JPH04141514A - Method and device for laser beam quenching - Google Patents
Method and device for laser beam quenchingInfo
- Publication number
- JPH04141514A JPH04141514A JP2263738A JP26373890A JPH04141514A JP H04141514 A JPH04141514 A JP H04141514A JP 2263738 A JP2263738 A JP 2263738A JP 26373890 A JP26373890 A JP 26373890A JP H04141514 A JPH04141514 A JP H04141514A
- Authority
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- optical system
- hardened
- hole
- laser
- inner peripheral
- Prior art date
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Links
- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000010791 quenching Methods 0.000 title abstract description 11
- 230000000171 quenching effect Effects 0.000 title abstract description 11
- 230000003287 optical effect Effects 0.000 claims abstract description 169
- 230000002093 peripheral effect Effects 0.000 claims abstract description 44
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 230000005540 biological transmission Effects 0.000 claims description 37
- 239000013307 optical fiber Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000005255 carburizing Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
Abstract
Description
く産業上の利用分針〉
本発明は鉄繭＠料なとの被焼入哨１対象物に形成されｊ
′−穴内周面の１・−ザ焼入れ方法及びその装Ｖに関す
る。
〈従来の技術〉
鉄鋼材料の表向焼入れ法には、従来より火炎焼入れ法、
高周波焼入れ法などがある。ところが、これらの焼入れ
方法は鉄鋼材料に形成さｉｌ、ｔ：直径が１５ｍ以下の
細径穴の内周面の焼入れを行うことは囚粒である。前述
した火炎焼入れ法、高周波焼入れ法などにはノズルやコ
イルなどの部材に寸法的な制約があり、細径穴の内周面
の焼入かには適用することがで艶ない。
そのため、従来、細径穴の内周面の焼入れは浸炭焼入ボ
１によって鉄鋼材料の全ての表面を硬化させていた。
〈発明が解決１ノようとする課題〉
上述した従来の浸炭焼入れ法による鉄鋼材料の表面硬化
処理にあっては、処ｆｌ！ ＠ Ｉｚ部品全体に歪みが
生じてしまうという問題点がある・そのため、歪みを解
圧するために後加Ｔが必要となり、加工性やコストの面
で好＊１゜くなかった。
また、浸炭焼入れ法ではその過程で一括して行わわ、バ
ッチ処理であろｔ】め、一つのバッチの処理には比較的
施工時間を要し、且つ、有る程度多数の部品個数を処理
しないと一つ当たりのコストが割高となり、迅速な部品
確保を行うことができないという問題点があった。
本発明はこのような問題点を解決するものであって、作
業性の向上を図ったレーザ焼入れ方法及びその装置を提
供することを目的とする。
〈課題を解決するための手段〉
上述の目的を達成するための本発明のレーザ焼入れ方法
は、被焼入れ対象物に形成された穴内に光伝送路と集光
光学系と反射光学系を配設し、前記光伝送路の先端部か
ら射出されたレーザ光を前記集光光学系によって平行光
化あるいは集光化して前記反射光学系によって前記被焼
入れ対象物の穴内周面に照射する一方、前記被焼入れ対
象物あるいは反射光学系を光軸に対して回転させると共
に光軸方向に移動させることで前記被焼入れ対象物の穴
内周面にスパイラル状のレーザ焼入れを行うことを特徴
とするものである。
そして、本発明のレーザ焼入れ装置は、被焼入れ対象物
に形成された穴内に配設され先端部からレーザ光を射出
する光伝送路と、前記穴内に配設され射出されたレーザ
光を平行光化あるいは集光化する集光光学系と、平行光
化あるいは集光化されたレーザ光を前記被焼入れ対象物
の穴内周面にスパイラル状に照射する反射光学系とを具
えたことを特徴とするものである。
また、とのレーザ焼入れ装置は、光伝送路と集光光学系
と反射光学系とをレーザ光を透過可能なハウジングにて
一体に保持し、該ハウジングを被焼入れ対象物の穴内に
挿脱自在に支持したことを特徴とするものである。
また、本発明のレーザ焼入れ方法は、被焼入れ対象物に
形成された穴内に光伝送路と集光光学系と円錐反射面を
有する反射光学系を配設し、前記光伝送路の先端部から
射出されたレーザ光を前記集光光学系によって平行光化
あるいは集光化して前記反射光学系によって前記被焼入
れ対象物の穴内周面に放射状に照射する一方、前記被焼
入れ対象物あるいは前記反射光学系を光軸方向に移動さ
せることで前記被焼入れ対象物の穴内周面にレーザ焼入
れを行うことを特徴とするものである。
そして、本発明のレーザ焼入れ装置は、被焼入れ対象物
に形成された穴内に配設され先端部からレーザ光を射出
する光伝送路と、前記穴内に配設され射出されたレーザ
光を平行光化あるいは集光化する集光光学系と、前記穴
内に配設され平行光化あるいは集光化されたレーザ光を
前記被焼入れ対象物の穴内周面に放射状に照射する円錐
反射面を有し前記被焼入れ対象物に対して光軸方向に相
対移動自在な反射光学系とを具えたことを特徴とするも
のである。
また、とのレーザ焼入れ装置は、光伝送路と集光光学系
と反射光学系とをレーザ光を透過可能なハウジングにて
一体に保持し、該ハウジングを被焼入れ対象物の穴内に
挿脱自在に支持したことを特徴とするものである。
更に、とのレーザ焼入れ装置は、光伝送路と集光光学系
とをレーザ光を透過可能なハウジングにて一体に保持し
、該ハウジングを被焼入れ対象物の一方の穴端部に挿脱
自在に支持すると共に、反射光学系を他方の穴端部に挿
脱自在に支持したことを特徴とするものである。
また、本発明のレーザ焼入れ方法は、被焼入れ対象物に
形成された穴内に光伝送路と円錐射出面を有する集光光
学系と円錐反射面を有する反射光学系を配設し、前記光
伝送路の先端部から射出されたレーザ光を前記集光光学
系によって平行光化あるいは集光化して前記反射光学系
によって前記被焼入れ対象物の穴内周面に放射状に照射
する一方、前記被焼入れ対象物あるいは反射光学系を光
軸方向に移動させることで前記被焼入れ対象物の穴内周
面にレーザ焼入れを行うことを特徴とするものである。
、
また、本発明のレーザ焼入れ方法は、被焼入れ対象物に
形成された穴内に光伝送路と集光光学系と円錐反射面を
有する反射光学系を配設し、前記光伝送路の先端部から
射出された１ノーザ光な前記無光光学系によって平行光
化あるいＬｔ集光化して前記反射光学系によって前記被
焼入れ対象物の穴内周面に放射状に照射する一方、前記
被焼入！！１対象物あるいは反射光学系を光軸方向に移
動させろど共に該被焼入れ対象物を前記穴の中心に対し
て回転させることで誠被焼入れ対象物の穴内Ｂ画にレー
ザ焼入れを行うことを特徴とするものである。
く作
用〉
光伝送路から射出されたレーザ光は飽充光学系によって
平行光化あるいは集光化して反射光学系によって被焼入
れ対象物の穴内周面に照射され、その照射された部分に
加熱焼入れ部を形成する。このとき、被焼入れ対象物あ
るいは反射光学系のいずれか一方を相対回転させると共
に光軸方向に移＠させることで被焼入れ対象物の穴内周
面εこスパイラル状のレーザ焼入れが行われる。
まｔ′：、、反射光学系が円銘反射向を有することで、
平行光化あるいは集光化された１・−ザ光は反射光学系
の円錐反射面によって被焼入れ対象物の穴内周面に放射
状に照射され、環状の加熱焼入れ部を形成する。乙のと
鯵、被焼入れ対ｌｋ物あるいは反射光学系を光軸方向に
移動させることでレーザ焼入れが行わ濾する。
Ｙに、集光光学系が円錐射出面を有することで、レーザ
光のリング状モードの集光を行い、これを反射光学系の
円錐反射面によって被焼入れ対象物の穴内周面に放射状
に照射し、球状の加熱焼入れ部を形成する。このとき、
環状の加熱焼入れ部の幅が比較的狭くなってエネルギー
密度が大きくなり、良好なレーザ焼入れが行われる。
まブニ、レーザ光を反射光学系の円錐反射面によって被
焼入れ対象物の穴内周面に放射状に照射するときに、被
焼入れ対象物あるいは反射光学系を光一方向に移動させ
ると共に被焼入れ対象物を穴の中心に対して回転させる
ことで、穴内周面に均一なレーザ焼入わが行われる。
＜：１１！ 施 例〉
以下、図耐に基づいて本発明の実施例を詳細に脱刷する
。
第１図及び１２図に本発明の館ｙの実施例に係るレーザ
焼入れ方法を表す概略な示し、第３図及び露４図にそれ
ｅ実施するｔ二めの具体的なレーザ焼入れ装置、嬉５図
及び第６図にその変形例を示す。
本実施例のレーザ焼入れ方法は、第１図及び第２図に示
すように、被焼入れ対象物１１に形成された大工２内に
光伝送１１Ｘ３とか先光学系１４と反射光学系１５を配
「する。そして、光伝送路１８の先端部から射出された
レーザ光１６を集光光学系１４１こよって平行光化する
と共に集光化して反射光学系】５によって穴１ｚの内周
面に照射し、被焼入れ対象物１１あるいは反射光学系１
５ｅ光軸に対して回転されると共に光軸方向に移動させ
て穴１２の内局耐にスパイラル状の加熱焼入わ部】、７
を形成することでレーザ焼入れを行うものである。
その具体的なレーザ焼入れ装置は、第３顆及び第４図に
示すように、ハウジング３１が中空形状をなし、レーザ
光１６を透過できるようになっている。このハウジング
３１は基端部にコネクタ３２、チ１．−ブ３８が取付け
られ、被焼入れ対象物１１の穴１２の一方の端部（第３
図及び第４図左端）に対して挿脱自在に片持支持されて
いる。
ハウジング３１にはその中央部に沿ってレンズホルダ３
４が貫通しており、ｌ／ンズホルダ３４の内部には光フ
ァイバ３５が支持されている。そして、レンズホルダ３
４には光ファイバ３５の先端部の前方に位置してコリメ
ートレンズ３６と集光レンズ３７が取付けられている。
更に、このレンズ３６．３７の前方には傾斜反射面３８
が形成された折り返しミラー３９がＯリング４０を介し
て取付けられている。
なお、ハウジング３１及びレンズホルダ３４にはそれぞ
れレーザ光１６が通過する開口が形成され、ハウジング
３１の開口にはガスケット４１が取付けられている。ま
た、ハウジング３１とレンズホルダ３４の間には冷却水
＠４２が取付けられている。
而して、被焼入れ対象物１１の穴１２の内周面にレーザ
焼入れ加工を施す場合には、まず、穴１２内にハウジン
グ３１を挿入する。
そして、光ファイバ３１の先端部からレーザ光１６を射
出し、コリメートレンズ３６によって平行光化すると共
に集光レンズ３７によって集光化する。集光されたレー
ザ光１６は折り返しミラー３９によって穴１２の内周面
に照射され、加熱焼入れ部１７が形成される。
このとき、被焼入れ対象物１１に対して折り返しミラー
３９を光軸に対して回転させながら光軸方向に移動させ
る。すると、光により形成された円状の熱源が穴１２の
内周面に沿ってスパイラル状に移動し、この熱源が移動
した領域は光による加熱とその後の部品の熱容量による
自己冷却作用により、穴１２の内周面の近傍のみ所定の
最高温度まで加熱され、その後、冷却されるという温度
変化をたどる。乙の最高到達温度が材料の変態濃度以上
で溶融点以下となれば、その領域は変態硬化するからレ
ーザパワーや移動速度、レーザ光の集光度を適度に変化
させることにより、焼入れ厚さを制御することができる
。
このようにして被焼入れ対象物１１０穴１２の内周面に
レーザ焼入れ加工が行われる。
なお、レーザ光の熱への変換効率を上昇させるためにグ
