JPH0414293A - Shielding case - Google Patents
Shielding caseInfo
- Publication number
- JPH0414293A JPH0414293A JP11580690A JP11580690A JPH0414293A JP H0414293 A JPH0414293 A JP H0414293A JP 11580690 A JP11580690 A JP 11580690A JP 11580690 A JP11580690 A JP 11580690A JP H0414293 A JPH0414293 A JP H0414293A
- Authority
- JP
- Japan
- Prior art keywords
- cases
- shield case
- board
- end faces
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 14
- 229920003023 plastic Polymers 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明はプラスチック成形品で形成されるシールドケー
スの改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an improvement in a shield case formed of a plastic molded product.
(従来の技術)
携帯無線電話装置等の無線装置では、電波雑音干渉(E
MI)を防止するため主要回路部はシールドケースで覆
われる構成とされる。(Prior art) Radio equipment such as mobile radio telephones suffer from radio noise interference (E
In order to prevent MI), the main circuit section is covered with a shield case.
このシールドケースはアルミダイカスト等の金属部材に
て形成されるのが一般的であるが、近年、機器の小形軽
量化が益々要求されており、それに伴いプラスチック成
形品に金属メッキを施して形成される場合も多くなって
いる。This shield case is generally made of a metal member such as aluminum die-casting, but in recent years there has been an increasing demand for smaller and lighter equipment, and in response to this, it has been made by applying metal plating to a plastic molded product. There are many cases where this is the case.
第3図及び第4図にこの種の従来のシールドケース及び
その取付構造を示す。FIGS. 3 and 4 show this type of conventional shield case and its mounting structure.
これらの図において、1は上シールドケース、2は下シ
ールドケース、3はプリント配線板である。In these figures, 1 is an upper shield case, 2 is a lower shield case, and 3 is a printed wiring board.
上下のシールドケース1,2はメッキ用ABS樹脂の成
形品にニッケルメッキを施すことにより形成されている
。また、上シールドケース1には、ねじ5の挿入穴6を
有する座7が形成され、下シールドケース2には、ねじ
ヲと螺合するねじ穴8を有する座9が座7と対応させて
形成されている。The upper and lower shield cases 1 and 2 are formed by applying nickel plating to a molded product of ABS resin for plating. Further, the upper shield case 1 is formed with a seat 7 having an insertion hole 6 for the screw 5, and the lower shield case 2 is formed with a seat 9 corresponding to the seat 7 and having a screw hole 8 for engaging the screw. It is formed.
そして、上シールドケース1はプリント配線板3の表面
11側に配置され、下シールドケース2はプリント配線
板3の裏面12側に配置され、上下シールドケース1.
2はねじ5にてプリント配線板3に共締めされる。The upper shield case 1 is arranged on the front surface 11 side of the printed wiring board 3, the lower shield case 2 is arranged on the back surface 12 side of the printed wiring board 3, and the upper and lower shield cases 1.
2 are jointly fastened to the printed wiring board 3 with screws 5.
ところで、プラスチック成形品にメッキを施す場合のメ
ッキ槽の温度は60’ C程度であり、この温度でメッ
キを行うと、高圧力、高温度で行われる射出成形の際に
成形品に残る残留応力がメッキ温度の影響で現れ、第3
図に示す如く、上下のシールドケース1.2は、プリン
ト配線板3と対向する側の端面15.1Bの中央部が凹
む方向に反る場合が多い。そのため、第4図に示す如く
、上下のシールドケース1,2を、長手方向の両端側の
みならず中央部分もねじ5にてプリント配線板3に固定
することにより、端面15.16の中央部分とプリント
配線板3との間に隙間が生じないようにしていた。By the way, when plating plastic molded products, the temperature of the plating bath is about 60'C, and if plating is performed at this temperature, residual stress that remains in the molded product during injection molding performed at high pressure and high temperature. appears due to the influence of plating temperature, and the third
As shown in the figure, the upper and lower shield cases 1.2 are often warped in a direction in which the center portion of the end surface 15.1B on the side facing the printed wiring board 3 is concave. Therefore, as shown in FIG. 4, by fixing the upper and lower shield cases 1 and 2 to the printed wiring board 3 with screws 5 not only at both ends in the longitudinal direction but also at the central portion, the central portion of the end surface 15. It was made to prevent a gap from occurring between the printed wiring board 3 and the printed wiring board 3.
しかし、このように上下のシールドケース12の両端側
及び中央部をねじ止めするのでは、ねじの本数が多くな
るばかりか、上下のシールドケース1.2のねし止め工
数が増大するという不具合があった。However, screwing both ends and the center of the upper and lower shield cases 12 in this way not only increases the number of screws but also increases the number of man-hours required for screwing the upper and lower shield cases 1.2. there were.
