学系104をトリミング開
始位置に位置決めする。制御部はレーザ発振器102に
指令を出し、ビームスキャナ光学系104を駆動させな
がら抵抗測定部で目標値を検出するまで抵抗体311(
第3図B)のトリミングを行う、摺動子の回転に対し、
カットを複数本行う場合は、現在の回転角に対する目標
値と直前の回転角に対する目標値とをカットの本数分、
比例分割を行い、その値を目標値とし、比例分割された
トリミング開始位置に位置決めし、トリミングを行う。
Next, the control unit 101 issues a command to the beam scanner control unit 103 to position the beam scanner optical system 104 at the trimming start position. The control unit issues a command to the laser oscillator 102, and while driving the beam scanner optical system 104, the resistor 311 (
For the rotation of the slider that performs the trimming in Figure 3B),
When making multiple cuts, set the target value for the current rotation angle and the target value for the previous rotation angle for the number of cuts.
Proportional division is performed, the resulting value is set as a target value, the position is positioned at the proportional division trimming start position, and trimming is performed.

前記作業を摺動子の回転角を大きくさせ、回転位置30
2〜305と次々に変えながら、トリミングを行う。
The above operation is carried out by increasing the rotation angle of the slider to the rotation position 30.
Trimming is performed by changing the number from 2 to 305 one after another.

本発明は、摺動子がセットされた状態でトリミングする
ので、従来のトリミング方法による場合の、摺動子取り
付は位置による誤差(第3図A、破線(b))や、プロ
ーブ位置と摺動する位置、接触面積、圧力による誤差(
第3図A、−転破線(C))による影響を取り除き、摺
動子の回転角度に対する目標値(第3図A、実線(a)
)を製品にそのまま実線することができる。
In the present invention, trimming is performed with the slider set, so when using the conventional trimming method, the slider attachment is subject to positional errors (Figure 3A, broken line (b)) and probe position errors. Errors due to sliding position, contact area, and pressure (
The target value for the rotation angle of the slider (Fig. 3A, solid line (a)) is removed by removing the influence of the - dashed line (C) in Fig.
) can be printed directly on the product.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明によるレーザトリミング装
置は、摺動抵抗を調整する際に、被トリミング基板であ
る摺動抵抗体に摺動子を取り付け、摺動させ、その位置
を検出しながらトリミングを行うので、トリミング時の
精度を、そのまま製品化したときの精度として生かせる
、高精度な摺動抵抗のトリミングを実現できる効果があ
る6
As explained above, when adjusting the sliding resistance, the laser trimming device according to the present invention attaches the slider to the sliding resistor, which is the substrate to be trimmed, slides it, and performs trimming while detecting its position. This has the effect of realizing highly accurate trimming of the sliding resistance, allowing the accuracy during trimming to be utilized as accuracy when commercialized.6

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のレーザトリミング装置の概略構成図、
第2図は従来技術によるレーザトリミング装置の概略構
成図、第3図A、Bは回転角に対する抵抗値のグラフ及
び、摺動抵抗体の図である。 101・・・制御部、102・・・レーザ発振器、10
3・・・ビームスキャナ制御部、104・・・ビームス
キャナ光学系、105・・・抵抗測定部、106・・・
被トリミング基板、107・・・摺動子回転駆動部、1
08・・・摺動子回転位置検出部、109・・・摺動子
、110・・・プローブ、201・・・測定端切換制御
部、310・・・電極、311・・・抵抗体。
FIG. 1 is a schematic configuration diagram of a laser trimming device of the present invention,
FIG. 2 is a schematic configuration diagram of a laser trimming device according to the prior art, and FIGS. 3A and 3B are graphs of resistance values versus rotation angles and diagrams of sliding resistors. 101... Control unit, 102... Laser oscillator, 10
3... Beam scanner control section, 104... Beam scanner optical system, 105... Resistance measurement section, 106...
Substrate to be trimmed, 107... Slider rotation drive unit, 1
08...Slider rotation position detection unit, 109...Slider, 110...Probe, 201...Measurement end switching control unit, 310...Electrode, 311...Resistor.

Claims (1)

【特許請求の範囲】[Claims]  レーザ光を発振するレーザ発振器、レーザ光の位置決
めを行い、被トリミング基板上の抵抗体上を移動させる
ビームスキャナ光学系、前記ビームスキャナ光学系を制
御するビームスキャナ制御部、被トリミング基板に取り
付けられた摺動子を指定位置に回転させる回転駆動部、
摺動子の回転位置を検出する回転検出部、抵抗値を測定
する抵抗測定部、前記各構成ユニットをプログラム制御
部を有することを特徴とするレーザトリミング装置。
A laser oscillator that oscillates a laser beam, a beam scanner optical system that positions the laser beam and moves it over a resistor on the substrate to be trimmed, a beam scanner control unit that controls the beam scanner optical system, and a beam scanner control unit that is attached to the substrate to be trimmed. a rotary drive unit that rotates the slider to a specified position;
A laser trimming apparatus comprising: a rotation detection section for detecting a rotational position of a slider; a resistance measurement section for measuring a resistance value; and a program control section for each of the constituent units.
JP2269839A 1990-10-08 1990-10-08 Laser trimming device Pending JPH04145602A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2269839A JPH04145602A (en) 1990-10-08 1990-10-08 Laser trimming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2269839A JPH04145602A (en) 1990-10-08 1990-10-08 Laser trimming device

Publications (1)

Publication Number Publication Date
JPH04145602A true JPH04145602A (en) 1992-05-19

Family

ID=17477906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2269839A Pending JPH04145602A (en) 1990-10-08 1990-10-08 Laser trimming device

Country Status (1)

Country Link
JP (1) JPH04145602A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7119656B2 (en) * 2001-09-10 2006-10-10 Microbridge Technologies Inc. Method for trimming resistors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7119656B2 (en) * 2001-09-10 2006-10-10 Microbridge Technologies Inc. Method for trimming resistors

Similar Documents

Publication Publication Date Title
JPH04145602A (en) Laser trimming device
JPS6258850B2 (en)
JP3199567B2 (en) Tool control method for swiveling side trimmer
JP2546290B2 (en) Lens drive
JP2630025B2 (en) Laser trimming method and apparatus
JPH0749706A (en) Controller for increment- numerical-value axis in machining place
JPH0778683B2 (en) Mechanical origin position correction method for articulated robots
JPS6325892B2 (en)
JPS5937098A (en) Method of positioning cutter of slitter
JPS629853A (en) Index rotating system automatic operating device
JPS6234210A (en) Detector for original point position
JPS6344471B2 (en)
JP2683277B2 (en) Trimming method of thin film resistor
JPH0141538Y2 (en)
KR100224862B1 (en) Apparatus and method for callibration of robot arm
JPS63191552A (en) Numerically controlled (nc) machine tool equipped with measurement probe error compensation function
JP2611013B2 (en) Circular chart recorder
JPH06218652A (en) Cutting tool shifting type cutting device
JP2542598B2 (en) Work processing equipment
KR100238982B1 (en) Apparatus for processing screw and controlling method thereof
JPS6440290A (en) Profile controller for robot
US4720629A (en) Pattern tracer with electronic kerf control with adjustably delayed sampling pulse
JP3440308B2 (en) How to adjust the detector
JPH0374482B2 (en)
JPS61221802A (en) Searching system for original point of robot arm