ラファイト等の塗布剤を被焼入れ対象物１１の穴１２の
内周面に塗布してもよい。
また、前述の実施例のようにデイフォーカス法による焼
入れ処理以外に、折り返しミラー３９の前段にシリント
リルレンズやカライドスコープ、結像光学系等を配置す
る乙とにより、線状あるいはき形状の熱源によってスパ
イラル焼入れ処理でもよい。
更に、スパイラル焼入れ処理のときに、加熱焼入れ部１
７の間隔は折９返しミラー３９の回転速度と移動速度を
適度に設定することで冨々変化させることができる。そ
して、この場合、折り返しミラー３９の回転と移動はハ
ウジング３１全体をもって行ってもよい。
実施例として、５０Ｍ４４５材に対し、内径１３鵬の丸
穴を形成し、ｓｏｏｗ、軸方向挿引速度１０ ｍ／ｗｉ
ｎ Ｎ回転速度２４．５ ｒｐｍで焼入れを行った結果
、焼入れ幅２．７閣、深さ０．３鵬焼入れ間隔（軸方向
の距離）１．７−のスパイラル状の硬化部（母材的３０
０ｈｖに対し硬化１１７００ＨＶ）を得ることができた
。
第５図及び第６図に示す別のレーザ焼入れ装置は、被焼
入れ対象物１１の大１２が貫通孔である場合に使用され
るものである。即ち、中空形状をなすハウジング５１に
はその中央部に光ファイバ５２が支持され、その前方に
位冒してレンズホルダ５３を介してコリメートレンズ５
４と集光レンズ５５が取付けられている。そして、この
ハウジング５は被焼入れ対象物１１の穴１２の一方の端
部（第５図及び第６図左端）に対して挿脱自在に片持支
持されている。
一方、ハウジング５１に対向して傾斜反射面５６が形成
された折り返しミラー５７が配置され、基端部にアダプ
タ５８が固定され、０リング５９を介してコネクタマウ
ント６０が取付けられている。更に、コネクタ６１、チ
ューブ６２が取付けられ、被焼入れ対象物１１の穴１２
の他方の端Ｓ（第５図及び第６図右端）に対して挿脱自
在に片持支持されている。また、折や返しミラー５７に
は冷却水導入用管６３が接続され、冷却水路６４が形成
されている。
而して、被焼入れ対象物１１の穴１２の内周面にレーザ
焼入れ加工を施す場合には、まず、穴１２内に一方から
ハウジング５１を挿入すると共に他方から折り返しミラ
ー５７を押入する。そして、光ファイバ５２の先端部か
らレーザ光１Ｇを射出し、Ｐｉ−】／ンズ５４゜５５に
よって集光化し、折り返しミラー５７によって穴１２の
内周面に照射され、加熱焼入れ部２１が形成されろ。
このとき、被焼入れ対象物１１に対して折り返し波ラー
５７を光軸に対して回転さ１ｒながら光軸方向に移動さ
れることで、被焼入へ対象物１１の穴１ｚの内Ｒ西にス
パイラル状のレーザ焼入ｆｉ加工が行われる。
飾７図乃至第９図に本発明の篤２の実施例に係るレーザ
焼入れ方法を表す概略を示し、第１０図乃至第１３図に
そわを実施するための具体的な１／−ザ焼入れ装置、第
１４閲及び第１５図にその変形側を示す。なお、前述の
各実施例ど同一の機能を有する部材には同一の符号を付
して重複する説明は省略する。
本夾施例のレーザ焼入な方法は、第７図乃乃至第９図に
示すように、被焼入れ対象物１１の穴１２内に光伝送路
１３と集光光学系１８と円錐反射面１９を有する反射光
学系２０を配設する。そして、光伝送路１３の先端部か
ら射Ｉｊｊされｔ：レーザ光１６を集光光学系１８によ
って平行光化あるいは集光化して反射光学系２０（ごよ
って穴１２の内周面ζこ放射状ｔこ照射し、被焼入れ対
象物１１あるいは反射光学系２０ｔｅ光軸方向に移動さ
することで被焼入れ対象物１１の穴内周面にレーザ焼入
れを行うものである。
その具体的なレーザ焼入れ１！１１は、第１１図乃至第
１３図に示すように、中空形状のハウジング３１が被焼
入れ対象物Ｊ、１の穴１２の一方の端部に対して挿脱自
在に片持支持されている。
ハウジング３１には光ファイバ３５が支持さ１１、その
前方に位Minute hand for industrial use> The present invention is a minute hand formed on an object to be incinerated with an iron cocoon.
1.- The method of hardening the inner circumferential surface of the hole and the method thereof. <Conventional technology> Surface hardening methods for steel materials have traditionally been flame hardening methods,
Examples include induction hardening. However, in these hardening methods, it is difficult to harden the inner circumferential surface of a small hole with a diameter of 15 m or less formed in a steel material. The above-mentioned flame hardening method, induction hardening method, etc. have dimensional restrictions on members such as nozzles and coils, and cannot be applied to hardening the inner peripheral surface of a small diameter hole. Therefore, conventionally, the inner circumferential surface of a small diameter hole was hardened by using a carburizing hardening bolt 1 to harden the entire surface of the steel material. <Problems to be solved by the invention> In surface hardening treatment of steel materials by the conventional carburizing and quenching method described above, the process fl! @ Iz There is a problem that distortion occurs in the entire part. Therefore, post-addition T is required to relieve the distortion, which is not favorable in terms of workability and cost. In addition, in the carburizing and quenching method, the process is carried out all at once, so it is a batch process, so it takes a relatively long time to process one batch, and a certain number of parts must be processed. There was a problem in that the cost per unit was relatively high and parts could not be quickly secured. The present invention is intended to solve these problems, and an object of the present invention is to provide a laser hardening method and an apparatus therefor that improve workability. <Means for Solving the Problems> The laser hardening method of the present invention for achieving the above-mentioned object includes disposing an optical transmission path, a condensing optical system, and a reflecting optical system in a hole formed in an object to be hardened. The laser beam emitted from the tip of the optical transmission path is collimated or condensed by the condensing optical system and irradiated onto the inner circumferential surface of the hole of the object to be hardened by the reflective optical system; The method is characterized in that spiral-shaped laser hardening is performed on the inner peripheral surface of the hole of the object to be hardened by rotating the object to be hardened or the reflective optical system with respect to the optical axis and moving it in the direction of the optical axis. . The laser hardening device of the present invention includes an optical transmission path that is disposed in a hole formed in the object to be hardened and emits a laser beam from its tip, and an optical transmission path that is disposed in the hole and converts the emitted laser beam into a parallel beam. The method is characterized by comprising a condensing optical system that converts or condenses the laser beam, and a reflective optical system that irradiates the inner peripheral surface of the hole of the object to be hardened in a spiral manner with the collimated or condensed laser beam. It is something to do. In addition, the laser hardening device of 2008 holds the optical transmission path, the condensing optical system, and the reflective optical system together in a housing that can transmit laser light, and the housing can be inserted into and removed from the hole in the object to be hardened. It is characterized by its support. Further, in the laser hardening method of the present invention, an optical transmission path, a condensing optical system, and a reflection optical system having a conical reflection surface are disposed