(発明が解決しようとする課題)
上述の如く、上記シールドケースでは、基板との間に隙
間が生じないように、多数のねじを用いてシールドケー
スを基板に固定する必要があった。(Problems to be Solved by the Invention) As described above, in the above-described shield case, it is necessary to fix the shield case to the board using a large number of screws so as not to create a gap between the shield case and the board.
本発明はこのような従来の欠点に鑑みてなされたもので
あり、従来よりも少い本数のねじを用いて基板に密着さ
せて取り付けることができるシールドケースを提供する
ことを目的とする。The present invention has been made in view of these conventional drawbacks, and it is an object of the present invention to provide a shield case that can be attached in close contact with a board using fewer screws than the conventional case.
[発明の構成]
(課題を解決するための手段)
本発明では、プラスチック成形品に金属メッキを施して
形成されるシールドケースにおいて、前記シールドケー
スは基板に対向させられる側の端面の中央部が突出する
方向に湾曲させられた構成となっている。[Structure of the Invention] (Means for Solving the Problems) In the present invention, in a shield case formed by applying metal plating to a plastic molded product, the shield case has a central portion of the end face facing the substrate. The structure is curved in the protruding direction.
(作用)
本発明のシールドケースでは、その端面の中央部が先に
基板に接触した状態となり、シールドケースの両端部を
基板にねし止めすると、シールドケースは、プラスチ・
ツクの弾性により、中央部から両端部までの端面が基板
に密着する方向に変形する。(Function) In the shield case of the present invention, the central part of the end surface contacts the board first, and when both ends of the shield case are screwed onto the board, the shield case is made of plastic.
Due to the elasticity of the hook, the end faces from the center to both ends are deformed in a direction that brings them into close contact with the substrate.
(実施例)
以下、本発明の一実施例を第1図及び第2図を参照して
詳述する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to FIGS. 1 and 2.
第1図はシールドケースの組立前後を示す側面図、第2
図はシールドケースを組立てた状態の斜視図である。Figure 1 is a side view showing the shield case before and after assembly, Figure 2
The figure is a perspective view of the assembled shield case.
これらの図において、20は上シールドケース、21は
下シールドケース、22はプリント配線板である。In these figures, 20 is an upper shield case, 21 is a lower shield case, and 22 is a printed wiring board.
上下のシールドケース20.21はメッキ用ABS樹脂
の成形品にニッケルメッキを施すことにより形成される
が、これらの上下のシールドケース20゜21は、第1
図(a)に示す如く、メッキ後の状態において、プリン
ト配線板22と対向する側の端面2425の中央部が突
出する方向に湾曲させられて形成される。The upper and lower shield cases 20 and 21 are formed by applying nickel plating to a molded product of ABS resin for plating.
As shown in Figure (a), in the state after plating, the center portion of the end surface 2425 on the side facing the printed wiring board 22 is curved in a protruding direction.
これらの上下のシールドケース20.21の製造方法と
しては、湾曲した状態の成形品(メ・・ツキ前のシール
ドケース20.21、以下同じ)を金型を用いて直接製
造することも考えられるが、この方法だと金型が複雑に
なり金型の加工工数、コストが増大する。As a manufacturing method for these upper and lower shield cases 20.21, it is also possible to directly manufacture curved molded products (shield cases 20.21 before metal fitting, hereinafter the same) using a mold. However, this method complicates the mold and increases the number of man-hours and costs for mold processing.
そこで、通常のアニール治具を用いて、端面24゜25
の中央部分が突出する方向に反らせる方法が簡便で良い
。すなわち、射出成形を行った後、成形品をそのまま放
置して冷却するのではなく、アニール治具を用いて、強
制的に成形品を反らせた状態で冷却させると良い。尚、
成形品を反らせる量は、メッキ工程で成形品が反対方向
に反る量よりも若干大きくするが、この量は試作を行っ
て決定する。Therefore, using a normal annealing jig, we
A simple and good method is to bend it in the direction in which the central part of the blade protrudes. That is, after performing injection molding, instead of leaving the molded product as it is to cool it, it is preferable to use an annealing jig to forcibly cool the molded product in a warped state. still,
The amount by which the molded product is warped is slightly greater than the amount by which the molded product is warped in the opposite direction during the plating process, but this amount is determined by trial production.
上記の如き形状とされた上下のシールドケース20、2
1は、プリント配線板22の表面26側に上シールドケ
ース20が配置され、裏面27側に下シールドケース2
1が配置されてねじ29によりプリント配線板22に共
締めされる(第2図)。Upper and lower shield cases 20, 2 shaped as above
1, an upper shield case 20 is arranged on the front surface 26 side of the printed wiring board 22, and a lower shield case 2 is arranged on the back surface 27 side.
