JPH0413613Y2 - - Google Patents
Info
- Publication number
- JPH0413613Y2 JPH0413613Y2 JP6337284U JP6337284U JPH0413613Y2 JP H0413613 Y2 JPH0413613 Y2 JP H0413613Y2 JP 6337284 U JP6337284 U JP 6337284U JP 6337284 U JP6337284 U JP 6337284U JP H0413613 Y2 JPH0413613 Y2 JP H0413613Y2
- Authority
- JP
- Japan
- Prior art keywords
- component
- lead
- lead wire
- electronic component
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 claims description 28
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 23
- 238000007747 plating Methods 0.000 description 16
- 230000002950 deficient Effects 0.000 description 11
- 239000011521 glass Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6337284U JPS60174808U (ja) | 1984-04-27 | 1984-04-27 | 電子部品のリ−ド線線径判別装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6337284U JPS60174808U (ja) | 1984-04-27 | 1984-04-27 | 電子部品のリ−ド線線径判別装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60174808U JPS60174808U (ja) | 1985-11-19 |
| JPH0413613Y2 true JPH0413613Y2 (enrdf_load_stackoverflow) | 1992-03-30 |
Family
ID=30593452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6337284U Granted JPS60174808U (ja) | 1984-04-27 | 1984-04-27 | 電子部品のリ−ド線線径判別装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60174808U (enrdf_load_stackoverflow) |
-
1984
- 1984-04-27 JP JP6337284U patent/JPS60174808U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60174808U (ja) | 1985-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5773764A (en) | Printed circuit board panel | |
| KR19980018712A (ko) | 도전성볼의 탑재장치 및 탑재방법 (conductive ball mounting apparatus) | |
| KR100538912B1 (ko) | 피크-앤-플레이스 로봇으로 기판 상에 배치된 소자의 위치를 검출하는 방법 | |
| US5682675A (en) | Apparatus and method of mounting electronic components | |
| US8677614B2 (en) | Device mounting method determining touching between device and board | |
| CN104936429A (zh) | 销插入装置和销插入不良判定方法 | |
| JPH0413613Y2 (enrdf_load_stackoverflow) | ||
| US4255851A (en) | Method and apparatus for indelibly marking articles during a manufacturing process | |
| CN220738851U (zh) | 半导体器件表面瑕疵异物检测处理设备 | |
| CN113747667A (zh) | 一种金手指卡板插槽的加工方法 | |
| US6622378B1 (en) | Handling module for at least one component for mounting on and removal from a component carrier | |
| CN208745003U (zh) | 一种pcb钻孔设备 | |
| CN207305282U (zh) | 电表pcba板元件引脚控制装置 | |
| KR20130117191A (ko) | 작업유닛 이송장치 | |
| US20010011828A1 (en) | Spherical particle transport apparatus | |
| JP3132351B2 (ja) | 導電性ボールの搭載装置および搭載方法 | |
| CN207282363U (zh) | 四极纵磁结构装配的灭弧室封接模 | |
| JPH07307342A (ja) | 半田ボールのボンディング装置 | |
| JP3254644B2 (ja) | 半田ボール供給装置 | |
| JP3855216B2 (ja) | 半田ボール吸着検査装置 | |
| JPH01321684A (ja) | 回路基板の製造方法 | |
| CN210995366U (zh) | 陶瓷基板自动检孔通孔设备 | |
| JPH07241731A (ja) | 基板材料の小径穴加工方法及び装置 | |
| JPH0222146Y2 (enrdf_load_stackoverflow) | ||
| JPH116863A (ja) | 基板電気検査方法及び基板電気検査装置 |