in a hole formed in the object to be hardened, and from the tip of the optical transmission path, The emitted laser beam is collimated or condensed by the condensing optical system and radially irradiated onto the inner circumferential surface of the hole of the object to be hardened by the reflection optical system, while the object to be hardened or the reflection optical system The present invention is characterized in that laser hardening is performed on the inner peripheral surface of the hole of the object to be hardened by moving the system in the optical axis direction. The laser hardening device of the present invention includes an optical transmission path that is disposed in a hole formed in the object to be hardened and emits a laser beam from its tip, and an optical transmission path that is disposed in the hole and converts the emitted laser beam into a parallel beam. a condensing optical system that converts or condenses light, and a conical reflecting surface that is disposed in the hole and radially irradiates the inner peripheral surface of the hole of the object to be hardened with the collimated or condensed laser beam. The present invention is characterized in that it includes a reflective optical system that is movable relative to the object to be hardened in the optical axis direction. In addition, the laser hardening device of 2008 holds the optical transmission path, the condensing optical system, and the reflective optical system together in a housing that can transmit laser light, and the housing can be inserted into and removed from the hole in the object to be hardened. It is characterized by its support. Furthermore, the laser hardening device of 2008 holds the optical transmission line and the condensing optical system together in a housing that can transmit laser light, and the housing can be freely inserted into and removed from one end of the hole of the object to be hardened. The reflective optical system is supported at the end of the other hole so as to be freely insertable and removable. Further, the laser hardening method of the present invention includes disposing an optical transmission path, a condensing optical system having a conical exit surface, and a reflecting optical system having a conical reflecting surface in a hole formed in the object to be hardened. The laser beam emitted from the tip of the path is collimated or condensed by the condensing optical system, and is radially irradiated onto the inner peripheral surface of the hole of the object to be hardened by the reflecting optical system. This method is characterized in that laser hardening is performed on the inner peripheral surface of the hole of the object to be hardened by moving the object or the reflective optical system in the optical axis direction. Further, in the laser hardening method of the present invention, an optical transmission path, a condensing optical system, and a reflective optical system having a conical reflective surface are disposed in a hole formed in an object to be hardened, and the tip of the optical transmission path is One nose light emitted from the lightless optical system is collimated or condensed by the lightless optical system, and is irradiated radially onto the inner peripheral surface of the hole of the object to be hardened by the reflective optical system. ! 1. Laser hardening is performed on the B area of the hole of the object to be hardened by moving the object or the reflective optical system in the optical axis direction and simultaneously rotating the object to be hardened with respect to the center of the hole. That is. The laser beam emitted from the optical transmission path is collimated or condensed by the saturation optical system, and is irradiated onto the inner peripheral surface of the hole of the object to be hardened by the reflective optical system, and the irradiated part is heated and hardened. form a section. At this time, by relatively rotating either the object to be hardened or the reflective optical system and moving it in the optical axis direction, spiral laser hardening of the inner circumferential surface of the hole of the object to be hardened is performed. Mat':,, since the reflective optical system has a circular reflection direction,
The collimated or condensed 1.-the light is radially irradiated onto the inner circumferential surface of the hole of the object to be hardened by the conical reflection surface of the reflection optical system, thereby forming an annular heated and hardened portion. Laser hardening is performed by moving the object to be hardened or the reflective optical system in the optical axis direction. At Y, the condensing optical system has a conical exit surface, which condenses the ring-shaped laser beam, and irradiates it radially onto the inner peripheral surface of the hole of the object to be hardened using the conical reflective surface of the reflective optical system. Then, a spherical heat-quenched part is formed. At this time,