1 are arranged and fastened together to the printed wiring board 22 with screws 29 (FIG. 2).
この場合に、上下のシールドケース20.21は、夫々
の端面24.25の中央部分が先にプリント配線板22
のアースパターン(図示せず)に接触した状態となり、
シールドケース20.21の長手方向の両端側をねじ2
9で締め付けると、プラスチックの弾性によりケース2
0.21は変形し、中央部分から両端部までの端面24
.25はアースパターンに密着した状態となる。従って
、シールドケース20.21の中央部分をねじ止めしな
くとも、シールドケース20、21の端面24.25は
全体がアースパターンに密着し、シールドケース20.
21内外を良好にシールドできる。In this case, the upper and lower shield cases 20.21 have their respective end surfaces 24.25 centered on the printed wiring board 22 first.
is in contact with the earth pattern (not shown),
Attach both longitudinal ends of the shield case 20 and 21 with screws 2.
When tightened at 9, the elasticity of the plastic will cause case 2 to tighten.
0.21 is deformed and the end face 24 from the center part to both ends
.. 25 is in close contact with the ground pattern. Therefore, even if the center portion of the shield case 20.21 is not screwed, the entire end surfaces 24.25 of the shield cases 20, 21 are in close contact with the ground pattern, and the shield case 20.21 is in close contact with the ground pattern.
21 can be well shielded inside and outside.
[発明の効果]
以上説明したように本発明のシールドケースでは、その
両端側を基板にねじ止めすると、まず基板と対向する端
面の中央部が基板に接触した後、プラスチックの弾性に
よる変形で、ケースの中央部から両端部までの端面が基
板に密着した状態となる。従って、シールドケースの両
端側のみを基板にねじ止めするだけで、シールドケース
の内外を確実にシールドできる。[Effects of the Invention] As explained above, in the shield case of the present invention, when both ends of the shield case are screwed to the board, the central part of the end face facing the board comes into contact with the board, and then deforms due to the elasticity of the plastic. The end faces of the case from the center to both ends are in close contact with the board. Therefore, by simply screwing only both ends of the shield case to the board, the inside and outside of the shield case can be reliably shielded.
第1図及び第2図は本発明の一実施例を説明する図であ
り、第1図(a)及び(b)はシールドケースの基板へ
の取り付は前後を説明する側面図、第2図は基板に取り
付けられたシールドケースの斜視図である。
第3図は従来のシールドケースの斜視図であり、第4図
は第3図のシールドケースを基板に取り付けた状態の斜
視図である。
20・・・上シールドケース
21・・・下シールドケース
22・・・プリント配線板(基板〉
24・・・上シールドケースの端面
25・・・下シールドケースの端面
代理人 弁理士 則 近 憲 佑
同 山王
第1図
第3図
第2図
第4図1 and 2 are diagrams for explaining one embodiment of the present invention, and FIGS. 1(a) and 2(b) are side views illustrating the front and rear views of how the shield case is attached to the board, and FIGS. The figure is a perspective view of the shield case attached to the board. FIG. 3 is a perspective view of a conventional shield case, and FIG. 4 is a perspective view of the shield case of FIG. 3 attached to a board. 20... Upper shield case 21... Lower shield case 22... Printed wiring board (board) 24... End face of upper shield case 25... End face of lower shield case Patent attorney Noriyuki Chika Sanno Figure 1 Figure 3 Figure 2 Figure 4
Claims (1)
リント配線板上の電子部品を覆うようにして前記プリン
ト配線板に取付られるシールドケースにおいて、前記シ
ールドケースはプリント配線板に対向させられる側の端
面の中央部が突出する方向に湾曲させられていることを
特徴とするシールドケース。In a shield case that is formed by applying metal plating to a plastic molded product and is attached to the printed wiring board so as to cover electronic components on the printed wiring board, the shield case is located at the center of the end face of the side facing the printed wiring board. A shield case characterized in that a portion thereof is curved in a protruding direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11580690A JPH0414293A (en) | 1990-05-07 | 1990-05-07 | Shielding case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11580690A JPH0414293A (en) | 1990-05-07 | 1990-05-07 | Shielding case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0414293A true JPH0414293A (en) | 1992-01-20 |
Family
ID=14671552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11580690A Pending JPH0414293A (en) | 1990-05-07 | 1990-05-07 | Shielding case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0414293A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008287261A (en) * | 2007-05-18 | 2008-11-27 | Samsung Sdi Co Ltd | Chassis base assembly and display device having same |
-
1990
- 1990-05-07 JP JP11580690A patent/JPH0414293A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008287261A (en) * | 2007-05-18 | 2008-11-27 | Samsung Sdi Co Ltd | Chassis base assembly and display device having same |
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