The width of the annular heat-hardened portion is relatively narrow, the energy density is increased, and good laser hardening is performed. When the laser beam is radially irradiated onto the inner peripheral surface of the hole of the object to be hardened by the conical reflecting surface of the reflective optical system, the object to be hardened or the reflective optical system is moved in one direction of the light, and the object to be hardened is By rotating about the center of the hole, uniform laser hardening is performed on the inner peripheral surface of the hole. <:11! Examples> Hereinafter, examples of the present invention will be described in detail based on illustrations. 1 and 12 schematically show a laser hardening method according to an embodiment of the present invention, and FIGS. 3 and 4 show a second specific laser hardening apparatus for carrying out the method. Modifications thereof are shown in FIGS. 5 and 6. In the laser hardening method of this embodiment, as shown in FIGS. 1 and 2, an optical transmission 11X3, a forward optical system 14, and a reflective optical system 15 are arranged in a carpenter 2 formed on an object 11 to be hardened. Then, the laser beam 16 emitted from the tip of the optical transmission line 18 is collimated and condensed by the condensing optical system 141, and is irradiated onto the inner circumferential surface of the hole 1z by the reflective optical system 5. , the object to be hardened 11 or the reflective optical system 1
5e Rotated with respect to the optical axis and moved in the optical axis direction to form a spiral heating hardened portion inside the hole 12], 7
Laser hardening is performed by forming. In the specific laser hardening device, as shown in the third condyle and FIG. 4, the housing 31 has a hollow shape and can transmit the laser beam 16. This housing 31 has a connector 32 at the proximal end, and 1. - The tube 38 is attached to one end (the third
It is supported in a cantilever manner so as to be freely insertable and removable. The housing 31 has a lens holder 3 along its center.
4 passes through the lens holder 34, and an optical fiber 35 is supported inside the l/lens holder 34. And lens holder 3
4, a collimating lens 36 and a condensing lens 37 are attached to the front end of the optical fiber 35. Furthermore, an inclined reflective surface 38 is provided in front of this lens 36,37.
A folding mirror 39 is attached via an O-ring 40. Note that the housing 31 and the lens holder 34 each have an opening through which the laser beam 16 passes, and a gasket 41 is attached to the opening of the housing 31. Further, cooling water @42 is installed between the housing 31 and the lens holder 34. When performing laser hardening on the inner peripheral surface of the hole 12 of the object to be hardened 11, the housing 31 is first inserted into the hole 12. Then, the laser beam 16 is emitted from the tip of the optical fiber 31, collimated by the collimating lens 36, and condensed by the condensing lens 37. The focused laser beam 16 is irradiated onto the inner circumferential surface of the hole 12 by a folding mirror 39, and a heat-hardened portion 17 is formed. At this time, the folding mirror 39 is moved in the optical axis direction with respect to the object 11 to be hardened while being rotated with respect to the optical axis. Then, the circular heat source formed by the light moves in a spiral shape along the inner peripheral surface of the hole 12, and the area to which this heat source moves is heated by the light and then self-cooled by the heat capacity of the parts, causing the hole to close. A temperature change is followed in which only the vicinity of the inner circumferential surface of No. 12 is heated to a predetermined maximum temperature, and then cooled. If the maximum temperature of B is higher than the transformation concentration of the material and lower than the melting point, that area will undergo transformation hardening, so the quenching thickness can be controlled by appropriately changing the laser power, moving speed, and laser beam focusing degree. can do. In this way, the laser hardening process is performed on the inner peripheral surface of the hole 12 of the object to be hardened 110. Note that a coating agent such as graphite may be applied to the inner peripheral surface of the hole 12 of the object to be hardened 11 in order to increase the conversion efficiency of laser light into heat. In addition to the hardening process using the day focus method as in the above-mentioned embodiments, linear or square-shaped Spiral quenching may be used depending on the heat source. Furthermore, during the spiral quenching process, the heating quenching part 1
The interval 7 can be varied widely by appropriately setting the rotational speed and moving speed of the folding mirror 39. In this case, the entire housing 31 may be used to rotate and move the folding mirror 39. As an example, a round hole with an inner diameter of 13 mm was formed in 50M445 material, and the axial insertion speed was 10 m/wi.
As a result of hardening at a rotational speed of 24.5 rpm, a spiral hardened part (base metal 30
It was possible to obtain a cure of 11,700 HV) compared to 0 HV. Another laser hardening apparatus shown in FIGS. 5 and 6 is used when the large part 12 of the object 11 to be hardened is a through hole. That is, an optical fiber 52 is supported in the center of a hollow housing 51, and a collimating lens 5 is placed in front of the housing 51 through a lens holder 53.
4 and a condenser lens 55 are attached. The housing 5 is cantilevered to one end (the left end in FIGS. 5 and 6) of the hole 12 of the object 11 to be hardened so as to be insertable and removable. On the other hand, a folding mirror 57 having an inclined reflective surface 56 is disposed facing the housing 51, an adapter 58 is fixed to the base end, and a connector mount 60 is attached via an O-ring 59. Furthermore, a connector 61 and a tube 62 are attached to the hole 12 of the object to be hardened 11.
It is cantilevered to the other end S (the right end in FIGS. 5 and 6) so that it can be inserted and removed. Further, a cooling water introduction pipe 63 is connected to the folding mirror 57, and a cooling water channel 64 is formed. When performing laser hardening on the inner peripheral surface of the hole 12 of the object to be hardened 11, first, the housing 51 is inserted into the hole 12 from one side, and the folding mirror 57 is pushed in from the other side. Then, 1G of laser light is emitted from the tip of the optical fiber 52, condensed by the Pi-]/ lenses 54 and 55, and irradiated onto the inner circumferential surface of the hole 12 by the folding mirror 57, thereby forming the heat-hardened part 21. reactor. At this time, by moving the folding waver 57 toward the object 11 to be hardened in the direction of the optical axis while rotating 1r with respect to the optical axis, the waveform 57 is moved toward the inner R west of the hole 1z of the object 11 to be hardened. Spiral laser hardening fi processing is performed. Figures 7 to 9 schematically show the laser hardening method according to the second embodiment of the present invention, and Figures 10 to 13 show a specific 1/-ther hardening apparatus for performing the warping. , the modified side is shown in Fig. 14 and Fig. 15. It should be noted that members having the same functions in each of the above-described embodiments are given the same reference numerals and redundant explanations will be omitted. In the laser hardening method of this embodiment, as shown in FIGS. 7 to 9, an optical transmission path 13, a condensing optical system 18, and a conical reflecting surface 19 are placed in a hole 12 of an object 11 to be hardened. A reflective optical system 20 is provided. Then, the laser beam 16 is emitted from the tip of the optical transmission path 13 and is collimated or condensed by the condensing optical system 18, and the reflected optical system 20 (thereby, the inner circumferential surface of the hole 12 By irradiating this and moving the object to be hardened 11 or the reflective optical system 20te in the optical axis direction, laser hardening is performed on the inner peripheral surface of the hole in the object to be hardened 11. Specific laser hardening 1!11 As shown in FIGS. 11 to 13, a hollow housing 31 is cantilevered and removably inserted into one end of the hole 12 of the object to be hardened J, 1. An optical fiber 35 is supported by 31 and is positioned in front of it.
【してコリメートレンズ３６がレンズホルダ３
４によって取付けら幻、このレンズ３６の前方には円錐
状の反射面７１が形成された円錐ミラー７２が取付けら
ズ１ている。
なお、レンズホルダ、ダ３４にはガスを排出するガス孔
７３が形成されることで、冷却ガス還路７４が般けられ
、また、ハウジング３１の先端部にはフィン７５が設け
らｉｔている。
面して、被焼入ｔ１対象物１１の穴１２の内８面にレー
ザ焼入れ加工を施す場合には、まず、穴！ｚ内にハウジ
ング３１を挿入する。
そして、光ファイバ３１の先端部からレーザ光１６を射
出し、コリメートレンズ３６によ１て平行光化１７、レ
ーザ光１６は円錐ミラー７２！ｉ：よ７て穴１２の内周
面に放射状に照射され、加熱焼入ね部２１が形成される
。
このとき、被焼入れ対象物１１に対して円絃赴う−７２
を光軸方向ξζ移動させる。すると、光によφ形成され
ｉ：Ｒ状の熱源が穴１２に沿って移動し、被焼入れ対象
物１１の穴１２の内周面にレーザ焼入れ加工が行われる
。
実施例として、Ｓ ＣＭ ４４５材に対し、内径１３「
の丸穴を形成し、９２０Ｗ、熱源幅約２ＩｌｌＩＩで焼
入滅１を行）た結果、厚さ０．３Ｎの円環状の硬化部（
母材約３００１ｉｖ弱に対し硬化部６５０ ＢＹ）を得
ることがでかな。
第１４図及び第１５図に示す別のレーザ焼入れ装置は、
被焼入れ対象物１１の穴１２が貫通孔である場合に使用
されるものであり、ハウジング５１に光ファイバ５２と
フリメートレンズ５４が取付けられ、このハウジング５
１は被焼入１対象物１１０穴１２の一方の端部に対して
挿脱自在に片持支持さズ１ている。
一方、ハウジング５１１こ対向して円鍍状の反射向７６
が形成された円錐ミラー７７が配置され、内部に冷却水
導入用銅パイヅ６３が接続され、冷却水路６４が形成さ
れ、ている。
而して、被焼入れ対象物１１０穴１２の内周面にし〜ザ
焼入れ加工を施す場合には、Ｊ・ず、穴】、２内に一方
からハウジング５１を挿入すると共に他方から円釘ミラ
ー７７を挿入する。そして、光ファイバ５２からレーザ
光１６をレンズ５４と円錐ミラー７７によって穴１２の
内周面に照射し、このと艶、被焼入れ対象物１１に対し
て円錐ミラー７７を光軸方向に移動させることで、大１
２の内周面に環状の加熱焼入れ部２１が形成されてレー
ザ焼入れ加工が行われる。
第１６図乃至第１８図に本発明の第３の実施例に係るレ
ーザ焼入れ方法の概略を示す。
本実施例のレーザ焼入れ方法は、第１６図及び第１７図
に示すように、被焼入れ対象物１１の穴１２内に光伝送
４１Ｂ（光ファイバ３５）と円錐射出面２２を有する集
光光学系２３（コリメートレンズ３６、アクシコンレン
ズ８１）と円錐反射面１９ （反射Ｎ７１）を有する反
射光学系２０（円錐ミラー７２）を配設する。
そして、光伝送路１３の先端部から射出されたレーザ光
１６を集光光学系２３によって平行光化すると共に集光
化して反射光学系２゜によって被焼入れ対象物１１の穴
１２内周面に放射状に照射する。
このとき、アクシコンレンズ８１によって集光化された
レーザ光１６は反射光学系２０によって被焼入れ対象物
１１の穴１２内周面に放ａ状に照射されるが、アクシコ
ンレンズ８１の射出面は円錐形状をなしているため、第
１８図に示すように、円錐ミラー７２の頂点に光を集中
させずに環状の加熱焼入れ部２１の幅を比較的狭くする
ことで、エネルギー密度を大きくすることができる。
そして、円錐ミラー７２を光軸方向に移動させることで
環状の熱源が穴１２に沿って移動してレーザ焼入れ加工
が行われる。
第１９図及び第２０図に本発明の第４の実施例に係るレ
ーザ焼入れ方法の概略を示す。
本実施例のレーザ焼入れ方法は、第１９図及び第２０図
に示すように、被焼入れ対象物１１の穴１２内に光伝送
路１３（光ファイバ３５）と集光光学系１８（コリメー
トレンズ３６）と円錐反射面１９（反射面７１）を有す
る反射光学系２０（円錐ミラー７２）を配設する。
そして、射出されたレーザ光１６をコリメートレンズ８
６によって平行光化して反射光学系２０によって被焼入
れ対象物１１の穴１２内周面に放射状に照射する。
このとき、被焼入れ対象物１１あるいは反射光学系２０
を光軸方向に移動させると共に被焼入れ対象物１１を穴
１２の中心に対して回転させることで、環状の熱源が穴
１２に沿って移動してレーザ焼入れ加工が行われる。
このように環状の熱源が穴１２に沿って移動するときに
被焼入れ対象物１１を回転させるので、円錐ミラー７２
の中心と穴１２の中心がずれて設定されていたとしても
、全周にわたって均一な焼入れ処理が行われる。
〈発明の効果〉
以上、実施例を挙げて詳細に説明したように本発明のレ
ーザ焼入れ方法及び装置によれば、光伝送路から射出さ
れたレーザ光が集光光学系並びに反射光学系によって被
焼入れ対象物の穴内周面に照射されて加熱焼入れ部を形
成する一方、被焼入れ対象物あるいは反射光学系のいず
れか一方を相対回転させると共に光軸方向に移動させる
ことで被焼入れ対象物の穴内周面にスパイラル状のレー
ザ焼入れを行うようにしたので、細径穴の内周面の焼入
れ処理が精度良く可能となり、工数を低減することがで
きると共にバッチ処理を単品ごとにライン処理でき納期
管理を春易とすることができる。
また、反射光学系に円錐反射面を設け、平行光化あるい
は集光化されたレーザ光をこの円錐反射面によって被焼
入れ対象物の穴内周面に放射状に照射して環状の加熱焼
入れ部を形成しレーザ焼入れ行うようにしたので、細径
穴の内周面の焼入れ処理を簡単に且つ精度良く行うこと
ができ、工数を低減することができる。
その結果、レーザ焼入れ処理の作業性を向上させること
ができる。
更に、集光光学系に円錐射出面を設け、し−ザ光のリン
グ状モードの皇光を行い、これを反射光学系の円錐反射
面によって被焼入九対峡物の穴内周面に放射状に照射し
て環状の加熱焼入れ部な形成しレーザ焼入れ行うように
したので、環状の加熱焼入れ部の幅が比較的狭くなって
エネルギー密度な大さ（することができると共に飾光光
学系の破損や溶融を防止し、安定した良好な１．／−ザ
焼入れを行うことができる。
求に、レーザ光を反射光学系の円錐反射面によって放射
状に照射するときに被焼入れ対献物あるいは反射光学系
を光軸方向に移動させると共に被焼入れ対象物を穴の中
心に対して回転させるようにしたので、穴内周面に均一
なレーザ焼入ｉ１を行うことかで％石。[The collimating lens 36 is attached to the lens holder 3.]
A conical mirror 72 having a conical reflecting surface 71 is mounted in front of the lens 36. Note that a cooling gas return path 74 is opened by forming a gas hole 73 for discharging gas in the lens holder holder 34, and a fin 75 is provided at the tip of the housing 31. . When laser hardening is performed on the eight surfaces of the hole 12 of the object 11 to be hardened t1, first, the hole! Insert the housing 31 into the z. Then, the laser beam 16 is emitted from the tip of the optical fiber 31, and is converted into parallel light 17 by the collimating lens 36, and the laser beam 16 is reflected by the conical mirror 72! i: The inner peripheral surface of the hole 12 is irradiated radially to form a heat-hardened portion 21. At this time, a circular string is applied to the object 11 to be quenched.
is moved in the optical axis direction ξζ. Then, the i:R-shaped heat source formed by the light moves along the hole 12, and laser hardening is performed on the inner peripheral surface of the hole 12 of the object 11 to be hardened. As an example, for S CM 445 material, an inner diameter of 13"
As a result, a circular hardened part with a thickness of 0.3N (
I wonder if it is possible to obtain a hardened part of 650 BY) for the base material of about 3001 IV. Another laser hardening device shown in FIGS. 14 and 15 is
This is used when the hole 12 of the object to be hardened 11 is a through hole, and an optical fiber 52 and a frimate lens 54 are attached to a housing 51.
1 is supported by a cantilever on one end of a hole 12 in which an object to be hardened 110 can be freely inserted and removed. On the other hand, the circular reflection direction 76 is opposite to the housing 511.
A conical mirror 77 is disposed in which a cooling water introduction copper pipe 63 is connected, and a cooling water channel 64 is formed. When the inner peripheral surface of the hole 12 of the object to be hardened is subjected to the hardening process, the housing 51 is inserted into the hole 2 from one side, and the circular nail mirror 77 is inserted from the other side. Insert. Then, the laser beam 16 is irradiated from the optical fiber 52 to the inner peripheral surface of the hole 12 through the lens 54 and the conical mirror 77, and the conical mirror 77 is then moved in the optical axis direction relative to the object 11 to be polished and hardened. So, 1 large
An annular heat-hardened portion 21 is formed on the inner circumferential surface of 2, and laser hardening processing is performed. 16 to 18 schematically show a laser hardening method according to a third embodiment of the present invention. As shown in FIGS. 16 and 17, the laser hardening method of this embodiment uses a condensing optical system having a light transmission 41B (optical fiber 35) and a conical exit surface 22 in the hole 12 of the object to be hardened 11. 23 (collimating lens 36, axicon lens 81) and a reflective optical system 20 (conical mirror 72) having a conical reflective surface 19 (reflection N71). The laser beam 16 emitted from the tip of the optical transmission path 13 is parallelized and condensed by the condensing optical system 23, and is applied to the inner peripheral surface of the hole 12 of the object to be hardened 11 by the reflective optical system 2°. Irradiates radially. At this time, the laser beam 16 focused by the axicon lens 81 is radially irradiated onto the inner peripheral surface of the hole 12 of the object to be hardened 11 by the reflective optical system 20, but the exit surface of the axicon lens 81 Since it has a conical shape, as shown in FIG. 18, the energy density is increased by making the width of the annular heating and hardening part 21 relatively narrow without concentrating the light on the apex of the conical mirror 72. be able to. Then, by moving the conical mirror 72 in the optical axis direction, the annular heat source moves along the hole 12 and laser hardening processing is performed. 19 and 20 schematically show a laser hardening method according to a fourth embodiment of the present invention. In the laser hardening method of this embodiment, as shown in FIGS. 19 and 20, an optical transmission line 13 (optical fiber 35) and a condensing optical system 18 (collimating lens 36 ) and a reflective optical system 20 (conical mirror 72) having a conical reflective surface 19 (reflective surface 71). Then, the emitted laser beam 16 is converted into a collimating lens 8.
6, the parallel light is made into parallel light and is irradiated radially onto the inner peripheral surface of the hole 12 of the object 11 to be hardened by the reflective optical system 20. At this time, the object to be hardened 11 or the reflective optical system 20
By moving the object 11 in the optical axis direction and rotating the object 11 to be hardened with respect to the center of the hole 12, the annular heat source moves along the hole 12 and laser hardening is performed. Since the annular heat source rotates the object 11 to be hardened as it moves along the hole 12, the conical mirror 72
Even if the center of the hole 12 and the center of the hole 12 are set to be offset from each other, uniform hardening treatment is performed over the entire circumference. <Effects of the Invention> As described above in detail with reference to examples, according to the laser hardening method and apparatus of the present invention, the laser beam emitted from the optical transmission path is covered by the condensing optical system and the reflecting optical system. The inner peripheral surface of the hole of the object to be hardened is irradiated to form a heated hardened part, while the object to be hardened or the reflective optical system is relatively rotated and moved in the optical axis direction to form a heated part inside the hole of the object to be hardened. By performing spiral laser hardening on the circumferential surface, it is possible to harden the inner peripheral surface of a small diameter hole with high precision, reducing man-hours, and batch processing can be performed on a line for each individual item, allowing delivery date management. can be taken as spring. In addition, a conical reflective surface is provided in the reflective optical system, and the conical reflective surface irradiates the parallel or condensed laser beam radially onto the inner peripheral surface of the hole of the object to be hardened to form an annular heated and hardened part. Since the laser hardening is performed, the hardening process of the inner circumferential surface of the small diameter hole can be easily and accurately performed, and the number of man-hours can be reduced. As a result, the workability of the laser hardening process can be improved. Furthermore, a conical exit surface is provided in the condensing optical system to emit a ring-shaped mode of laser light, which is then radially applied to the inner peripheral surface of the hole of the object to be hardened by the conical reflective surface of the reflective optical system. Since the annular heat-hardened part is formed by laser irradiation, the width of the annular heat-hardened part becomes relatively narrow and the energy density increases (as well as damage to the decorative optical system). It is possible to perform stable and good laser hardening by preventing melting or melting. By moving the system in the optical axis direction and rotating the object to be hardened with respect to the center of the hole, uniform laser hardening can be performed on the inner peripheral surface of the hole.
第１図は本発明の第１の実施例に係るレーザ焼入れ方法
を表す概略図、第２図は第１図のπ−Ｕ断面図、第３図
はそれを実施するための具体的なレーザ焼入れ装置の構
成図、剪４図ばその断面図、第５図はその変形例に係ろ
レーザ焼入れ装置の構成図、第６図はその断面図、第７
図は本発明の第２の実施側孔こ係るレーザ焼入れ方法を
表す概略図、第８閃１．ｉ第７図の■−■断面図、第９
図は焼入かの進行状態を表す説明図、第１０図はそ嘘１
を実施するための具体的なレーザ焼入れ騎費の構成図、
第１１図はその断面図、第１２閏は第ｉ５、図のｘｉ
−ｘｉ Ｗｆｔ面図、簗１３図は第１ ｘ１５ｆｆｌ）
Ｘ’Ｊ［−Ｘｌ［ｉ面図、節１４１ｕｔの変形例に係る
レーザ焼入れ装置の構成図、第１５閏はその断面図、第
１６図は本発明の第３の実施例に係ろレーザ焼入か、方
法の概略図、第１７図は第１６図のＸ■−Ｘ■断面閲、
第１８図は焼入れの進行状態を表す説明図、第１９図は
本発明の第４の実施例に係るレーザ焼入れ方法の概略図
、第２０図は第１９図のｘｘ −ｘｘ断面図である。
図 面 中、
１１は被焼入れ対象物、
１２は穴、
３は光伝送路、
４．１８ｐ２３は集光光学系、
５．２０は反射光学系、
６はレーザ光、
７．２１は加熱焼入れ部、
９は円錐反射面、
２は円錐射出面である。
特許出販人
三菱重工業株式会社
代 理 人FIG. 1 is a schematic diagram showing the laser hardening method according to the first embodiment of the present invention, FIG. 2 is a π-U cross-sectional view of FIG. 1, and FIG. 3 is a specific laser for implementing the method. Fig. 5 is a block diagram of a laser hardening apparatus according to a modification thereof, Fig. 6 is a cross-sectional view thereof, and Fig. 7 is a block diagram of the hardening device.
The figure is a schematic diagram showing the laser hardening method according to the second embodiment of the present invention. i Figure 7 ■-■ sectional view, No. 9
The figure is an explanatory diagram showing the progress of quenching, and Figure 10 is 1
A configuration diagram of a specific laser hardening kit for carrying out the
Figure 11 is its cross-sectional view, the 12th leap is i5, and the xi in Figure
-xi Wft view, 13th view is 1st x15ffl)
X'J [-Xl A schematic diagram of the method, Figure 17 is a cross-sectional view of Figure 16,
FIG. 18 is an explanatory diagram showing the progress of hardening, FIG. 19 is a schematic diagram of a laser hardening method according to a fourth embodiment of the present invention, and FIG. 20 is a sectional view taken along line xx-xx in FIG. 19. In the drawing, 11 is the object to be hardened, 12 is the hole, 3 is the optical transmission line, 4.18p23 is the condensing optical system, 5.20 is the reflective optical system, 6 is the laser beam, 7.21 is the heating hardening part , 9 is a conical reflection surface, and 2 is a conical exit surface. Patent seller Mitsubishi Heavy Industries, Ltd. Agent
Claims (9)
光光学系と反射光学系を配設し、前記光伝送路の先端部
から射出されたレーザ光を前記集光光学系によって平行
光化あるいは集光化して前記反射光学系によって前記被
焼入れ対象物の穴内周面に照射する一方、前記被焼入れ
対象物あるいは反射光学系を光軸に対して回転させると
共に光軸方向に移動させることで前記被焼入れ対象物の
穴内周面にスパイラル状のレーザ焼入れを行うことを特
徴とするレーザ焼入れ方法。(1) An optical transmission path, a condensing optical system, and a reflective optical system are arranged in a hole formed in the object to be hardened, and the laser beam emitted from the tip of the optical transmission path is transmitted by the condensing optical system. While collimating or condensing the light and irradiating it onto the inner peripheral surface of the hole of the object to be hardened by the reflective optical system, the object to be hardened or the reflective optical system is rotated with respect to the optical axis and moved in the optical axis direction. A laser hardening method characterized by performing spiral-shaped laser hardening on the inner peripheral surface of the hole of the object to be hardened.
部からレーザ光を射出する光伝送路と、前記穴内に配設
され射出されたレーザ光を平行光化あるいは集光化する
集光光学系と、平行光化あるいは集光化されたレーザ光
を前記被焼入れ対象物の穴内周面にスパイラル状に照射
する反射光学系とを具えたことを特徴とするレーザ焼入
れ装置。(2) An optical transmission line disposed in a hole formed in the object to be hardened to emit laser light from the tip, and a condenser disposed in the hole to collimate or condense the emitted laser light. A laser hardening apparatus comprising: a light optical system; and a reflective optical system that irradiates parallel or focused laser light onto the inner peripheral surface of the hole of the object to be hardened in a spiral manner.
て、光伝送路と集光光学系と反射光学系とをレーザ光を
透過可能なハウジングにて一体に保持し、該ハウジング
を被焼入れ対象物の穴内に挿脱自在に支持したことを特
徴とするレーザ焼入れ装置。(3) In the laser hardening apparatus according to claim (2), the optical transmission path, the condensing optical system, and the reflective optical system are integrally held in a housing that can transmit laser light, and the housing is the object to be hardened. A laser hardening device characterized by being supported so that it can be inserted into and removed from a hole in an object.
光光学系と円錐反射面を有する反射光学系を配設し、前
記光伝送路の先端部から射出されたレーザ光を前記集光
光学系によって平行光化あるいは集光化して前記反射光
学系によって前記被焼入れ対象物の穴内周面に放射状に
照射する一方、前記被焼入れ対象物あるいは前記反射光
学系を光軸方向に移動させることで前記被焼入れ対象物
の穴内周面にレーザ焼入れを行うことを特徴とするレー
ザ焼入れ方法。(4) An optical transmission path, a condensing optical system, and a reflection optical system having a conical reflection surface are arranged in the hole formed in the object to be hardened, and the laser beam emitted from the tip of the optical transmission path is directed to the The light is collimated or condensed by a condensing optical system and radially irradiated onto the inner peripheral surface of the hole of the object to be hardened by the reflective optical system, while moving the object to be hardened or the reflective optical system in the optical axis direction. A laser hardening method characterized by performing laser hardening on the inner peripheral surface of the hole of the object to be hardened.
部からレーザ光を射出する光伝送路と、前記穴内に配設
され射出されたレーザ光を平行光化あるいは集光化する
集光光学系と、前記穴内に配設され平行光化あるいは集
光化されたレーザ光を前記被焼入れ対象物の穴内周面に
放射状に照射する円錐反射面を有し前記被焼入れ対象物
に対して光軸方向に相対移動自在な反射光学系とを具え
たことを特徴とするレーザ焼入れ装置。(5) An optical transmission line disposed in a hole formed in the object to be hardened to emit laser light from the tip, and a condenser disposed in the hole to collimate or condense the emitted laser light. a light optical system, and a conical reflecting surface disposed in the hole to radially irradiate the inner circumferential surface of the hole of the object to be hardened with a collimated or condensed laser beam; A laser hardening device characterized by comprising a reflective optical system that is relatively movable in the optical axis direction.
て、光伝送路と集光光学系と反射光学系とをレーザ光を
透過可能なハウジングにて一体に保持し、該ハウジング
を被焼入れ対象物の穴内に挿脱自在に支持したことを特
徴とするレーザ焼入れ装置。(6) In the laser hardening apparatus according to claim (5), the optical transmission path, the condensing optical system, and the reflective optical system are integrally held in a housing that can transmit laser light, and the housing is the object to be hardened. A laser hardening device characterized by being supported so that it can be inserted into and removed from a hole in an object.
て、光伝送路と集光光学系とをレーザ光を透過可能なハ
ウジングにて一体に保持し、該ハウジングを被焼入れ対
象物の一方の穴端部に挿脱自在に支持すると共に、反射
光学系を他方の穴端部に挿脱自在に支持したことを特徴
とするレーザ焼入れ装置。(7) In the laser hardening apparatus according to claim (5), the optical transmission path and the condensing optical system are held together by a housing that can transmit laser light, and the housing is attached to one of the objects to be hardened. A laser hardening device characterized in that a laser hardening device is supported at an end of a hole so as to be freely inserted and removed, and a reflective optical system is supported at an end of the other hole so that it can be inserted and removed.
錐射出面を有する集光光学系と円錐反射面を有する反射
光学系を配設し、前記光伝送路の先端部から射出された
レーザ光を前記集光光学系によって平行光化あるいは集
光化して前記反射光学系によって前記被焼入れ対象物の
穴内周面に放射状に照射する一方、前記被焼入れ対象物
あるいは反射光学系を光軸方向に移動させることで前記
被焼入れ対象物の穴内周面にレーザ焼入れを行うことを
特徴とするレーザ焼入れ方法。(8) A light transmission path, a condensing optical system having a conical exit surface, and a reflection optical system having a conical reflection surface are disposed in the hole formed in the object to be hardened, and the light beam is emitted from the tip of the light transmission path. The laser beam is collimated or focused by the condensing optical system, and is radially irradiated onto the inner peripheral surface of the hole of the object to be hardened by the reflecting optical system, while the object to be hardened or the reflecting optical system is collimated or focused by the reflecting optical system. A laser hardening method characterized by performing laser hardening on the inner peripheral surface of the hole of the object to be hardened by moving the object in the axial direction.
光光学系と円錐反射面を有する反射光学系を配設し、前
記光伝送路の先端部から射出されたレーザ光を前記集光
光学系によって平行光化あるいは集光化して前記反射光
学系によって前記被焼入れ対象物の穴内周面に放射状に
照射する一方、前記被焼入れ対象物あるいは反射光学系
を光軸方向に移動させると共に該被焼入れ対象物を前記
穴の中心に対して回転させることで該被焼入れ対象物の
穴内周面にレーザ焼入れを行うことを特徴とするレーザ
焼入れ方法。(9) An optical transmission path, a condensing optical system, and a reflection optical system having a conical reflection surface are arranged in the hole formed in the object to be hardened, and the laser beam emitted from the tip of the optical transmission path is directed to the The light is collimated or condensed by the condensing optical system and radially irradiated onto the inner peripheral surface of the hole of the object to be hardened by the reflective optical system, while the object to be hardened or the reflective optical system is moved in the optical axis direction. A laser hardening method characterized in that the inner peripheral surface of the hole of the object to be hardened is laser hardened by rotating the object to be hardened with respect to the center of the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2263738A JPH04141514A (en) | 1990-10-03 | 1990-10-03 | Method and device for laser beam quenching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2263738A JPH04141514A (en) | 1990-10-03 | 1990-10-03 | Method and device for laser beam quenching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04141514A true JPH04141514A (en) | 1992-05-15 |
Family
ID=17393605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2263738A Pending JPH04141514A (en) | 1990-10-03 | 1990-10-03 | Method and device for laser beam quenching |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04141514A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007031282A1 (en) * | 2005-09-14 | 2007-03-22 | Heckler & Koch Gmbh | Reflector arrangement provided with a laser beam reflecting head and a guiding device, device and method for hardening internal surfaces of a workpiece |
| JP2011520748A (en) * | 2008-04-30 | 2011-07-21 | コーニング インコーポレイテッド | Laser cutting with a curved trajectory |
| DE102016121707A1 (en) * | 2016-11-14 | 2018-05-17 | ECO Holding 1 GmbH | Method for machining an inner surface of a valve bush, valve bush and device for machining an inner surface of a valve bush |
-
1990
- 1990-10-03 JP JP2263738A patent/JPH04141514A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007031282A1 (en) * | 2005-09-14 | 2007-03-22 | Heckler & Koch Gmbh | Reflector arrangement provided with a laser beam reflecting head and a guiding device, device and method for hardening internal surfaces of a workpiece |
| JP2011520748A (en) * | 2008-04-30 | 2011-07-21 | コーニング インコーポレイテッド | Laser cutting with a curved trajectory |
| DE102016121707A1 (en) * | 2016-11-14 | 2018-05-17 | ECO Holding 1 GmbH | Method for machining an inner surface of a valve bush, valve bush and device for machining an inner surface of a valve bush |
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